JPH0376295A - Circuit board aggregate - Google Patents
Circuit board aggregateInfo
- Publication number
- JPH0376295A JPH0376295A JP21238089A JP21238089A JPH0376295A JP H0376295 A JPH0376295 A JP H0376295A JP 21238089 A JP21238089 A JP 21238089A JP 21238089 A JP21238089 A JP 21238089A JP H0376295 A JPH0376295 A JP H0376295A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- grooves
- board assembly
- aggregate
- dividing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000005245 sintering Methods 0.000 claims description 11
- 239000011230 binding agent Substances 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 10
- 238000007639 printing Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- -1 etc.) Polymers 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、スルーホールや物品を取りつける小孔等が、
穿設されている寸法の安定した回路用基板を効率よく製
造するための回路用基板集合体に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention provides a method in which through-holes, small holes for attaching articles, etc.
The present invention relates to a circuit board assembly for efficiently manufacturing a circuit board with stable dimensions.
従来、回路用基板としては、紙−フェノール樹脂系基板
、ガラス−エポキシ樹脂などによって造られた積層基板
、絶縁物でアルミニウム板等を被覆した金属基板、アル
ミナ、炭化けい素等の焼結体によって造られたセラミッ
クス基板等が、それぞれ民生用部品として広く用いられ
ているが、特にセラミックス製の回路用基板は、耐熱性
、放熱性、電気絶縁性などに優れていることからその延
びは著しい。Conventionally, circuit boards have been made of paper-phenol resin substrates, laminated substrates made of glass-epoxy resin, metal substrates with aluminum plates covered with insulators, and sintered bodies of alumina, silicon carbide, etc. The manufactured ceramic substrates and the like are widely used as consumer parts, and the popularity of ceramic circuit boards in particular is remarkable due to their excellent heat resistance, heat dissipation, electrical insulation, etc.
上記セラミックス基板は肉薄で、通常、セラミックスお
よびバインダー等を混合したスラリーをドクターブレー
ド法によってテープ状に成形し、グリーン体をつくる。The ceramic substrate is thin and is usually made into a green body by forming a slurry containing ceramics, a binder, etc. into a tape shape using a doctor blade method.
このグリーン体は多数の回路用基板が採取出来る寸法で
、これにそれぞれの基板に必要なスルーホールや部品を
取付ける小孔を打抜きによって穿設するが、同時に、こ
れを焼結した後、それぞれの回路用基板に分割するため
の分割溝を上記グリーン体に型押しによって形成する。This green body has a size that allows a large number of circuit boards to be collected, and the necessary through holes and small holes for attaching parts to each board are punched out.At the same time, after sintering this, each Dividing grooves for dividing into circuit boards are formed in the green body by embossing.
この回路用基板グリーン体を焼結した後、印刷によって
回路パターンを付は加え、上記分割溝において分割し、
多数の回路用基板とする。After sintering this circuit board green body, a circuit pattern is added by printing, and it is divided into the above-mentioned dividing grooves.
A large number of circuit boards.
しかしながら、上記グリーン体に、スルーホール等と同
時に形成される分割溝は、グリーン体の上面のみに形成
されているので、これを焼結して分割する場合、分割溝
以外の場所に切断面がずれてしまうことが多い。そのた
め、分割された個々の回路用基板のサイズにバラつきを
生じその後の組立て工程におけるトラブル発生の原因と
なっている。However, the dividing grooves that are formed in the green body at the same time as the through holes are formed only on the top surface of the green body, so when the green body is sintered and divided, the cut surface will be in places other than the dividing grooves. It often shifts. Therefore, the sizes of the individual divided circuit boards vary, causing trouble in the subsequent assembly process.
