JPH0377497U - - Google Patents

Info

Publication number
JPH0377497U
JPH0377497U JP13740889U JP13740889U JPH0377497U JP H0377497 U JPH0377497 U JP H0377497U JP 13740889 U JP13740889 U JP 13740889U JP 13740889 U JP13740889 U JP 13740889U JP H0377497 U JPH0377497 U JP H0377497U
Authority
JP
Japan
Prior art keywords
chip
shaped electronic
electronic component
circuit board
mounting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13740889U
Other languages
Japanese (ja)
Other versions
JPH0651031Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989137408U priority Critical patent/JPH0651031Y2/en
Publication of JPH0377497U publication Critical patent/JPH0377497U/ja
Application granted granted Critical
Publication of JPH0651031Y2 publication Critical patent/JPH0651031Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例であるチツプ状電子部
品マウント装置の吸着ヘツド手段と回路基板支持
手段を示す斜視図、第2図は前記吸着ヘツド手段
のサクシヨンノズル及びテンプレートの詳細構造
を示す一部断面を含む斜視図、第3図a乃至eは
前記チツプ状電子部品マウント装置の動作を示す
動作説明図、第4図は本考案の他の実施例による
チツプ状電子部品マウント装置を説明する一部斜
視図、そして、第5図a,b及び第6図は、従来
のチツプ状電子部品マウント装置及びそれを用い
てチツプ状電子部品をマウントした回路基板の一
例を示す図である。 1……バツクアツプボード、2……バツクアツ
プベース、3……Xテーブル、5……ピン、60
……吸着ヘツド、61……サクシヨンノズル、6
2……位置決めピン、100……回路基板、10
1……位置決め孔、70……テンプレート、20
0……チツプ状電子部品。
FIG. 1 is a perspective view showing the suction head means and circuit board support means of a chip-shaped electronic component mounting apparatus which is an embodiment of the present invention, and FIG. 2 shows the detailed structure of the suction nozzle and template of the suction head means. A perspective view including a partial cross section, FIGS. 3a to 3e are operation explanatory diagrams showing the operation of the chip-shaped electronic component mounting device, and FIG. 4 illustrates a chip-shaped electronic component mounting device according to another embodiment of the present invention. The partial perspective view, FIGS. 5a and 5b, and FIG. 6 are views showing an example of a conventional chip-shaped electronic component mounting device and a circuit board on which a chip-shaped electronic component is mounted using the same. 1...backup board, 2...backup base, 3...X table, 5...pin, 60
... Suction head, 61 ... Suction nozzle, 6
2...Positioning pin, 100...Circuit board, 10
1...Positioning hole, 70...Template, 20
0... Chip-shaped electronic component.

Claims (1)

【実用新案登録請求の範囲】 (1) 所定の回路パターンを表面に形成した回路
基板を支持する基板支持手段と、分配供給された
チツプ状電子部品を収受する複数の収納凹部を有
するテンプレート手段と、前記テンプレート手段
の収納凹部に収受された前記チツプ状電子部品を
吸着・保持するための吸着ヘツド手段と、前記吸
着ヘツド手段を移動し、前記基板支持手段上に支
持された回路基板上の所定の位置に前記チツプ状
電子部品を搭載する搭載機構とを備えたチツプ状
電子部品マウント装置において、前記回路基板に
は任意の位置に位置決め孔が設けられると共に、
前記吸着ヘツド手段には、前記回路基板の前記位
置決め孔に挿入する位置決めピンが固設されたこ
とを特徴とするチツプ状電子部品マウント装置。 (2) 請求項1のチツプ状電子部品マウント装置
において、回路基板は、複数に分割されるための
手段と、分割される数に対応した数の位置決め孔
を有し、前記吸着ヘツド手段には、前記回路基板
に設けられた位置決め孔に各々挿入される位置に
ピンが固設されたことを特徴とするチツプ状電子
部品マウント装置。
[Claims for Utility Model Registration] (1) Board support means for supporting a circuit board with a predetermined circuit pattern formed on its surface; template means having a plurality of storage recesses for receiving chip-shaped electronic components distributed and supplied; a suction head means for suctioning and holding the chip-shaped electronic component received in the storage recess of the template means; A chip-shaped electronic component mounting device comprising a mounting mechanism for mounting the chip-shaped electronic component at a position, wherein the circuit board is provided with a positioning hole at an arbitrary position, and
A chip-shaped electronic component mounting device, wherein a positioning pin to be inserted into the positioning hole of the circuit board is fixed to the suction head means. (2) In the chip-shaped electronic component mounting device according to claim 1, the circuit board has means for dividing into a plurality of parts and a number of positioning holes corresponding to the number of parts to be divided, and the suction head means has a plurality of positioning holes. . A chip-shaped electronic component mounting device, characterized in that pins are fixedly installed at positions to be inserted into positioning holes provided in the circuit board.
JP1989137408U 1989-11-28 1989-11-28 Chip-shaped electronic component mounting device Expired - Lifetime JPH0651031Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989137408U JPH0651031Y2 (en) 1989-11-28 1989-11-28 Chip-shaped electronic component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989137408U JPH0651031Y2 (en) 1989-11-28 1989-11-28 Chip-shaped electronic component mounting device

Publications (2)

Publication Number Publication Date
JPH0377497U true JPH0377497U (en) 1991-08-05
JPH0651031Y2 JPH0651031Y2 (en) 1994-12-21

Family

ID=31684566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989137408U Expired - Lifetime JPH0651031Y2 (en) 1989-11-28 1989-11-28 Chip-shaped electronic component mounting device

Country Status (1)

Country Link
JP (1) JPH0651031Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117029A (en) * 1984-11-13 1986-06-04 Toshiba Seiki Kk Work setting method and device thereof
JPS6327077U (en) * 1986-08-07 1988-02-22
JPH01123400U (en) * 1988-02-15 1989-08-22

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117029A (en) * 1984-11-13 1986-06-04 Toshiba Seiki Kk Work setting method and device thereof
JPS6327077U (en) * 1986-08-07 1988-02-22
JPH01123400U (en) * 1988-02-15 1989-08-22

Also Published As

Publication number Publication date
JPH0651031Y2 (en) 1994-12-21

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