JPH0375552U - - Google Patents

Info

Publication number
JPH0375552U
JPH0375552U JP1989136159U JP13615989U JPH0375552U JP H0375552 U JPH0375552 U JP H0375552U JP 1989136159 U JP1989136159 U JP 1989136159U JP 13615989 U JP13615989 U JP 13615989U JP H0375552 U JPH0375552 U JP H0375552U
Authority
JP
Japan
Prior art keywords
image sensor
solid
state image
storage package
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989136159U
Other languages
Japanese (ja)
Other versions
JP2508608Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989136159U priority Critical patent/JP2508608Y2/en
Publication of JPH0375552U publication Critical patent/JPH0375552U/ja
Application granted granted Critical
Publication of JP2508608Y2 publication Critical patent/JP2508608Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案固体撮像素子収納パツケージの
第１の実施例を示す断面図、第２図は本考案固体
撮像素子収納パツケージの第２の実施例を示す断
面図、第３図は本考案固体撮像素子収納パツケー
ジの第３の実施例を示す断面図、第４図Ａ乃至Ｃ
は固体撮像素子収納パツケージの従来例を示すも
ので、同図Ａは平面図、同図Ｂは同図ＡのＢ−Ｂ
線に沿う断面図、同図Ｃは同図ＡのＣ−Ｃ線に沿
う断面図である。 符号の説明、１……固体撮像素子収納パツケー
ジ、２……固体撮像素子支持領域（ダイパツド部
）、３……固体撮像素子。 FIG. 1 is a cross-sectional view showing a first embodiment of the solid-state imaging device storage package of the present invention, FIG. 2 is a cross-sectional view of the second embodiment of the solid-state imaging device storage package of the present invention, and FIG. 3 is a cross-sectional view of the solid-state imaging device storage package of the present invention. Cross-sectional views showing the third embodiment of the solid-state image sensor storage package, FIGS. 4A to 4C
Figure A shows a conventional example of a solid-state image sensor storage package, and Figure A is a plan view and Figure B is a line taken along line B-B in Figure A.
A sectional view taken along line C in the figure is a sectional view taken along line CC in figure A. Explanation of the symbols: 1... Solid-state image sensor storage package, 2... Solid-state image sensor support area (die pad portion), 3... Solid-state image sensor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固体撮像素子を支持する固定撮像素子支持領域
の表面を凹状に形成してなることを特徴とする固
体撮像素子収納パツケージ。 A solid-state image sensor storage package characterized in that the surface of a fixed image sensor support area that supports a solid-state image sensor is formed into a concave shape.
JP1989136159U 1989-11-22 1989-11-22 Solid-state image sensor storage package Expired - Lifetime JP2508608Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989136159U JP2508608Y2 (en) 1989-11-22 1989-11-22 Solid-state image sensor storage package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989136159U JP2508608Y2 (en) 1989-11-22 1989-11-22 Solid-state image sensor storage package

Publications (2)

Publication Number Publication Date
JPH0375552U true JPH0375552U (en) 1991-07-29
JP2508608Y2 JP2508608Y2 (en) 1996-08-28

Family

ID=31683383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989136159U Expired - Lifetime JP2508608Y2 (en) 1989-11-22 1989-11-22 Solid-state image sensor storage package

Country Status (1)

Country Link
JP (1) JP2508608Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294850A (en) * 2005-04-11 2006-10-26 Nec Electronics Corp Interposer, semiconductor device using the same, and method for manufacturing semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127029A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127029A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294850A (en) * 2005-04-11 2006-10-26 Nec Electronics Corp Interposer, semiconductor device using the same, and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JP2508608Y2 (en) 1996-08-28

Similar Documents

Publication Publication Date Title
JPH0170359U (en)
JPS63119240U (en)
JPH02140826U (en)
JPH0353850U (en)
JPS62163953U (en)
JPH0456335U (en)
JPH0186246U (en)
JPS6330846U (en)
JPS6447056U (en)
JPH0299714U (en)
JPH0252441U (en)
JPS62193736U (en)
JPH0161170U (en)
JPS6193161U (en)
JPH02146439U (en)
JPS63167749U (en)
JPS62180941U (en)
JPS61119343U (en)
JPH0325252U (en)
JPS63141194U (en)
JPS63159820U (en)
JPH0477262U (en)
JPH0226262U (en)
JPH0298645U (en)
JPS62177375U (en)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term