JPH0377643U - - Google Patents
Info
- Publication number
- JPH0377643U JPH0377643U JP13863089U JP13863089U JPH0377643U JP H0377643 U JPH0377643 U JP H0377643U JP 13863089 U JP13863089 U JP 13863089U JP 13863089 U JP13863089 U JP 13863089U JP H0377643 U JPH0377643 U JP H0377643U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum plate
- fins
- ceramic substrate
- thermal head
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図はこの考案の一実施例を示す図、第２図
は従来の構造を示す図、第３図は使用状態におけ
るサーマルヘツド基板の反りを測定する方法を示
す図。
１……セラミツク基板、２……アルミ板、３…
…アルミフイン、４……鉄板、５……ネジ。なお
、各図中同一符号は同一または相当部分を示すも
のとする。
FIG. 1 is a diagram showing an embodiment of this invention, FIG. 2 is a diagram showing a conventional structure, and FIG. 3 is a diagram showing a method for measuring warpage of a thermal head board in a used state. 1... Ceramic substrate, 2... Aluminum plate, 3...
...aluminum fin, 4...iron plate, 5...screw. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
状に形成されたセラミツク基板、 このセラミツク基板の強度を補強し、その熱を
伝導して外部へ放熱するため、該セラミツク基板
の上記発熱体の形成されている表面とは反対面に
接着されるアルミ板、 このアルミ板の上記セラミツク基板が接着され
た面と反対面に当該アルミ板と一体に形成される
アルミフイン、 このアルミフインの複数のフイン端部にねじ止
めされ、この複数のフイン端部を互いに連結する
鉄板、 を備えたサーマルヘツド基板の補強構造。[Scope of Claim for Utility Model Registration] A ceramic substrate on which heating elements constituting a thermal head array are formed in a straight line; an aluminum plate bonded to a surface opposite to the surface on which the heating element is formed; an aluminum fin integrally formed with the aluminum plate on a surface of the aluminum plate opposite to the surface to which the ceramic substrate is bonded; A reinforcing structure for a thermal head board, comprising: a steel plate screwed to the ends of a plurality of fins to connect the ends of the plurality of fins to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13863089U JPH0377643U (en) | 1989-12-01 | 1989-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13863089U JPH0377643U (en) | 1989-12-01 | 1989-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377643U true JPH0377643U (en) | 1991-08-05 |
Family
ID=31685719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13863089U Pending JPH0377643U (en) | 1989-12-01 | 1989-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377643U (en) |
-
1989
- 1989-12-01 JP JP13863089U patent/JPH0377643U/ja active Pending
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