JPH0174573U - - Google Patents
Info
- Publication number
- JPH0174573U JPH0174573U JP1987170261U JP17026187U JPH0174573U JP H0174573 U JPH0174573 U JP H0174573U JP 1987170261 U JP1987170261 U JP 1987170261U JP 17026187 U JP17026187 U JP 17026187U JP H0174573 U JPH0174573 U JP H0174573U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- pin
- contact pin
- base plate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図はその要部斜面図、第３図は従来の装置の断
面図、第４図はその接触子部分の斜面図である。
図中、１は半導体装置、１ａはリードピン、２
はスタンド、３はアウターコンタクトピン、４は
インナーコンタクトピン、５はプツシヤ、６はベ
ースプレートである。なお、各図中、同一符号は
同一又は相当部分を示す。
FIG. 1 is a sectional view showing an embodiment of this invention, FIG. 2 is a perspective view of the main part thereof, FIG. 3 is a sectional view of a conventional device, and FIG. 4 is a perspective view of the contact portion thereof. In the figure, 1 is a semiconductor device, 1a is a lead pin, 2
is a stand, 3 is an outer contact pin, 4 is an inner contact pin, 5 is a pusher, and 6 is a base plate. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
装置の接触装置に於いて、ベースプレートに設け
られ、半導体装置を下方から支持するスタンド、
上記ベースプレートに揺動可能に設けられ、上記
半導体装置のリードピンの先端と接触し得る第１
のコンタクトピン、上記ベースプレートに揺動可
能に上記第１のコンタクトピンの外側に配置され
、上記リードピンの内端と接触し得る第２のコン
タクトピン、この第２のコンタクトピン又は上記
第１のコンタクトピンに設けられ、これら双方を
当接させる突起、上記第２のコンタクトピンを外
側から押圧し、上記突起を介して上記第２のコン
タクトピンと共に上記第１のコンタクトピンを上
記リードピンに接触させる絶縁材からなるプツシ
ヤを備えた半導体計測装置の接触装置。 In a contact device for a semiconductor measuring device that measures the electrical characteristics of a semiconductor device, a stand is provided on a base plate and supports the semiconductor device from below;
A first member that is swingably provided on the base plate and that can come into contact with the tips of the lead pins of the semiconductor device.
a contact pin, a second contact pin that is swingably disposed on the base plate outside the first contact pin and can come into contact with an inner end of the lead pin, the second contact pin or the first contact; a protrusion provided on the pin that brings them into contact; an insulator that presses the second contact pin from the outside and brings the first contact pin and the second contact pin into contact with the lead pin via the protrusion; A contact device for semiconductor measuring equipment equipped with a pusher made of wood.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170261U JPH0174573U (en) | 1987-11-07 | 1987-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170261U JPH0174573U (en) | 1987-11-07 | 1987-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0174573U true JPH0174573U (en) | 1989-05-19 |
Family
ID=31461050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987170261U Pending JPH0174573U (en) | 1987-11-07 | 1987-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0174573U (en) |
-
1987
- 1987-11-07 JP JP1987170261U patent/JPH0174573U/ja active Pending