JPH0374853A - Carrier for tab device and measuring module using same and insert device therefor - Google Patents

Abstract

PURPOSE:To reduce positioning error and obtain a device suitable for a high density element by elastically clamping in a state where positioning is effected utilizing a target mark formed on a tape automated bonding tape. CONSTITUTION:A target mark 22 on a tape automation bonding (TAB) tape 10 and the position of a guide hole 36 on a carrier 30 are pattern recognized by a detecting camera 56 and the error thereof is detected by an error detecting part 58. A stage 52 is moved in the X, Y, theta directions by a stage driving part 60 based upon this information to effect positioning. Then, the stage 52 is raised to bring the upper surface 32 of the carrier 30 into contact with the tape 10 to raise a clamp releasing pin 62 and the peripheral part 4 of the tape 10 is clamped by a TAB holder 40 utilizing the biasing force of a spring 44. Thus, high precision positioning and holding of the tape 10 and the carrier 30 can be achieved so that a device so that a device suitable for a high density element with a narrow test pad pitch can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a carrier for a TAB (tape automated bonding) device, a measurement module using the same, and an insert device thereof.

(Prior Art) In recent years, a TAB method has been established in which an unpackaged device is directly bonded onto a TAB tape in order to ensure higher-density packaging of the device.

According to this TAB method, sprocket holes are formed along the feeding direction of the TAB tape, and the TAB tape can be fed in one direction by driving the sprocket. Further, the electrode pattern of the TAB tape and bumps provided on a device such as a semiconductor chip can be directly bonded and fixed by thermal welding.

By the way, according to this type of TAB method, since the TAB tape is formed of a long tape of about 20 m, for example, burn-in inspection after bonding and fixing the device is difficult due to its structure. . In order to make this burn-in test possible, a method has been considered in which a TAB tape on which devices are bonded is cut into individual devices and then mounted on a TAB device carrier. This TAB device carrier has a pin that fits into a sprocket hole of the TAB tape, and the TAB tape is positioned and held by the fit between the pin and the hole.

(Problem to be Solved by the Invention) TAB tape is extremely thin, with a thickness of about 50 μm to 100 μm, and when positioning the sprocket hole on this TAB tape as a reference position, this reference hole There was a problem in that the guide pin caused deformation and positional errors. In particular, when the density of chips bonded to this TAB tape increases, the test pad pitch and area of the test pads become smaller. The contact becomes uncertain, and the conventional test pad pitch is 700 mm.
μm, and the length of one side of the test pad was limited to 500 μm.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a carrier for TAB devices that has a highly accurate positioning function that can reliably contact contact pins on the socket side of a burn-in device, even if the TAB devices are highly dense. There is a particular thing. Another object of the present invention is to provide a socket that can reliably contact the test pads on the TAB tape supported on the carrier, in order to enable burn-in testing of high-density TAB devices. The objective is to provide a measurement module with Furthermore, another object of the present invention is to provide an insert device that can position and hold a TAB tape with high precision with respect to the TAB device carrier.

[Structure of the Invention] (Means for Solving the Problems) The TAB device carrier of the present invention fixes the device by bonding, and uses the TAB tape, which has a target mark for alignment formed on the surface, by using the target mark. A holding portion is provided for elastically holding the tape at least at a position avoiding the test pad when the test pad is positioned.

The measurement module of the present invention includes a TAB device carrier and a socket that contacts the test pad of the TAB tape supported by the TAB device carrier, and the TAB carrier is provided with a guide hole and a locking portion, and the TAB device includes a guide pin that fits into the guide hole, and
A locked portion that elastically engages with the locking portion is provided.

The insert device of the present invention includes a detection means for detecting the positioning target mark formed on the TAB tape, and a relative position on the two-dimensional surface of the TAB tape or TAB device carrier based on the detection result of the detection means. The present invention has means for controlling the alignment of the position, and driving means for driving the clamping part of the TAB device carrier to open and driving the clamping part to close after the alignment operation.

