JPH0375558U - - Google Patents
Info
- Publication number
- JPH0375558U JPH0375558U JP13572489U JP13572489U JPH0375558U JP H0375558 U JPH0375558 U JP H0375558U JP 13572489 U JP13572489 U JP 13572489U JP 13572489 U JP13572489 U JP 13572489U JP H0375558 U JPH0375558 U JP H0375558U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- hole
- land
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本実施例を示す印刷配線基板の接続装
置の一部省略斜視構造図、第２図は同第１図に示
す印刷配線基板の接続装置の一部省略断面図、第
３図は同第２図に示す半田付部間の間隙に半田を
注入した状態の一部省略断面図、第４図は他の実
施例を示す印刷配線基板の接続装置の一部省略断
面図、第５図は従来例を示す印刷配線基板の接続
装置の一部省略斜視構造図、第６図は他の従来例
を示す印刷配線基板の接続装置の一部省略斜視構
造図である。
１……第１の印刷配線基板、２……第２の印刷
配線基板、３……外側端部、４……パターンラン
ド、５……半田付部、６……透孔、７……レジス
ト膜、８……間隙、９……半田、２１……第１の
印刷配線基板、２２……第２の印刷配線基板、２
３……プラグ、２４……コネクター、２５……配
線材、２６……プラグ、２７……コネクター。
FIG. 1 is a partially omitted perspective structural view of a printed wiring board connection device showing this embodiment, FIG. 2 is a partially omitted sectional view of the printed wiring board connection device shown in FIG. 1, and FIG. 2 is a partially omitted cross-sectional view of a state in which solder is injected into the gap between the soldered parts, FIG. 4 is a partially omitted cross-sectional view of a printed wiring board connection device showing another embodiment, and FIG. FIG. 6 is a partially omitted perspective structural view of a printed wiring board connecting device showing a conventional example, and FIG. 6 is a partially omitted perspective structural view of a printed wiring board connecting device showing another conventional example. DESCRIPTION OF SYMBOLS 1...First printed wiring board, 2...Second printed wiring board, 3...Outside end, 4...Pattern land, 5...Soldering part, 6...Through hole, 7...Resist Film, 8... Gap, 9... Solder, 21... First printed wiring board, 22... Second printed wiring board, 2
3...Plug, 24...Connector, 25...Wiring material, 26...Plug, 27...Connector.
Claims (1)
外側端部に半田付部を有するパターンランドを形
成した相互に接続する第１および第２の印刷配線
基板をそれぞれ設け、同第１の印刷配線基板に形
成した前記パターンランドの半田付部に同半田付
部を貫通する透孔を形成し、同透孔を設けた前記
第１の印刷配線基板を上側とし、同基板の半田付
部と前記第２の印刷配線基板の前記パターンラン
ドに形成した半田付部とを上下に向合わせ、前記
透孔より同上下の半田付部間に設けた間隙に溶融
した半田を注入し半田付固着するようにしてなる
印刷配線基板の接続装置。 (2) 下側とした第２の印刷配線基板に形成した
パターンランドの半田付部に透孔を設け、同透孔
より溶融した噴流半田を注入するようにしてなる
請求項(1)記載の印刷配線基板の接続装置。[Scope of claims for utility model registration] (1) Regarding printed wiring boards used in electronic equipment,
First and second printed wiring boards that are connected to each other are provided, each having a patterned land having a soldered portion on the outer end thereof, and the soldered portion of the patterned land formed on the first printed wiring board is provided with the same patterned land. A through hole was formed to penetrate through the soldering part, and the first printed wiring board provided with the through hole was placed on the upper side, and the pattern was formed in the soldering part of the board and the pattern land of the second printed wiring board. A connecting device for a printed wiring board, wherein the soldered parts are placed vertically facing each other, and molten solder is injected into the gap provided between the upper and lower soldered parts through the through hole to fix them by soldering. (2) A through-hole is provided in the soldering portion of the pattern land formed on the second lower printed wiring board, and molten jet solder is injected through the through-hole. Connection device for printed wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13572489U JPH0375558U (en) | 1989-11-22 | 1989-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13572489U JPH0375558U (en) | 1989-11-22 | 1989-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375558U true JPH0375558U (en) | 1991-07-29 |
Family
ID=31682972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13572489U Pending JPH0375558U (en) | 1989-11-22 | 1989-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375558U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016528726A (en) * | 2013-07-24 | 2016-09-15 | エルジー ディスプレイ カンパニー リミテッド | Flexible printed circuit board structure |
-
1989
- 1989-11-22 JP JP13572489U patent/JPH0375558U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016528726A (en) * | 2013-07-24 | 2016-09-15 | エルジー ディスプレイ カンパニー リミテッド | Flexible printed circuit board structure |
| US9872389B2 (en) | 2013-07-24 | 2018-01-16 | Lg Display Co., Ltd. | Flexible printed circuit board structure |
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