JPH0372157B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for etching sheet-like materials such as metal plates.

[Conventional technology]

Conventionally, when etching a sheet-like material such as a metal plate, when etching can be performed by etching only one side, for example, even when there is no need to penetrate the base sheet, etching is performed from both sides of the base sheet.
The same process used for penetration was used, except that the etching agent was sprayed on only one side.

For example, as shown in FIG. 2a, first, a base sheet 1 that has been pretreated such as surface smoothing is prepared, and then a resist film 3a is formed on the entire surface of the base sheet (see FIG. 2b).
Then, exposure and development are performed through a predetermined mask pattern to expose only the metal surface to be etched (FIG. 2c). Then spray etching liquid 5,
This exposed metal surface is half-etched to form the desired etching hole 4 (FIG. 2d). Finally, the remaining resist film is dissolved and removed.
The etching process is completed (Figure 2e).

However, this conventional method has the same problems as double-sided etching in terms of work efficiency and the cost of materials such as etching agent and peeling film, even when etching only needs to be done on one side.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an etching method that is inexpensive to manufacture and can improve productivity.

[Means for solving problems]

That is, in the present invention, a pair of base sheets to be etched are stacked one on top of the other so that the surfaces to be etched are exposed, and the laminated base sheets are adhered to each other in a manner that maintains liquid tightness so as to be releasable. The present invention provides an etching method characterized in that after etching both surfaces to be etched using the etching-resistant pattern formed on the surface to be etched as a mask, the laminated base sheets to be etched are separated. .

Furthermore, the present invention provides an etching method in which the etching process is half etching.

In this specification, half-etching means etching to an intermediate stage without completely penetrating the base sheet to be etched in the thickness direction.

Further, the substrate sheet to be etched is not limited to metal, but includes all materials suitable for etching (including wet etching and dry etching) such as glass, ceramic, and plastic. The etching agent may be appropriately selected depending on the material of the base sheet. The anti-etching agent used as a mask during etching is also appropriately selected in relation to the etching agent used. The base sheets are bonded to each other using an adhesive that can withstand the etching temperature and etching solution and is easily removable (for example, double-sided adhesive tape) to prevent the etching solution from penetrating between the laminated base sheets.

〔Example〕

The present invention will be described below with reference to an embodiment illustrated in FIGS. 1 and 3.

First, as shown in FIG. 1a, substrate sheets 1 to be etched (for example, metal plates) are stacked one on top of the other so that the surfaces to be etched are exposed, and an adhesive (for example, pressure-sensitive adhesive) 2 is preferably applied between them. As shown in Figure 1b, they are adhered to each other so that they can be peeled off, with only the edges interposed.

An anti-etching agent 3a is applied to both surfaces of the laminate 6 of base sheets adhered to each other in this way (FIG. 1c), and then by partial exposure and development,
An etching-resistant pattern 3b is formed (FIG. 1d). Next, the laminate 6 with the etching-resistant patterns 3b formed on both sides is prepared as shown in FIG.
It is continuously introduced into the etching tank 8. Here, the laminated body 6 is arranged in the vertical direction of the introduction path 7 in this tank 8, and is sprayed with the etching liquid 5 by a shower device 10 having a large number of nozzles.
As shown in FIG. 1e, each base sheet is half-etched, for example, from the opening of the etching pattern 3b to form etching holes 4. The base sheet stack 6 that has passed through the etching tank 8 is then introduced into a cleaning tank 9, where a cleaning liquid is sprayed by a shower device 11 to remove the etching liquid. Next, the base sheet laminate 6 is separated into individual base sheet units 1 by a suitable peeling device 13 as shown in FIG.
4 (FIG. 1f), and the etching process is completed. The etching pattern is removed with a suitable solvent after or before being separated into base sheet units.

In this example, the two base sheets were bonded together before forming the etching mask, but there is also a method in which the etching mask is formed and then bonded and then developed. It is also possible to do this.

〔Effect of the invention〕

As explained above, according to the method of the present invention, a pair of substrate sheets to be etched are bonded with one side facing each other so that one side is not etched, and only the other side is exposed and subjected to the etching process. Since etching of two substrates to be etched is completed simultaneously in one etching process, manufacturing efficiency is greatly improved compared to the conventional method of etching one substrate at a time. This makes it possible to significantly reduce manufacturing costs, such as by reducing the proportion of etching resistant agent and cleaning liquid used in the amount of etching product.

In the above embodiment, a case has been described in which the material to be etched is etched in a continuous manner, but the etching process is not limited to this, and a batchwise etching process is also possible.

Further, the method of the present invention is particularly suitable for producing a product by half etching alone, but it can of course also be applied to forming through holes in a metal plate or the like by etching.

[Brief explanation of drawings]

1A to 1F are cross-sectional views for explaining the method of the present invention in the order of steps, FIG. 2 is a cross-sectional view for explaining the conventional etching method in the order of steps, and FIG. 3 is a cross-sectional view for explaining the method of the present invention in the order of steps. FIG. 3 is a schematic diagram of an etching device for etching. DESCRIPTION OF SYMBOLS 1... Base sheet, 2... Adhesive, 3a... Etching resistant agent, 3b... Etching resistant pattern, 4... Etching hole, 5... Etching liquid, 6... Base sheet laminate, 8... Etching tank, 9... Cleaning tank , 14...Base sheet unit.

Claims (1)

[Scope of Claims] 1. A pair of base sheets to be etched are stacked one on top of the other so that the surfaces to be etched are exposed, and the laminated base sheets are adhered to each other so as to be releasably kept liquid-tight. Then, after etching both surfaces to be etched using the etching-resistant pattern formed on the surface to be etched as a mask, the laminated substrate sheets to be etched are separated. 2. The method according to claim 1, wherein the etching process is half etching.