(Function) According to the structure of claim (1), by using the target mark formed on the TAB tape, it is possible to position the test pad on the TAB tape and the TAB device carrier with high precision. Become. Moreover, the method of holding the TAB tape with this carrier does not utilize the sprocket holes formed on the TAB tape as in the conventional method, but instead uses a method of elastically holding the TAB tape at a position that avoids the test pad of the TAB tape. Because I am doing this,
Highly accurate positioning and holding is possible, and the clamping and clamping release can be realized easily.

In addition, it is preferable that a guide hole as shown in claim (2) is formed on the carrier side, and this guide hole is used as a positioning reference position on the carrier side.

According to the structure of claim (2), as the connection structure of the measurement module composed of the carrier and the socket, highly accurate positioning guidance is realized by fitting the guide hole on the carrier side and the guide bin on the socket side. Even if the TAB tape has a high density, it is possible to reliably contact the contact pin on the socket side with the test pad. Moreover, due to the elastic engagement between the locking part on the carrier side and the locked part on the socket side, a highly accurate contact state can be reliably maintained and the engagement can be easily released. becomes possible.

According to the structure of claim (3), the TAB
The holding part of the device carrier is driven open, and the TAB tape is mounted on the carrier. And this TA
The positioning target mark formed on the B tape is detected by the detection means, and based on this detection result, the TAB
The relative positional relationship of the tape or TAB device carrier on a two-dimensional plane is controlled by alignment. After this alignment operation, the driving means closes the holding portion of the carrier, thereby making it possible to hold the TAB tape on the carrier while maintaining highly accurate positioning.

(Example) Hereinafter, an example apparatus to which the present invention is applied will be specifically described with reference to the drawings.

First, the structure of the TAB tape will be explained with reference to FIG.

FIG. 2 shows a state in which the long TAB tape 10 is cut into individual devices.

Sprocket holes 12, 12 are formed at predetermined intervals on both sides of this TAB tape 10.

Furthermore, a lead pattern 14 is formed on the TAB tape 10 by, for example, etching. The lead pattern 14 is formed of a conductive pattern that connects the test pad 16, the outer lead 18, and the inner lead 20, respectively, and is formed so that the test pad 16 has the largest pad pitch and the inner lead 20 has the smallest lead pitch. . The semiconductor chip 24 is directly connected onto the TAB tape 10 by bonding the inner leads 20 and the unillustrated electrode pads of the semiconductor chip 24. Furthermore, after the inner lead bonding of the semiconductor chip 24 onto the TAB tape 10 is completed, the chip 24 is resin-sealed on the TAB tape 10 using a resin sealing device (not shown), and then the resin is cured using a heater. The device name is now printed.

Next, the TAB to which the semiconductor chip 24 was bonded
The configuration of a TAB device carrier used to carry the tape 10 into a probe device or a burn-in inspection device will be explained with reference to FIG.

This carrier 30 is composed of a rectangular carrier base 32, and a notch 34 is bored in the center of the carrier base 32.

Furthermore, guide holes 36 and 36 are formed at two diagonal locations on the carrier base 32. This guide hole 36
．． Reference numeral 36 is for setting a reference position for positioning the carrier 30, and also for guiding the positioning of a socket, which will be described later. These two guide holes 36, 36 are located at the two-dimensional orthogonal coordinate X when the TAB tape 10 is correctly positioned with respect to the carrier 3o.

Y axis unit, (Xs, Yl), (X2.Y2)
A highly accurate positional relationship is now established.

In order to hold the TAB tape IO on this carrier 30, each of the four sides of the carrier base 32 is provided with a TAB tape lO.
A B holder 40 is arranged.

This TAB holder 40 is rotatably supported by a bin 42, and is normally urged to rotate by a compression coil spring 44 so that the TAB holder 40 is in close contact with the upper surface of the carrier base 32.

Further, a side wall of the carrier base 32 and TAB
An undercut-shaped locking portion 48 is formed at a position away from the holding position of the holder 40. This locking part 48
is for engaging and holding a socket, which will be described later.

