JPH0375557U

JPH0375557U -

Info

Publication number: JPH0375557U
Application number: JP13754389U
Authority: JP
Priority date: 1989-11-27
Filing date: 1989-11-27
Publication date: 1991-07-29

Description

[Brief explanation of the drawing]

第１図ａとｂとｃは本考案の一実施例を示す模
式的要部側断面図、第２図は本考案による基板ビ
アの特徴的性質を示す模式的要部側断面図、第３
図はａとｂとｃは従来の基板ビアの構造を示す模
式的要部側断面図、第４図は従来の基板ビアによ
つて発生する障害例を示す模式的要部側断面図で
ある。図において、１……表面配線層、２……裏面配
線層、１０，４０……基板ビア、２０……絶縁基
板、３０，６０……下孔、８０……レーザ光線、
Ｏ……基板ビアの厚さ方向の中央ライン、α……
円錐状の傾斜面、ｄ……基板ビア１０の最小部分
（入り口部分）の断面積、Ｄ……基板ビア１０の
最大部分（中央ラインＯに対応する部分）の断面
積、△……クラツク、をそれぞれ示す。 Figures 1a, b, and c are schematic side sectional views of essential parts showing an embodiment of the present invention; Figure 2 is a schematic side sectional view of essential parts showing the characteristic properties of the substrate via according to the present invention;
In the figures, a, b, and c are schematic side sectional views of main parts showing the structure of conventional board vias, and FIG. 4 is a schematic side sectional view of main parts showing examples of failures caused by conventional board vias. . In the figure, 1... Surface wiring layer, 2... Back wiring layer, 10, 40... Substrate via, 20... Insulating substrate, 30, 60... Preparation hole, 80... Laser beam,
O... Center line in the thickness direction of the board via, α...
Conical inclined surface, d...Cross-sectional area of the smallest part (entrance part) of the substrate via 10, D...Cross-sectional area of the largest part (corresponding to the center line O) of the substrate via 10, Δ...Crack, are shown respectively.

Claims

[Claims for Utility Model Registration] In the structure of a substrate via that electrically connects the front wiring layer 1 and the back wiring layer 2 formed on the front and back surfaces of the insulating substrate 20, the substrate via is provided to penetrate the insulating substrate 20. The substrate vias 10 are connected to the front wiring layer 1 and the back wiring layer 2.
A structure of a substrate via, characterized in that the cross-sectional area of a portion contacting the insulating substrate 20 is minimum, and the cross-sectional area of a portion corresponding to the center line O in the thickness direction of the insulating substrate 20 is maximum.