JPH037401Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a horizontal tray-type plating cell for electroplating, which has a nozzle that spouts a plating liquid parallel to the conveying direction of the steel plate to be plated.

The configuration of a conventional Metxel C is shown in FIG. The tray body 7 contains plating liquid E in which metal ions are dissolved.
is ejected from the nozzle 2' of the nozzle header 2 and forms a flow relative to the advancing direction arrow A of the steel plate 5 to be plated. 1 is a dam roll on the plating liquid inlet side, and 4 is a dam roll on the output side. A dam of plating liquid is formed between them. In this case, the plating liquid E is discharged from a discharge port (not shown) on the side of the tray near the output dam roll 4. It overflows and is returned to the plating liquid supply device (not shown). The dam rolls 1 and 4 are each pressed against the steel plate 5 to be plated by a rolling device (not shown) and rotated following the progress of the steel plate 5 to be plated. 3 indicates a positive electrode.

During plating, the flow of the plating liquid greatly affects quality and productivity, and the critical current density that indicates plating performance is 7/8 of the relative speed between the plate and the plating liquid in the threading direction.
Proportional to the power. The greater the limiting current density, the higher the productivity of plating. Therefore, the faster the flow rate of the plating solution, the higher the productivity.

By the way, in the conventional tray type plating cell C described above with reference to FIG. 1, the flow of the plating liquid is dammed by the outlet dam roll 4. Although the plating liquid is configured to overflow from the outlet on the side of the tray near the output dam roll 4, since it is dammed up by the dam roll, the flow rate of the plating liquid decreases, and as a result, the limiting current density of the plating cell decreases, and the plating properties worsen. Furthermore, the gas generated during plating cannot be easily discharged, which has an adverse effect on the uniformity of plating.

Therefore, the purpose of the present invention is to increase the relative speed between the plating liquid and the steel plate to be plated in the plating cell,
The objective is to provide a horizontal tray-type plating cell that can stably perform uniform plating by increasing the critical current density that indicates the ability of the plating cell and also by making it easier to discharge the gas generated during plating. .

The present invention is a horizontal tray-type plating cell for electroplating that has a nozzle that spouts plating liquid parallel to the conveyance direction of the steel plate to be plated. The steel plate to be plated is sandwiched between a plating liquid flow rate adjusting roll consisting of a circumferential surface that contacts and seals the steel plate to be plated, and a curved or flat surface whose distance from the center of rotation is shorter than the radius of the circumferential surface at any position. Therefore, there is provided a horizontal tray type Metxel which is provided with at least a pair of upper and lower rolls, and is also provided with means for adjusting the rotation of the flow rate regulating rolls.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the horizontal tray type Metxel of the present invention will be described in detail with reference to preferred embodiments shown in the accompanying drawings.

The horizontal tray type plating cell of the present invention is constructed so that the rear end of the plating liquid jet flow is not dammed up by the dam roll 4, unlike the conventional plating cell. In the present invention, instead of the conventional dam roll 4, an outlet flow rate adjusting roll 6 as illustrated in FIG. 2 is provided.
The horizontal tray type Metsuki cell of the present invention shown in Fig. 2 is shown in Fig. 3.
The figure is shown as a partially cut away perspective view.

Flow rate adjustment roll 6 used in the Metsuki cell of the present invention
Various configuration examples are shown in FIG. The roll used in this invention has a circumferential surface that is concentric with the center of rotation of the roll and contacts the steel plate to be plated in a sealed state, and a curved or flat surface that is shorter than the circumferential surface at any position from the center of rotation of the roll. Consists of. 4th a
The example shown in the figure is a circumferential surface A with a radius R ₀ that includes the central angle α, a circumferential surface B ₁ with a radius R ₁ smaller than R ₀ , and an ellipsoidal surface C that smoothly connects the circumferential surfaces A and B ₁ . ₁ , and the central angle α is arbitrary, but it is preferably approximately 180° in order to provide both sealing performance with the steel plate and dam action of the roll. In this case, the maximum opening degree between the steel plate to be plated and the main roll is R ₀ −R ₁ .

The example shown in Figure 4b is the radius R ₀ including the central angle α.
A circumferential surface of A and a circumferential surface of radius R ₂ larger than R _0
B2 , and the central angle α is arbitrary as above. In this case, the maximum opening degree between the steel plate to be plated and the main roll is R ₀ -a.

The example shown in FIG. 4c is a radius R ₀ including the central angle α
It is composed of a circumferential surface A, _{a circumferential surface B3 with} a radius R3 smaller than _R0 , and a plane _D1 that smoothly contacts these circumferential surfaces A and _B3 . In this case, the maximum opening degree between the steel plate to be plated and the main roll is R ₀ −R ₃ .