これを解決するため、ドクターブレード法や粉末プレス
法などにより板状体を成形し、焼結した後、放電加工法
やレーザー加工法等によってスルーホールや分割溝等を
付加する方法が試みられているが、人手を要し、工程管
理が複雑化し、コストが高くなるなどの問題があった。To solve this problem, attempts have been made to form a plate using a doctor blade method or powder press method, sinter it, and then add through holes or dividing grooves using electrical discharge machining or laser processing. However, there were problems such as requiring labor, complicating process management, and increasing costs.
本発明は上記の事情に鑑み、分割の際、断面がずれるこ
とがなく、寸法安定性の優れた回路用基板が得られる分
割溝が設けられた回路用基板集合体を提供することを目
的とする。In view of the above circumstances, it is an object of the present invention to provide a circuit board assembly provided with dividing grooves, which prevents the cross section from shifting during division and yields a circuit board with excellent dimensional stability. do.
上記の目的を達成するため、本発明の回路用基板集合体
においては、焼結性セラミックスおよびバインダーの混
合物を射出成形した成形体を焼結して得られる板状の回
路用基板集合体であって、回路用基板に分割する分割溝
が、上下の面より対向して、設けられている。In order to achieve the above object, the circuit board assembly of the present invention is a plate-shaped circuit board assembly obtained by sintering a molded body obtained by injection molding a mixture of sinterable ceramics and a binder. Dividing grooves for dividing the circuit board are provided facing each other from the upper and lower surfaces.
本発明の回路用基板集合体は、上記の構成となっている
ので、回路用基板に分割する際、分割面が分割溝よりそ
れることがない。Since the circuit board assembly of the present invention has the above-described structure, when dividing into circuit boards, the dividing plane does not deviate from the dividing groove.
第１図および第２図は本発明に係る回路用基板集合体ｌ
の一実施例を示すもので、図中符号２は個々の回路用基
板である。FIGS. 1 and 2 show a circuit board assembly l according to the present invention.
This shows one embodiment of the present invention, and reference numeral 2 in the figure represents an individual circuit board.
回路用基板２は、上面および下面より対向して形成され
た上下の分割溝３および４によって区画されている。The circuit board 2 is divided by upper and lower dividing grooves 3 and 4 that are formed facing each other from the upper and lower surfaces.
上記個々の回路用基板２には、それぞれスルーホールや
、ＩＣ取付は用などの多数の小孔５・・・或はさらに第
３図に示すように、個々の回路用基板ｌのコーナ部に、
取付は用のボス６を取付ける取付は孔６ａが穿設されて
いる。Each of the circuit boards 2 has through holes, a large number of small holes 5 for IC mounting, etc., or, as shown in FIG. ,
A mounting hole 6a is provided for mounting a boss 6 for mounting.
また、上記個々の回路用基板２にはプリント配線が印刷
されるが、印刷を行う際に便利な、第４図に示すように
周囲にガイド部７を設けた回路用基板集合体ｌ° もあ
る。Further, although printed wiring is printed on each of the circuit boards 2, there is also a circuit board assembly l° with a guide portion 7 provided around the periphery as shown in FIG. 4, which is convenient for printing. be.
上記構成の回路用基板集合体ｌまたは１°を造るには、
焼結性セラミックスおよびバインダー等を混練し、これ
を射出成形してグリーン体を成形し、このグリーン体を
焼結して造られる。To make the circuit board assembly l or 1° with the above configuration,
It is made by kneading sinterable ceramics, a binder, etc., injection molding the mixture to form a green body, and sintering this green body.
バインダーと混練する上記セラミックスは、融点、分解
温度または昇華温度が８００℃以上、特にｔｏｏｏ℃以
上が好ましく、さらに１４００℃以上が好適である。。The above ceramics to be kneaded with the binder preferably has a melting point, decomposition temperature, or sublimation temperature of 800°C or higher, particularly 1400°C or higher, and more preferably 1400°C or higher. .
上記融点、分解温度または昇華温度が８００℃未満では
、脱脂時に変形やふくれが発生する。If the melting point, decomposition temperature or sublimation temperature is less than 800°C, deformation or blistering will occur during degreasing.
