JPH0372377U - - Google Patents
Info
- Publication number
- JPH0372377U JPH0372377U JP13324589U JP13324589U JPH0372377U JP H0372377 U JPH0372377 U JP H0372377U JP 13324589 U JP13324589 U JP 13324589U JP 13324589 U JP13324589 U JP 13324589U JP H0372377 U JPH0372377 U JP H0372377U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- pole
- contactor
- pedestal
- ejector plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図は本考案の一実施例を示す半導体装置検
査用コンタクタの側面図、第２図は従来の一例を
示す半導体装置検査用コンタクタの平面図及び側
面図である。
１……ＩＣ、１ａ……リード、２，２ａ……台
座、３……位置決めこま、３ａ，５……コンタク
ト、４，４ａ……位置決めピン、６……ポール、
７……コイルスプリング、８……ヘツダ、９……
プツシユピン、１０……コイルスプリング、１１
……エジエクタ板。
FIG. 1 is a side view of a contactor for testing semiconductor devices showing an embodiment of the present invention, and FIG. 2 is a plan view and a side view of a contactor for testing semiconductor devices showing a conventional example. 1...IC, 1a...Lead, 2, 2a...Pedestal, 3...Positioning piece, 3a, 5...Contact, 4, 4a...Positioning pin, 6...Pole,
7... Coil spring, 8... Header, 9...
Push pin, 10...Coil spring, 11
...Ejiekta board.
Claims (1)
ト及び前記半導体装置を位置決めする位置決めピ
ンが取り付けられた台座と、この台座に埋め込ま
れたポールと、このポールの外周囲に挿入された
コイルスプリグと、このコイルスプリグを下敷き
にし、前記ポールに上下摺動するとともに前記半
導体装置を搭載するエジエクタ板と、このエジエ
クタ板の上に前記半導体装置を間において配置さ
れるとともに前記半導体装置の外郭体を押えるヘ
ツダと、このヘツダの下面に突出したり、引込ん
だりするようにスプリングを介して取り付けられ
る前記リードを前記コンタクトに押し付けるプツ
シユピンとを備えることを特徴とする半導体装置
検査用コンタクタ。 A pedestal to which a plurality of contacts contacting leads of a semiconductor device and positioning pins for positioning the semiconductor device are attached, a pole embedded in the pedestal, a coil sprig inserted around the outer periphery of the pole, and the coil sprig. an ejector plate that is placed under the semiconductor device and slides up and down on the pole and mounts the semiconductor device; a header that is placed on the ejector plate with the semiconductor device therebetween and presses down the outer body of the semiconductor device; A contactor for testing a semiconductor device, comprising: a push pin that is attached via a spring so as to protrude or retract from the lower surface of the contactor, and presses the lead against the contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13324589U JPH0372377U (en) | 1989-11-15 | 1989-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13324589U JPH0372377U (en) | 1989-11-15 | 1989-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0372377U true JPH0372377U (en) | 1991-07-22 |
Family
ID=31680655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13324589U Pending JPH0372377U (en) | 1989-11-15 | 1989-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0372377U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012202843A (en) * | 2011-03-25 | 2012-10-22 | Renesas Electronics Corp | Semiconductor device manufacturing method |
-
1989
- 1989-11-15 JP JP13324589U patent/JPH0372377U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012202843A (en) * | 2011-03-25 | 2012-10-22 | Renesas Electronics Corp | Semiconductor device manufacturing method |
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