JPH0375551U - - Google Patents
Info
- Publication number
- JPH0375551U JPH0375551U JP13571789U JP13571789U JPH0375551U JP H0375551 U JPH0375551 U JP H0375551U JP 13571789 U JP13571789 U JP 13571789U JP 13571789 U JP13571789 U JP 13571789U JP H0375551 U JPH0375551 U JP H0375551U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component module
- top cover
- control board
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図はこの考案による電子部品モジユールの
一実施例を示した斜視図、第２図は同モジユール
の断面図である。
図中、１……金属ベース基板、２……金属上蓋
、３……外部端子、４……パワー素子、５……制
御基板、６……半導体素子（中央演算処理回路）
、７……支持具を兼ねた配線基板、８……コネク
ターである。
FIG. 1 is a perspective view showing an embodiment of an electronic component module according to this invention, and FIG. 2 is a sectional view of the module. In the figure, 1...metal base board, 2...metal top cover, 3...external terminal, 4...power element, 5...control board, 6...semiconductor element (central processing circuit)
, 7... A wiring board that also serves as a support, 8... A connector.
Claims (1)
電子回路金属ベース基板と、それを覆うべく凹状
にした金属上蓋とから成る電子部品モジユールに
おいて、前記基板を制御する半導体素子を備えた
制御基板を、電子回路金属ベース基板上に支持具
を兼ねた別の配線基板をもつて保持し、前記両基
板を電気的に接続したことを特徴とする電子部品
モジユール。 (2) 前記制御基板に実装された半導体素子の上
面が、前記金属上蓋の内面に接するようにした請
求項１記載の電子部品モジユール。[Claims for Utility Model Registration] (1) In an electronic component module consisting of an electronic circuit metal base substrate mounted with a power element that generates heat when operated, and a concave metal top cover to cover it, a semiconductor that controls the substrate. An electronic component module characterized in that a control board provided with an element is held on an electronic circuit metal base board with another wiring board that also serves as a support, and the two boards are electrically connected. (2) The electronic component module according to claim 1, wherein the upper surface of the semiconductor element mounted on the control board is in contact with the inner surface of the metal top cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13571789U JPH0375551U (en) | 1989-11-22 | 1989-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13571789U JPH0375551U (en) | 1989-11-22 | 1989-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375551U true JPH0375551U (en) | 1991-07-29 |
Family
ID=31682965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13571789U Pending JPH0375551U (en) | 1989-11-22 | 1989-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375551U (en) |
-
1989
- 1989-11-22 JP JP13571789U patent/JPH0375551U/ja active Pending