上記セラミックスとしては、例えばアルミナ、炭化ケイ
素、窒化ケイ素、ジルコニア、フェライト、コージライ
ト、タングステンカーバイド、窒化アルミニウム等があ
げられる。さらに焼結助剤として、ホウ素、ベリリウム
、炭素、酸化イツトリウム、酸化セリウム、酸化マグネ
シウム、酸化リチウムなどを少量添加してもよい。この
焼結助剤の添加量は、通常セラミックス１００重量部に
対して２０重量部以下である。Examples of the ceramics include alumina, silicon carbide, silicon nitride, zirconia, ferrite, cordierite, tungsten carbide, aluminum nitride, and the like. Furthermore, a small amount of boron, beryllium, carbon, yttrium oxide, cerium oxide, magnesium oxide, lithium oxide, etc. may be added as a sintering aid. The amount of this sintering aid added is usually 20 parts by weight or less per 100 parts by weight of the ceramic.
上記セラミックスの粒度は、平均粒径が００１〜２００
μｍ、特に０．１〜１５０μｍが好ましく、ざらに００
１〜１００μｍが好適である。平均粒径０．１μｍ未満
では、混練する際、均一分散が困難であり、２００μｍ
を越えると、焼結の際の保形性が悪くなると共に焼結後
の密度が小さくなり、その機械的強度が低下する。The particle size of the above ceramics has an average particle size of 001 to 200.
μm, particularly preferably 0.1 to 150 μm, roughly 0.00 μm
1 to 100 μm is suitable. If the average particle size is less than 0.1 μm, uniform dispersion is difficult during kneading;
If it exceeds this, the shape retention during sintering will deteriorate, the density after sintering will decrease, and the mechanical strength will decrease.
また、バインダーとしては、エチレン系重合体、スチレ
ン系重合体、プロピレン系重合体、エチレン−酢酸ビニ
ル共重合体、アルキル（炭素数６以下）メタアクリレー
トを主成分（主成分とは５０ｗｔ％以上を意味する）と
する共重合体（例えば、ポリメチルメタアクリレート、
ポリエチルメタアクリレート、ポリブチルメタアクリレ
ート等）、アルキル（炭素数６以上）アクリレートを主
成分とする共重合体（例えば、ポリブチルアクリレ−ト
等）があげられる。In addition, as a binder, ethylene polymer, styrene polymer, propylene polymer, ethylene-vinyl acetate copolymer, alkyl (carbon number 6 or less) methacrylate is the main component (main component is 50 wt% or more). copolymers (e.g., polymethyl methacrylate,
(polyethyl methacrylate, polybutyl methacrylate, etc.), and copolymers containing alkyl (having 6 or more carbon atoms) acrylate as a main component (eg, polybutyl acrylate, etc.).
上記「Ａ系重合体」とは、Ａモノマーの単独重合体、ま
たははＡモノマーを主成分とした、他のモノマーとの共
重合体を意味する。The above-mentioned "A-based polymer" means a homopolymer of the A monomer or a copolymer containing the A monomer as a main component with other monomers.
これら合成樹脂バインダーは、蒸気圧浸透法（Ｖａｐｏ
ｒ Ｐｒｅ’５ｓｕｒｅ Ｏｓｍｏｍｅｔｅｒ）によっ
て測定した数平均分子量が、通常２．０００〜５００，
０００゜特に４．０００〜５００，０００が好ましい。These synthetic resin binders can be used by vapor pressure osmosis method (Vapo osmosis method).
The number average molecular weight measured by Pre'5sure Osmometer) is usually 2.000 to 500,
000°, particularly preferably 4.000 to 500,000.
上記セラミックスおよびバインダーを用いて回路用基板
集合体を製造するには、まず、セラミックスの粉末とバ
インダーを所定の割合（通常セラミックスの粉末１００
重量部に対してバインダーを５〜４０重量部用いる）で
混練し、ペレット状に成形する。To manufacture a circuit board assembly using the above ceramics and binder, first, ceramic powder and binder are mixed in a predetermined ratio (usually ceramic powder 100%
(using 5 to 40 parts by weight of binder) and molded into pellets.