The example shown in Figure 4d is the radius R ₀ including the central angle α.
The circumferential surface A of and the plane that is in smooth contact with this
D ₂ , and in this case, the maximum opening degree between the steel plate to be plated and the main roll is R ₀ −b.

As shown in the above example, the surface of the roll is formed by appropriately combining a circumferential surface for sealing and a curved surface or a flat surface whose distance from the roll center O is shorter than the radius R ₀ of this circumferential surface to form a surface that is connected to the steel plate to be plated. A gap 9 (see FIG. 2) having an appropriate degree of opening can be provided between them.

As shown in FIG. 3, at least one pair of rolls 6 as illustrated in FIG.
It is preferable to freely change and adjust the opening between them, that is, the gap 9. FIG. 5 shows an example in which the roll 6 is provided with a handle 8 so that it can be rotated. However, the rotation means for the roll 6 is not limited to this example, and may be other manual rotation means, or may be remotely controlled by a fluid pressure cylinder, an actuator, or the like instead of manual rotation.

Next, the action of Metxel of the present invention will be explained.

In the conventional plating cell shown in Fig. 1, the rear end of the jet of plating liquid is dammed by a dam roll 4, and although there is an overflow port, the flow rate of the plating liquid cannot be increased, and the gas generated during plating is also removed. As mentioned above, there was a problem with the plating properties due to insufficient oxidation.

In the present invention, instead of the dam roll 4, a roll 6 is used, which has a circumferential surface for sealing with the steel plate to be plated, and a curved or flat surface that is shorter in distance from the center of the roll than this circumferential surface. Since the liquid E flows out from a gap 9 with a variable opening degree formed between the steel plate 5 to be plated and the roll 6 as shown by 10, the plating liquid flows out without being retained at the rear of the tray. In the plating cell of the present invention, by rotating the roll 6, the level of the plating liquid in the tray can be arbitrarily controlled. The discharged plating liquid is collected in a liquid collection tray (not shown) and is returned to the plating liquid supply device.

In this way, it has become possible to increase the average relative speed between the steel plate to be plated and the plating solution. Figure 6 shows the average flow velocity distribution of the plating liquid.
It can be seen that in the Metxel of the present invention, the flow of the Metxel liquid downstream is improved, and the flow rate is improved by about 50% or more compared to the conventional Metxel. Therefore, the critical current density, which indicates the ability of the plating cell, has also increased, and the gas generated during plating can be easily and effectively discharged, preventing uneven plating and greatly contributing to the uniformity of plating. It has also been possible to improve the productivity of the plating cell, and it has become possible to reduce the power consumed by plating by improving the current conductivity in the plating liquid flow.

Further, according to the present invention, in addition to double-sided plating, single-sided plating can be easily performed, and the plating flow surface can be controlled by rotating the flow rate regulating roll, thereby preventing plating from adhering to the back side during single-sided plating. That is, when producing a single-sided plated steel plate, the flow of the upper plating liquid is suppressed as much as possible by bringing the upper flow rate adjustment roll into contact with the steel plate to be plated and applying a flow rate of the plating liquid only to the lower side. Harmful plating on the edges of the non-plated surface (top surface) can be significantly reduced.

[Brief explanation of drawings]

Fig. 1 is a diagrammatic sectional view of a conventional horizontal tray type Metsuki cell, Figure 2 is a diagrammatic sectional view of the horizontal tray type Metsuki cell of the present invention, and Figure 3 is a partially broken view of the horizontal tray type Metsuki cell of the present invention. Removed perspective view, 4th
The figures are cross-sectional views of various configuration examples of the flow rate regulating roll used in the Metsuki Cell of the present invention, Figure 5 is a perspective view of an example of a rotating means for the flow rate regulating roll used in the Metsuki Cell of the present invention, and Figure 6 is a longitudinal view of the tray. It is a graph showing directional average flow velocity distribution. Explanation of symbols, 1...Dam roll, 2...Nozzle header, 3...Positive electrode, 4...Steel plate to be plated,
6...Flow rate adjustment roll, 7...Tray body, 8...
...Handle, 9...Gap, 10...Outflowing liquid flow.

Claims (1)

[Scope of utility model registration request] In a horizontal tray-type plating cell for electroplating that has a nozzle that sprays plating liquid parallel to the conveyance direction of the steel plate to be plated, a steel plate to be plated whose outer peripheral surface is concentric with the center of rotation is placed at the rear end of the jet of plating liquid. At least one pair of upper and lower plating liquid flow rate adjusting rolls sandwiching the steel plate to be plated are composed of a circumferential surface that contacts and seals, and a curved or flat surface whose distance from the center of rotation is shorter than the radius of the circumferential surface at any position. A horizontal tray-type Metsuki cell comprising a means for adjusting the rotation of the flow rate adjusting roll.