JPH0375629B2 - - Google Patents
Info
- Publication number
- JPH0375629B2 JPH0375629B2 JP1150688A JP1150688A JPH0375629B2 JP H0375629 B2 JPH0375629 B2 JP H0375629B2 JP 1150688 A JP1150688 A JP 1150688A JP 1150688 A JP1150688 A JP 1150688A JP H0375629 B2 JPH0375629 B2 JP H0375629B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- base
- gas
- axis
- reactive sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 26
- 239000012495 reaction gas Substances 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000005546 reactive sputtering Methods 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000011295 pitch Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 39
- 239000000758 substrate Substances 0.000 description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 13
- 239000000203 mixture Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 231100000572 poisoning Toxicity 0.000 description 4
- 230000000607 poisoning effect Effects 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- -1 TiN) Chemical class 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1150688A JPH01188669A (ja) | 1988-01-20 | 1988-01-20 | 反応性スパッタリング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1150688A JPH01188669A (ja) | 1988-01-20 | 1988-01-20 | 反応性スパッタリング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01188669A JPH01188669A (ja) | 1989-07-27 |
| JPH0375629B2 true JPH0375629B2 (de) | 1991-12-02 |
Family
ID=11779908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1150688A Granted JPH01188669A (ja) | 1988-01-20 | 1988-01-20 | 反応性スパッタリング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01188669A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3905572B2 (ja) * | 1996-03-04 | 2007-04-18 | 多津男 庄司 | 高融点物質蒸発装置 |
-
1988
- 1988-01-20 JP JP1150688A patent/JPH01188669A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01188669A (ja) | 1989-07-27 |
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