JPH0377327U - - Google Patents
Info
- Publication number
- JPH0377327U JPH0377327U JP13902289U JP13902289U JPH0377327U JP H0377327 U JPH0377327 U JP H0377327U JP 13902289 U JP13902289 U JP 13902289U JP 13902289 U JP13902289 U JP 13902289U JP H0377327 U JPH0377327 U JP H0377327U
- Authority
- JP
- Japan
- Prior art keywords
- cable
- coating layer
- preventing condensation
- water
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011247 coating layer Substances 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 238000010073 coating (rubber) Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Description
第１図は本考案に係る結露防止用ケーブルの横
断面図、第２図は、従来の結露防止用ケーブルの
横断面図である。 １，４……導体、２……ゴム絶縁被覆層、３…
…低圧絶縁線心、５……半導電性被覆層、６……
半導電性線心、７……より合わせ体、８……半導
電性ゴム被覆層、９……高圧絶縁ゴム被覆層、１
０……外部しやへい層、１１……ケーブルシース
、１２……遮水層、１３……高吸湿被覆層。
断面図、第２図は、従来の結露防止用ケーブルの
横断面図である。 １，４……導体、２……ゴム絶縁被覆層、３…
…低圧絶縁線心、５……半導電性被覆層、６……
半導電性線心、７……より合わせ体、８……半導
電性ゴム被覆層、９……高圧絶縁ゴム被覆層、１
０……外部しやへい層、１１……ケーブルシース
、１２……遮水層、１３……高吸湿被覆層。
Claims (1)
- 電気ケーブルを構成するケーブルシースの外周
に遮水層及び高吸湿被覆層を設けて成ることを特
徴とする結露防止用ケーブル。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13902289U JPH0377327U (ja) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13902289U JPH0377327U (ja) | 1989-11-30 | 1989-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377327U true JPH0377327U (ja) | 1991-08-02 |
Family
ID=31686092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13902289U Pending JPH0377327U (ja) | 1989-11-30 | 1989-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377327U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8959756B2 (en) | 2000-09-25 | 2015-02-24 | Ibiden Co., Ltd. | Method of manufacturing a printed circuit board having an embedded electronic component |
-
1989
- 1989-11-30 JP JP13902289U patent/JPH0377327U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8959756B2 (en) | 2000-09-25 | 2015-02-24 | Ibiden Co., Ltd. | Method of manufacturing a printed circuit board having an embedded electronic component |
| US9245838B2 (en) | 2000-09-25 | 2016-01-26 | Ibiden Co., Ltd. | Semiconductor element |