JPH0377453U - - Google Patents

Info

Publication number
JPH0377453U
JPH0377453U JP13816089U JP13816089U JPH0377453U JP H0377453 U JPH0377453 U JP H0377453U JP 13816089 U JP13816089 U JP 13816089U JP 13816089 U JP13816089 U JP 13816089U JP H0377453 U JPH0377453 U JP H0377453U
Authority
JP
Japan
Prior art keywords
semiconductor component
electrode
heat sink
mounting plate
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13816089U
Other languages
English (en)
Other versions
JPH0810204Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13816089U priority Critical patent/JPH0810204Y2/ja
Publication of JPH0377453U publication Critical patent/JPH0377453U/ja
Application granted granted Critical
Publication of JPH0810204Y2 publication Critical patent/JPH0810204Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図および第２図は本考案の第１実施例を示
し、第１図は断面図、第２図は分解斜視図、第３
図および第４図は本考案の第２実施例を示し、第
３図は断面図、第４図は分解斜視図、第５図およ
び第６図は本考案の他の実施例を示し、第５図は
断面図、第６図は分解斜視図、第７図は従来例を
示す断面図である。 １……放熱板電極（放熱体電極）、２……半導
体部品、３……樹脂モールド（モールド部）、４
……面状電極、１０……取付板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体部品の側面にモールド部から面状に露出
    した電極を放熱体電極に電気的に接続して放熱体
    に半導体部品を取付ける半導体部品取付構造にお
    いて、前記半導体部品の面状電極と放熱体電極と
    の間に導電材からなる取付板を介装し、この取付
    板の少なくとも一部を前記半導体部品の電極より
    小幅に形成してなることを特徴とする半導体部品
    取付構造。
JP13816089U 1989-11-29 1989-11-29 半導体部品取付構造 Expired - Lifetime JPH0810204Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13816089U JPH0810204Y2 (ja) 1989-11-29 1989-11-29 半導体部品取付構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13816089U JPH0810204Y2 (ja) 1989-11-29 1989-11-29 半導体部品取付構造

Publications (2)

Publication Number Publication Date
JPH0377453U true JPH0377453U (ja) 1991-08-05
JPH0810204Y2 JPH0810204Y2 (ja) 1996-03-27

Family

ID=31685281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13816089U Expired - Lifetime JPH0810204Y2 (ja) 1989-11-29 1989-11-29 半導体部品取付構造

Country Status (1)

Country Link
JP (1) JPH0810204Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006094398A (ja) * 2004-09-27 2006-04-06 Matsushita Electric Works Ltd 圧力波発生装置
KR20100132458A (ko) * 2009-06-09 2010-12-17 레인만 게엠바하 엔 코 카게 역화 방지장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006094398A (ja) * 2004-09-27 2006-04-06 Matsushita Electric Works Ltd 圧力波発生装置
KR20100132458A (ko) * 2009-06-09 2010-12-17 레인만 게엠바하 엔 코 카게 역화 방지장치

Also Published As

Publication number Publication date
JPH0810204Y2 (ja) 1996-03-27

Similar Documents

Publication Publication Date Title
JPS61146909U (ja)
JPH0810204Y2 (ja) 半導体部品取付構造
JPS6442619U (ja)
JPS6242330U (ja)
JPH0338156U (ja)
JPH0242499U (ja)
JPH02136301U (ja)
JPS6448927U (ja)
JPH01105217U (ja)
JPH0334320U (ja)
JPS63127293U (ja)
JPS6448926U (ja)
JPH01127129U (ja)
JPH0332333U (ja)
JPH0336166U (ja)
JPH0385656U (ja)
JPS6142803U (ja) サ−ミスタ
JPS63158095U (ja)
JPS62164494U (ja)
JPH0381675U (ja)
JPH03131087U (ja)
JPS637900U (ja)
JPS6249204U (ja)
JPS63127294U (ja)
JPH0338918U (ja)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term