JPH0380350B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method for connecting integrated circuit units in the microwave band or millimeter wave band.

(b) Background of the technology Integrated circuits that operate in the microwave band to millimeter wave band are widely used in recent communication equipment, and the electrical characteristics and economical For these reasons, a non-stereoscopic circuit, such as a strip line, is used.

On the other hand, protection of dielectric substrate of integrated circuit, heat dissipation,
Dielectric substrates on which integrated circuits are constructed are often mounted on thin metal plates, so-called metal carriers, for ease of maintenance.

(c) Prior Art and Problems A conventional connection method for integrated circuit units configured with this type of circuit will be explained with reference to the sectional view of FIG.

In the same figure, 1 and 6 are respectively plane bases 1
The device is an integrated circuit unit that operates in the microwave band to millimeter wave band and is fixed to the top surface of the device 1 by suitable means such as machine screws, facing each other (the figure shows the transmission line portion to which it is connected).

The transmission path of the integrated circuit unit 1 is composed of a narrow strip line 3 on the top surface of a dielectric substrate (for example, an alumina substrate) 2, and a ground conductor 4 formed on the entire bottom surface.The bottom surface of the ground conductor 4 is a metal plate. The metal carrier 5 is closely attached (for example, soldered) to the upper surface of a metal carrier 5 made of (for example, an oxygen-free copper plate). The transmission line of the integrated circuit unit 6 has exactly the same shape as the transmission line of the integrated circuit unit 1, and is composed of a strip line 8, a dielectric substrate 7, a ground conductor 9, and a metal carrier 10.

Such integrated circuit units 1 and 6 are fixed to a flat substrate 10 with the end faces of the strip line 3 and the strip line 8 facing each other and in close proximity to each other, and the strip line 3 and the strip line 8 are made of a thin flexible wire bonded to the upper surface, for example. They are connected by a conductive plate 12, such as a conductive ribbon 12 made of pure gold. Note that the end faces of the integrated circuit unit 1 and the integrated circuit unit 6, that is, the end faces of the dielectric substrate 4 and the metal carrier 5 and the end faces of the dielectric substrate 7 and the metal carrier 10, are thermally expanded and pressed against each other. and are fixed with a desired gap to prevent damage. Note that since the conductor ribbon 12 is easily bent in the vertical direction above this gap, there is no risk of damage due to heat.

However, with only such a structure, there is a large discontinuous part with a long connection distance between the ground conductor 4 and the ground conductor 9 (earth conductor 4 → metal carrier 5 → flat substrate 11 → metal carrier 10 → earth conductor 9). The connected transmission lines become mismatched, resulting in poor transmission characteristics. Therefore, in the past, various efforts have been made to match the circuits around the joints of the integrated circuit units 1 and 6.

However, the gap between the end faces of the integrated circuit unit 1 and the integrated circuit unit 6 is not constant due to errors caused by manufacturing and assembly precision. Therefore, there is a limit to the matching achieved by devising the circuit, and it has not been possible to obtain satisfactory matching characteristics over a particularly wide band.

(d) Purpose of the Invention In view of the above-mentioned conventional problems, the purpose of the present invention is to provide an integrated circuit unit with good matching characteristics by slidingly and electrically connecting the ground conductors of the transmission lines to be connected. The purpose is to provide a connection method.

(e) Structure of the Invention In order to achieve this object, the present invention provides a protrusion on the end face of the metal carrier at the bottom of the transmission line of one integrated circuit unit, which faces the other integrated circuit unit. A recess into which the protrusion is inserted is provided in the end face of the opposing metal carrier of the unit, and the upper surface of the protrusion is in close contact with the lower surface of the ground conductor formed on the lower surface of the dielectric substrate of the other integrated circuit unit. and a connection of the integrated circuit unit in which the upper surface of the protrusion and the lower surface of the ground conductor are brought into close contact with each other via a connecting piece made of a soft conductive material so as to further improve the electrical connection. It's a method.

(f) Embodiments of the Invention The present invention will be described in detail below with reference to illustrated embodiments. Note that the same reference numerals indicate the same objects throughout the figures.

FIG. 2 is an embodiment of the present invention, in which A is a perspective view of important parts in separated form, and B is a sectional view of the transmission line portion of A.