Next, an inserting device for inserting the TAB tape 10 into the carrier 30 will be described with reference to FIG. 3. This insert device 50 has a stage 52 on which the carrier 30 is mounted and whose positioning can be controlled, a chuck stand 54 that chucks the semiconductor chip 24 bonded and fixed to the TAB tape 1O by vacuum suction, for example, and faces the stage 52. A detection camera 56 fixed at an upper position, an error detection section 58 that inputs the detection result of this detection camera 56 and detects a relative positional error between the TAB tape 10 and the carrier 30, and a It is comprised of a stage drive unit 60 that controls the movement of the stage 52 based on the output, and clamping release bins 62 and 62 that release the clamping state of the TAB holder 40. The stage 52 has two stages on which the carrier 30 is mounted.
It is movable in the X- and Y-axis directions, which are orthogonal coordinates of a dimensional plane, the Z-axis direction, which is the vertical direction, and the θ direction around the Z-axis, and is a relief part for preventing interference with the chuck table 54. 52a is formed at the center thereof. The detection camera 56 detects the target mark 22° 22 on the TAB tape 10 and the guide holes 36, 3 on the carrier 30.
Each position of 6 is detected by pattern recognition. The error detection unit 58 determines the coordinate positions (Xl, Yt) of the two target marks 22 on the TAB tape 10 with reference to the two guide holes 36 and 36 on the carrier 30,
(X2, Y2) is memorized, and this position information is compared with the detection result from the detection camera 52,
The position error is calculated. Based on the information from the error detection unit 58, the stage drive unit 60 controls the movement of the stage 52 on which the carrier 30 is mounted in each position in the X, Y, and θ directions.

Next, the functions of the carrier 30 and the insert device 50 will be explained.

First, a method for inserting the TAB tape 10 into the carrier 30 will be explained with reference to FIG. 3.

After holding the carrier 30 on the stage 52 by suction, the stage 52 is driven in two directions so that the chuck surface of the chuck base 54 protrudes from the upper surface of the carrier 30.

Thereafter, the TAB tape 10 on which the semiconductor chip 24 is bonded and fixed is set on the chuck table 54 and held by suction by a robot arm (not shown). After this, the third
As shown in Figure (A), the pinch release bins 62 and 62 are driven downward, and the TAB holder 40 is rotated away from the top surface of the carrier 30 against the biasing force of the spring 44, and the stage 52 is rotated in two directions. By driving, the TAB tape 10 is set to a position where it can be held by the TAB holder 40.

Next, while maintaining the state shown in Figure (A),
), the positional relationship between the TAB tape 10 and the carrier 30 is corrected. In this correction operation, that is, alignment operation, the detection camera 52 detects the positions of the target mark 22, 22 on the TAB tape 10 and the guide hole 36° 36 on the carrier 30 by pattern recognition.
The coordinate relationship (X,,y,) between the two is stored in advance.

(X2.Y2) is detected by the error detection unit 58, and based on this information, the stage drive unit 6°
2 in the X, Y, and θ directions. At this time, since the target mark 22.degree. 22 can be formed, for example, by etching like the lead pattern 14 on the TAB tape, the positional relationship with the lead pattern 14 can be maintained with extremely high precision. Therefore, as long as the target mark 22.22 and the guide hole 36.36 are positioned, the lead pattern 14 on the TAB tape 10 can be positioned with high precision with respect to the reference position of the carrier 30.

After the alignment operation as described above is completed, the stage 52
is raised in two directions to ensure contact between the upper surface of the carrier 32 and the TAB tape IO, and the pinch release pin 62.6 is raised in two directions.
By raising the TAB tape 2 and rotating the TAB holder 40 by the biasing force of the spring 44, four peripheral parts of the TAB tape 10 can be held between the TAB holder 40 and the upper surface of the carrier 30. In this way, T
After accurate alignment between the AB tape 10 and the carrier 30, the TAB is
Since the tape 10 can be held against the carrier 30, T
Highly accurate positioning and holding of the AB tape 10 and carrier 30 can be achieved.

In this way, according to the carrier 30 described above, the TAB tape 10 can be positioned and held with high precision, so that it is possible to position and hold the TAB tape 10 with high precision, so that it is possible to position and hold the TAB tape 10 with high precision. Even if the semiconductor chip 24 is dense, by mounting it on the carrier 30 and holding it, it is possible to ensure accurate contact with the stylus in the probe device, and accurate contact with the energizing socket in the burn-in device. It becomes possible to do so. In addition, when performing probe inspection using this carrier 30, accurate alignment is possible by driving the X-Y stage, so 100 μm≦pitch of test pad 16 53008 m 100 μm≦−side length of test pad 16 It was confirmed that even with a high-density element of 5250 μm, accurate contact with the probe device could be ensured.

