JPH0377497U - - Google Patents
Info
- Publication number
- JPH0377497U JPH0377497U JP13740889U JP13740889U JPH0377497U JP H0377497 U JPH0377497 U JP H0377497U JP 13740889 U JP13740889 U JP 13740889U JP 13740889 U JP13740889 U JP 13740889U JP H0377497 U JPH0377497 U JP H0377497U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- shaped electronic
- electronic component
- circuit board
- mounting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
Description
第1図は本考案の実施例であるチツプ状電子部
品マウント装置の吸着ヘツド手段と回路基板支持
手段を示す斜視図、第2図は前記吸着ヘツド手段
のサクシヨンノズル及びテンプレートの詳細構造
を示す一部断面を含む斜視図、第3図a乃至eは
前記チツプ状電子部品マウント装置の動作を示す
動作説明図、第4図は本考案の他の実施例による
チツプ状電子部品マウント装置を説明する一部斜
視図、そして、第5図a,b及び第6図は、従来
のチツプ状電子部品マウント装置及びそれを用い
てチツプ状電子部品をマウントした回路基板の一
例を示す図である。
1……バツクアツプボード、2……バツクアツ
プベース、3……Xテーブル、5……ピン、60
……吸着ヘツド、61……サクシヨンノズル、6
2……位置決めピン、100……回路基板、10
1……位置決め孔、70……テンプレート、20
0……チツプ状電子部品。
FIG. 1 is a perspective view showing the suction head means and circuit board support means of a chip-shaped electronic component mounting apparatus which is an embodiment of the present invention, and FIG. 2 shows the detailed structure of the suction nozzle and template of the suction head means. A perspective view including a partial cross section, FIGS. 3a to 3e are operation explanatory diagrams showing the operation of the chip-shaped electronic component mounting device, and FIG. 4 illustrates a chip-shaped electronic component mounting device according to another embodiment of the present invention. The partial perspective view, FIGS. 5a and 5b, and FIG. 6 are views showing an example of a conventional chip-shaped electronic component mounting device and a circuit board on which a chip-shaped electronic component is mounted using the same. 1...backup board, 2...backup base, 3...X table, 5...pin, 60
... Suction head, 61 ... Suction nozzle, 6
2...Positioning pin, 100...Circuit board, 10
1...Positioning hole, 70...Template, 20
0... Chip-shaped electronic component.
Claims (1)
基板を支持する基板支持手段と、分配供給された
チツプ状電子部品を収受する複数の収納凹部を有
するテンプレート手段と、前記テンプレート手段
の収納凹部に収受された前記チツプ状電子部品を
吸着・保持するための吸着ヘツド手段と、前記吸
着ヘツド手段を移動し、前記基板支持手段上に支
持された回路基板上の所定の位置に前記チツプ状
電子部品を搭載する搭載機構とを備えたチツプ状
電子部品マウント装置において、前記回路基板に
は任意の位置に位置決め孔が設けられると共に、
前記吸着ヘツド手段には、前記回路基板の前記位
置決め孔に挿入する位置決めピンが固設されたこ
とを特徴とするチツプ状電子部品マウント装置。 (2) 請求項1のチツプ状電子部品マウント装置
において、回路基板は、複数に分割されるための
手段と、分割される数に対応した数の位置決め孔
を有し、前記吸着ヘツド手段には、前記回路基板
に設けられた位置決め孔に各々挿入される位置に
ピンが固設されたことを特徴とするチツプ状電子
部品マウント装置。[Claims for Utility Model Registration] (1) Board support means for supporting a circuit board with a predetermined circuit pattern formed on its surface; template means having a plurality of storage recesses for receiving chip-shaped electronic components distributed and supplied; a suction head means for suctioning and holding the chip-shaped electronic component received in the storage recess of the template means; A chip-shaped electronic component mounting device comprising a mounting mechanism for mounting the chip-shaped electronic component at a position, wherein the circuit board is provided with a positioning hole at an arbitrary position, and
A chip-shaped electronic component mounting device, wherein a positioning pin to be inserted into the positioning hole of the circuit board is fixed to the suction head means. (2) In the chip-shaped electronic component mounting device according to claim 1, the circuit board has means for dividing into a plurality of parts and a number of positioning holes corresponding to the number of parts to be divided, and the suction head means has a plurality of positioning holes. . A chip-shaped electronic component mounting device, characterized in that pins are fixedly installed at positions to be inserted into positioning holes provided in the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989137408U JPH0651031Y2 (en) | 1989-11-28 | 1989-11-28 | Chip-shaped electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989137408U JPH0651031Y2 (en) | 1989-11-28 | 1989-11-28 | Chip-shaped electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377497U true JPH0377497U (en) | 1991-08-05 |
| JPH0651031Y2 JPH0651031Y2 (en) | 1994-12-21 |
Family
ID=31684566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989137408U Expired - Lifetime JPH0651031Y2 (en) | 1989-11-28 | 1989-11-28 | Chip-shaped electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651031Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117029A (en) * | 1984-11-13 | 1986-06-04 | Toshiba Seiki Kk | Work setting method and device thereof |
| JPS6327077U (en) * | 1986-08-07 | 1988-02-22 | ||
| JPH01123400U (en) * | 1988-02-15 | 1989-08-22 |
-
1989
- 1989-11-28 JP JP1989137408U patent/JPH0651031Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117029A (en) * | 1984-11-13 | 1986-06-04 | Toshiba Seiki Kk | Work setting method and device thereof |
| JPS6327077U (en) * | 1986-08-07 | 1988-02-22 | ||
| JPH01123400U (en) * | 1988-02-15 | 1989-08-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0651031Y2 (en) | 1994-12-21 |
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