In the same figure, a rectangular plate-shaped metal carrier 13 of an integrated circuit unit 1 has a protrusion 14, which is rectangular in side view and extends in the direction of the strip line 3 in plan view, on the end face facing another integrated circuit unit 6 to be connected. It is being A foil-shaped connection piece 17 made of a soft conductive material (for example, indium, pure gold, conductive rubber, etc.) is attached to the upper surface of the protrusion 14.

A square plate-shaped metal carrier 1 of the integrated circuit unit 6 whose thickness is approximately equal to the thickness of the metal carrier 13.
Reference numeral 5 denotes an end face facing the integrated circuit unit 1, and a recess 16 into which the protrusion 14 is inserted is provided in the direction of the strip line 8. The depth of the recess 16 in the direction of the strip line 8 is desirably longer than the amount of protrusion of the protrusion 14.

The integrated circuit unit 1 and the integrated circuit unit 6 configured in this way are placed facing each other on the planar substrate 11 so that the gap 10 between the dielectric substrate 2 and the dielectric substrate 7 is approximately the desired gap. When fixed, the upper surface of the connecting piece 17 comes into close contact with the lower surface of the ground conductor 9 by pressure. Therefore, earth conductor 4→
Metal carrier 13 → connection piece 17 → earth conductor 9
electrically connected over a relatively short distance. Thereafter, the strip line 6 and the strip line 8 are connected by a conductor ribbon 12 as before.

It goes without saying that there are gaps between the metal carriers 13 and 15, and between the tip end face of the protrusion 14 and the end face of the recess 16, and as a result, even if the respective integrated circuit units 1 and 6 expand thermally, There is no damage due to pressure on each other, and the connection piece 17 and the ground conductor 9 only slip on their contact surfaces, so there is no adverse effect on the connection status.

Therefore, even if the above-mentioned gap and the gap 18 between the dielectric substrate 2 and the dielectric substrate 7 are not constant and vary due to precision errors in manufacturing and assembly, the transmission consisting of the strip line 3, dielectric substrate 2, and ground conductor 4 The transmission line made up of the strip line 8, the dielectric substrate 7, and the ground conductor 9 are connected with matching characteristics over a wide band in the microwave band to millimeter wave band.

It goes without saying that the connection method of the present invention is not limited to the connection of two integrated circuit units, but can also be applied to a plurality of integrated circuit units, such as three or four.

(g) Effects of the Invention As explained above, the present invention allows transmission lines between integrated circuit units operating in the microwave band to millimeter wave band to be easily established, regardless of the accuracy of manufacturing and assembly. In addition, it is a method of connecting integrated circuit units that is low in cost and has excellent practical effects such as connection with good matching characteristics.

[Brief explanation of drawings]

Fig. 1 is a sectional view of an integrated circuit unit showing a conventional connection method, Fig. 2 is an embodiment of the present invention, A is a perspective view of important parts of a part of the integrated circuit unit separated, and B is a perspective view of important parts of the integrated circuit unit. FIG. In the figure, 1 and 6 are integrated circuit units, 2 and 7 are dielectric substrates, 3 and 8 are strip lines, 4 and 9 are ground conductors, 5, 10, 13, and 15 are metal carriers, 14 is a protrusion, and 16 is a recess. , 17 is a connecting piece, 1
2 is a conductor ribbon, and 11 is a flat substrate.

Claims (1)

[Scope of Claims] 1. Microwave band to millimeter integrated circuit in which an integrated circuit is formed on a dielectric substrate provided on the upper surface of a metal carrier, and a transmission path is provided to connect to another integrated circuit coupled to the integrated circuit. When arranging and connecting multiple waveband integrated circuit units on the same plane base,
A protrusion is provided on the end face of the metal carrier at the bottom of the transmission path of one of the integrated circuit units facing the other integrated circuit unit, and the protrusion is inserted into the end face of the opposing metal carrier of the other integrated circuit unit. A method for connecting integrated circuit units, characterized in that a recess is provided, and the upper surface of the protrusion is brought into close contact with the lower surface of a ground conductor formed on the lower surface of a dielectric substrate of the other integrated circuit unit. 2. Claim 1, characterized in that the upper surface of the protrusion and the lower surface of the ground conductor are brought into close contact via a connecting piece made of a soft conductive material.
How to connect the integrated circuit unit described in Section.