JPH0380348B2 - - Google Patents

Info

Publication number
JPH0380348B2
JPH0380348B2 JP60257425A JP25742585A JPH0380348B2 JP H0380348 B2 JPH0380348 B2 JP H0380348B2 JP 60257425 A JP60257425 A JP 60257425A JP 25742585 A JP25742585 A JP 25742585A JP H0380348 B2 JPH0380348 B2 JP H0380348B2
Authority
JP
Japan
Prior art keywords
cap
organic resin
adhesive
film
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60257425A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62117349A (ja
Inventor
Yoshitaka Ono
Hajime Yatsu
Keiji Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60257425A priority Critical patent/JPS62117349A/ja
Publication of JPS62117349A publication Critical patent/JPS62117349A/ja
Publication of JPH0380348B2 publication Critical patent/JPH0380348B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP60257425A 1985-11-16 1985-11-16 電子部品封止用キヤツプとその製造方法 Granted JPS62117349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60257425A JPS62117349A (ja) 1985-11-16 1985-11-16 電子部品封止用キヤツプとその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60257425A JPS62117349A (ja) 1985-11-16 1985-11-16 電子部品封止用キヤツプとその製造方法

Publications (2)

Publication Number Publication Date
JPS62117349A JPS62117349A (ja) 1987-05-28
JPH0380348B2 true JPH0380348B2 (cs) 1991-12-24

Family

ID=17306188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60257425A Granted JPS62117349A (ja) 1985-11-16 1985-11-16 電子部品封止用キヤツプとその製造方法

Country Status (1)

Country Link
JP (1) JPS62117349A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165816A (en) * 1996-06-13 2000-12-26 Nikko Company Fabrication of electronic components having a hollow package structure with a ceramic lid

Also Published As

Publication number Publication date
JPS62117349A (ja) 1987-05-28

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