Note that in order to ensure the elastic clamping state of the TAB holder 40 provided on the carrier 30, it is not necessary to use a compression coil spring 44 as shown in FIG.
As shown in FIGS. (A) and (B), it is inserted into the pin 42,
It is also possible to employ a torsion coil spring 46 that constantly biases the TAB holder 40 toward the upper surface of the carrier 30.

Next, referring to FIG. 5, a measurement module particularly suitable for burn-in inspection will be described.

This measurement module 70 is comprised of the carrier 30 and a socket 72 that can contact the test pad 16 on the TAB tape held by the carrier 30.

The socket 72 has a guide pin 76 on the socket base 74.
and a ratchet 80. The guide pins 76 fit into the guide holes 36° 36 provided at two diagonal locations on the carrier 30, and
This serves as a guide for positioning the socket 72 and the socket 72.

The ratchet 80 is rotatably supported by a pin 82 with respect to the socket base 74, and is engaged with the undercut-shaped locking portion 48 provided on the carrier 30 by the biasing force of a compression coil spring 84. I am trying to maintain it. Note that this operation of releasing the engaged state can be realized by raising the release bin 78.

The socket base 74 has a number of spring pins 86 that corresponds to the number of test bats 16 on the TAB tape 10.
is held, and one end thereof can be contacted to an interface (1/F) board 90 via a bin support board 88.

The other end side of the spring bin 86 is connected to the socket base 7
The test pad 16 is held by a contact probe 92 supported by the TAB tape 10, and is capable of contacting each test pad 16 on the TAB tape 10.

According to the measurement module 70 configured as described above, by raising the carrier 30, the carrier base 3
2 and the tapered surface 80a of the ratchet 80, the ratchet 80 is opened against the biasing force of the compression coil spring 84 and guided to the locking portion 48 of the carrier 30. After the ratchet 80 reaches the locking portion 48, the engaged state can be maintained by the biasing force of the compression coil spring 84. At this time, the guide pin 76 on the socket 72 side is fitted into the two guide holes 36, 36 of the carrier 30, and the carrier 30 and the socket 72 are accurately positioned by the above fitting operation.

At this time, the carrier 30 holds the test pad 16 of the TAB tape 10 in a correctly positioned state due to the above-described action, so the test pad 16 on the TAB tape 10 is The position of the pad 16 and the position of each spring pin 86 on the socket 72 side can be accurately positioned,
Even if the semiconductor chip 24 has a high density and the pad pitch of the test pads 16 is extremely narrow, accurate contact can be achieved by using the measurement module 70. Therefore, if such a measurement module 70 is applied to a burn-in test device, it becomes possible to perform a dynamic test, a partial burn-in test, and a monitor burn-in test of a TAB device.

Next, a probe apparatus 100 that performs a probe test of a TAB device using the carrier 30 will be described.

As shown in FIG. 6, this probe device 100 is roughly divided into tray setting sections 102. It is composed of a preheater section 104 and a test stage 106.

An input tray 108 and an output tray 110 can be arranged in the tray setting section 102, and movement of each tray 108, 110 is executed based on input to a tray operation panel 112. A large number of carriers 30 holding the TAB tapes 10 are loaded on the input tray 108, and the carriers 30 are taken out one by one from the input tray 108 and carried into the preheater section 104 via the briament position A. That's what I do.

This preheater section 104 is for sequentially transporting the carrier 30 in the direction shown by the broken line in the figure, and preheating the semiconductor chip 24 on the TAB tape 10 during this transport. After the preheating operation has been completed, the carrier 30 is pre-aligned at pre-alignment position A, and then transferred along the direction of the solid line in the figure and set at alignment position B, where a highly accurate alignment operation is performed. Ru. Thereafter, the carrier 30 is set at the test position C on the test stage 106, where a stylus is brought into contact with the test pad 16 on the TAB tape 10, and a signal pattern is applied from a tester (not shown).
By monitoring the output, the semiconductor chip 2
4 electrical characteristic tests are performed. The carrier 30 that has been inspected is transported along the direction of the solid line in the figure, and after passing through the unloading position D, the carrier 30 is transferred to the output tray 110.
It will be installed on. Note that inputting information necessary for the test is performed via the test operation panel 114.