このベレットを射出成形機に入れ、上記回路用基板集合
体のグリーン体を成形する金型内に射出する。この場合
金型として、スルホール等を形成するための挿入、抜き
出し自在なスライドビンを有する金型を用いてもよい。This pellet is placed in an injection molding machine and injected into a mold for molding the green body of the circuit board assembly. In this case, a mold having a slide bin that can be freely inserted and extracted for forming through holes etc. may be used as the mold.
金型内で固化した回路用基板集合体のグリーン体は離型
され、脱脂、焼結されて、回路用基板集合体がつくられ
るが、脱脂工程と焼結工程は分離して行っても、連続し
て行ってもよい。The green body of the circuit board assembly solidified in the mold is released, degreased, and sintered to produce the circuit board assembly, but even if the degreasing and sintering processes are performed separately, It may be done continuously.
脱脂は、窒素等の不活性ガス雰囲気下、或は大気中で、
加圧、または常圧下６００ ’Ｃまで昇温することによ
って行われる。Degreasing is carried out in an inert gas atmosphere such as nitrogen, or in the air.
This is carried out by increasing the pressure or by raising the temperature to 600'C under normal pressure.
また、焼結は、使用するセラミックスの種類によって最
高温度が異なるが、窒素等の不活性ガス雰囲気下、或は
大気中で最高１２００〜２３００℃の範囲の温度で行わ
れる。Sintering is performed at a maximum temperature of 1200 to 2300° C. in an atmosphere of an inert gas such as nitrogen or in the air, although the maximum temperature varies depending on the type of ceramic used.
このようにして得られた、回路用基板集合体ｌまたはｌ
゛の個々の回路用基板２の面に、銀−パラジウムペース
ト、銅ペーストなどの導電ｅ料によって回路パターンが
印刷される。The circuit board assembly l or l obtained in this way
A circuit pattern is printed on the surface of each circuit board 2 using a conductive e-material such as silver-palladium paste or copper paste.
しかし上記回路用基板集合体の表面状態が悪いと、回路
パターンの印刷がよく仕上がらないので、表面を切削、
研摩して印刷がよく仕上がるようにすることも出来る。However, if the surface condition of the above-mentioned circuit board assembly is poor, the printing of the circuit pattern will not be finished well.
It can also be polished to improve the print quality.
通常、上記回路用基板集合体ｌまたはビの厚みは、０．
３〜５．０間で、上下の分割溝３，４の深さは０．１＝
０．５ｎ＋ｓ、幅は０．１〜１． Ｏｌの範囲であり
、上下の分割溝３，４の深さ、幅はそれぞれ同じであっ
ても異なっていてもよい。Usually, the thickness of the circuit board assembly L or VI is 0.
Between 3 and 5.0, the depth of the upper and lower dividing grooves 3 and 4 is 0.1 =
0.5n+s, width 0.1-1. The depth and width of the upper and lower dividing grooves 3 and 4 may be the same or different.
このようにしてつくられた回路用基板集合体１または１
′は、分割溝３．４に従って折られ、回路用基板２に分
割されるが、分割溝３，４が対向して設けられているの
で、対向している先端部分に沿って分割され、分割線が
それることなく、正しい寸法の多数の回路用基板２・・
・が得られる。Circuit board assembly 1 or 1 made in this way
' is folded along the dividing grooves 3 and 4 and divided into the circuit board 2. However, since the dividing grooves 3 and 4 are provided facing each other, it is divided along the opposing tip portions, and the circuit board 2 is divided. A large number of circuit boards 2 with the correct dimensions without deviating lines...
・is obtained.
