JPH0377672U - - Google Patents

Info

Publication number
JPH0377672U
JPH0377672U JP1989139612U JP13961289U JPH0377672U JP H0377672 U JPH0377672 U JP H0377672U JP 1989139612 U JP1989139612 U JP 1989139612U JP 13961289 U JP13961289 U JP 13961289U JP H0377672 U JPH0377672 U JP H0377672U
Authority
JP
Japan
Prior art keywords
bump
board
wiring pattern
hole
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989139612U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989139612U priority Critical patent/JPH0377672U/ja
Publication of JPH0377672U publication Critical patent/JPH0377672U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)

Description

【図面の簡単な説明】
第1図は本考案による配線基板の一実施例を示
す断面図、第2図は製造工程の一実施例を示す断
面図、第3図は従来の情報カード読取システムの
構成を示す略線的ブロツク図、第4図はその情報
カードの電気的構成を示すブロツク図、第5図及
び第6図は従来の配線基板の説明に供する断面図
である。 4,30……情報カード、15,33……チツ
プ部品、21,31……基板、22,32……配
線パターン、23……電極、24……バンプ、3
5……スルーホール、37……接着材。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板上に形成された配線パターンにチツプ部品
    の電極をバンプを介して結合するようになされた
    配線基板において、 上記基板上の上記チツプ部品の電極に対応する
    位置にスルーホールを穿設し、 一部を上記スルーホールを埋め込みかつ他部を
    上記基板の一側表面上に突出するように上記バン
    プを形成すると共に、上記基板の他側表面上に上
    記スルーホールの上記一部に電気的に接続された
    配線パターンを形成する ことを特徴とする配線基板。
JP1989139612U 1989-12-01 1989-12-01 Pending JPH0377672U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989139612U JPH0377672U (ja) 1989-12-01 1989-12-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989139612U JPH0377672U (ja) 1989-12-01 1989-12-01

Publications (1)

Publication Number Publication Date
JPH0377672U true JPH0377672U (ja) 1991-08-05

Family

ID=31686646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989139612U Pending JPH0377672U (ja) 1989-12-01 1989-12-01

Country Status (1)

Country Link
JP (1) JPH0377672U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101908439B1 (ko) * 2017-04-20 2018-10-16 바다중공업 주식회사 고속단정용 대빗의 흔들림 방지장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101908439B1 (ko) * 2017-04-20 2018-10-16 바다중공업 주식회사 고속단정용 대빗의 흔들림 방지장치

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