When a probe test is performed using the carrier 30 in such a probe device 100, since highly accurate positioning of the carrier 30 and the lead pattern 14 on the TAB tape 10 is ensured, Contact with the test pad 16 on the carrier 30 set at test position C can be made with high precision, and even if the semiconductor chip 24 is highly dense, accurate probe testing can be performed. becomes.

Note that the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the gist of the present invention.

[Effects of the Invention] As explained above, according to the TAB device carrier of the present invention, highly accurate positioning with the carrier can be ensured using the target mark formed on the TAB tape,
Furthermore, since the TAB tape can be held between the carriers regardless of the sprocket holes on the TAB tape, it is possible to configure a carrier suitable for high-density devices with narrow test pad pitches.

According to the measurement module of the present invention, the socket is positioned and guided by the fitting of the guide hole and the guide pin to the carrier that positions and holds the test pad on the TAB tape with high precision, and the carrier and the socket are locked. By connecting the part and the locked part by elastic engagement, accurate contact with the test pad on the TAB tape with a narrow pad pitch can be ensured, and a measurement module suitable for a burn-in device can be provided.

According to the insert device of the present invention, the TAB tape is set on the carrier with the carrier clamping operation released, and then the target mark on the TAB tape is detected to correct the positional deviation between the carrier and the TAB tape. Then, by driving the clamping portion of the carrier to clamp the TAB tape between the carriers, it becomes possible to insert the test pad on the TAB tape in a highly precisely positioned state.

By performing sufficient checks, including burn-in tests, on TAB devices with a large number of bins and a narrow pitch as described above, it is possible to provide high quality devices.

[Brief explanation of drawings]

1A and 1B are a plan view and a partially cutaway front view of an embodiment of the carrier according to the present invention, and FIG. A plan view showing the TAB tape in a state; FIGS. 3(A), 3(B), and 3(C) are schematic explanatory diagrams for explaining the outline of the insert device for setting the TAB tape in the carrier and its operation; Figure 4 (A), (B)
5 is a plan view and partially cutaway front view showing a modified example of the clamping part provided on the carrier; FIG. 5 is a schematic explanatory diagram for explaining an example of a measurement module composed of a carrier and a socket; FIG. 6 is a schematic plan view showing an example of a probe device that performs a probe test using a carrier. 10... TAB tape, 12... Sprocket hole, 16... Test pad, 22... Target mark, 24... Device (semiconductor chip), 30... Carrier, 36... Guide hole , 40.42, 44.46
... Holding part, 48... Locking part, 50... Insert device, 52.58.60... Position correction means, 56.
...Detection means (detection camera), 62...Pinch release pin, 70...Measurement module, 72...Socket, 76...Guide pin, 80...
-Locked part (ratchet). Figure 2 24 semiconductor chip

Claims (3)

[Claims] (1) The device is fixed by bonding, and the TAB tape with alignment target marks formed on the surface is
After positioning using the target mark above,
A TA characterized in that a clamping part is provided that elastically clamps at least the tape at a position avoiding the test pad.
Carrier for B devices. (2) the TAB device carrier of claim (1);
a socket that contacts the test pad of the TAB tape supported by the TAB carrier; the TAB carrier is provided with a guide hole and a locking part; the socket has a guide pin that fits into the guide hole; A measurement module comprising a locking portion and a locked portion that elastically engages with the locking portion. (3) a detection means for detecting the positioning target mark formed on the TAB tape according to claim (1); and a detection means for detecting the positioning target mark formed on the TAB tape of claim (1); An insert device comprising: means for alignment control of the relative position of the TAB device carrier; and driving means for driving the clamping part of the TAB device carrier to open and for driving the clamping part to close after the alignment operation.