なお上記説明では、回路用基板集合体ｌまたはｌ゛を４
個の回路用基板の集合体としたがこれに限定されるもの
でなく、集合する個数は、各回路用基板の大きい、その
他の条件によって自由に選択出来る。In the above explanation, the circuit board assembly l or l is 4.
Although the present invention is an assembly of circuit boards, the present invention is not limited to this, and the number of circuit boards to be assembled can be freely selected depending on the size of each circuit board and other conditions.
以上述べたように、本発明に係る回路用基板集合体は、
セラミックスの焼結体によってつくられているので、放
熱性、耐熱性、電気絶縁性に優れ、多数の回路用基板が
一回の成形によって得られるので、生産効率がよく、特
に分割溝が上下面より対向して形成されており、これを
分割する際、分割溝に沿って正しく分割されて分割線が
分割溝をそれたりすることがないので、各回路用基板の
寸法はいずれも同じとなり、組立工程における製品管理
が極めて容易になるなど多くの長所を有する。As described above, the circuit board assembly according to the present invention is
Since it is made from a sintered ceramic body, it has excellent heat dissipation, heat resistance, and electrical insulation properties.Many circuit boards can be obtained by one molding process, which improves production efficiency. They are formed so that they face each other, and when they are divided, they are correctly divided along the dividing groove and the dividing line does not deviate from the dividing groove, so the dimensions of each circuit board are the same. It has many advantages such as extremely easy product management in the assembly process.
第１図および第２図は本発明に係る回路用基板集合体の
一実施例を示す図で、第１図は斜視図、第２図は第１図
の■−■線視固視図３図は取付は用ボスが設けられる回
路用基板の集合体を示す斜視図、第４図はガイド部を有
する回路用基板集合体の斜視図である。
ｌ・・・・・・回路用基板集合体、
１°・・・・・・ガイド部を有する回路用基板集合体、
２・・・・・・回路用基板、３・・・・・・上分割溝、
４・・・・・・子分割溝、５・・・・・・小孔、６・・
・・・・ボス、６ａ・・・・・・取付は孔、７・・・・
・・ガイド部。1 and 2 are diagrams showing one embodiment of a circuit board assembly according to the present invention, FIG. 1 is a perspective view, and FIG. 2 is a fixed view 3 taken along the line ■-■ in FIG. 1. The figure is a perspective view showing a circuit board assembly provided with mounting bosses, and FIG. 4 is a perspective view of a circuit board assembly having a guide portion. 1...Circuit board assembly, 1°...Circuit board assembly having a guide part,
2... Circuit board, 3... Upper dividing groove,
4... Child dividing groove, 5... Small hole, 6...
...Boss, 6a... Mounting hole, 7...
...Guide section.
Claims (1)
成形した成形体を焼結して得られる板状の回路用基板集
合体であって、回路用基板に分割する分割溝が、上下の
面より対向して、設けられていることを特徴とする回路
用基板集合体。A plate-shaped circuit board assembly obtained by sintering a molded body made by injection molding a mixture of sinterable ceramics and a binder, in which the dividing grooves that divide the circuit boards face each other from the upper and lower surfaces. A circuit board assembly characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21238089A JPH0376295A (en) | 1989-08-18 | 1989-08-18 | Circuit board aggregate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21238089A JPH0376295A (en) | 1989-08-18 | 1989-08-18 | Circuit board aggregate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0376295A true JPH0376295A (en) | 1991-04-02 |
Family
ID=16621616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21238089A Pending JPH0376295A (en) | 1989-08-18 | 1989-08-18 | Circuit board aggregate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0376295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010225726A (en) * | 2009-03-23 | 2010-10-07 | Kyocera Corp | Multi-cavity wiring board, wiring board, electronic component storage package, and electronic device |
-
1989
- 1989-08-18 JP JP21238089A patent/JPH0376295A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010225726A (en) * | 2009-03-23 | 2010-10-07 | Kyocera Corp | Multi-cavity wiring board, wiring board, electronic component storage package, and electronic device |
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