JPH038095B2 - - Google Patents
Info
- Publication number
- JPH038095B2 JPH038095B2 JP29567585A JP29567585A JPH038095B2 JP H038095 B2 JPH038095 B2 JP H038095B2 JP 29567585 A JP29567585 A JP 29567585A JP 29567585 A JP29567585 A JP 29567585A JP H038095 B2 JPH038095 B2 JP H038095B2
- Authority
- JP
- Japan
- Prior art keywords
- exterior material
- electronic component
- electrolytic capacitor
- leads
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 36
- 239000002390 adhesive tape Substances 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 description 32
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子部品の改良にかかり、特に、
外部接続用のリードが同一方向に導かれた電子部
品を表面実装に対応させる外装構造に関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to the improvement of electronic components, and in particular,
The present invention relates to an exterior structure for surface mounting of electronic components in which external connection leads are guided in the same direction.
近来、電子機器の小型軽量化、電子回路の高集
積化に伴い、電子部品のリードレス化の要請が高
まつている。
In recent years, as electronic devices have become smaller and lighter and electronic circuits have become more highly integrated, there has been an increasing demand for leadless electronic components.
従来の電子部品、例えば電解コンデンサをリー
ドレス化する場合、第２図に示したように、コン
デンサ素子２の外表面に熱硬化性合成樹脂からな
る樹脂層１２を被覆成形するとともに、コンデン
サ素子２から導いたリード１３を外部接続用の端
子１４に接続したものがあつた。 When making a conventional electronic component, such as an electrolytic capacitor, leadless, as shown in FIG. There was one in which the lead 13 led from the wire was connected to the terminal 14 for external connection.
しかし、従来例による場合、コンデンサ素子２
を熱硬化性の合成樹脂で被覆して樹脂層１２を形
成する工程が煩雑であるとともに、樹脂層１２を
被覆する際の成形熱によるコンデンサ素子２の熱
劣化を招いていた。
However, in the case of the conventional example, the capacitor element 2
The process of forming the resin layer 12 by coating the capacitor element 2 with a thermosetting synthetic resin is complicated, and also causes thermal deterioration of the capacitor element 2 due to molding heat during coating the resin layer 12.
また、コンデンサ素子２は、樹脂層１２によつ
て外部と遮断されるが、樹脂層１２と外部接続用
の端子１４との接合状態、または樹脂層１２自体
の接合状態によつては、内部の気密性が損なわ
れ、電解液の漏れ、外部の粉塵、水分の侵入によ
り、電気的特性に悪影響を及ぼす場合があつた。 The capacitor element 2 is isolated from the outside by the resin layer 12, but depending on the bonding state between the resin layer 12 and the external connection terminal 14, or the bonding state of the resin layer 12 itself, the internal Airtightness was impaired, and electrical characteristics were sometimes adversely affected due to electrolyte leakage, external dust, and moisture infiltration.
この発明は、従来の電子部品の構造を変更する
ことなく、リードレス化を実現することを目的と
している。 The present invention aims to realize leadless electronic components without changing the structure of conventional electronic components.
この発明は、外部接続用のリードが同一方向に
導かれた電子部品と、中心部に電子部品を収納し
得る凹状の収納部を備えた一体構造の合成樹脂か
らなる外装材とからなり、前記外装材の収納部に
電子部品を収納し、外装材の開口部に貼着テープ
を貼着して、前記電子部品を外装材の収納部に固
定するとともに、電子部品のリードの先端を外装
材の開口部縁部に当接させたことを特徴としてい
る。
This invention consists of an electronic component in which leads for external connection are guided in the same direction, and an exterior material made of synthetic resin having an integral structure and having a concave storage portion in the center that can store the electronic component. The electronic component is stored in the housing part of the exterior material, and the adhesive tape is pasted to the opening of the exterior material to fix the electronic component to the housing part of the exterior material, and the tip of the lead of the electronic component is attached to the exterior material. It is characterized by being brought into contact with the edge of the opening.
電子部品の端面には、一体構造の合成樹脂から
なる外装材の開口部端面がほぼ同一平面に位置す
ることになり、電子部品の自立を可能とし、いわ
ゆるフエイスボンデイング構造の基板に表面実装
することができる。また、素子から導かれたリー
ドは、外装材の開口部端面に当接するので、この
発明により得られた電子部品を基板に表面実装し
た場合、電子部品のリードと基板の配線とが当接
し、リフロー半田法等の手段により、電気的に接
続することが可能となる。
The end faces of the openings of the integral synthetic resin exterior material are located on almost the same plane, allowing the electronic parts to stand on their own, and allowing them to be surface-mounted on a board with a so-called face bonding structure. Can be done. Further, since the leads led from the element come into contact with the end face of the opening of the exterior material, when the electronic component obtained according to the present invention is surface mounted on a board, the leads of the electronic component and the wiring of the board come into contact with each other. Electrical connection can be achieved by means such as reflow soldering.
以下この発明の実施例を図面にしたがい説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.
第１図は、この発明の実施例を示した一部断面
図である。第３図は、実施例において使用する外
装材の外観形状および電子部品を収納した状態を
示す斜視図である。 FIG. 1 is a partially sectional view showing an embodiment of the present invention. FIG. 3 is a perspective view showing the external shape of the exterior material used in the example and the state in which electronic components are housed.
なお、実施例においては電解コンデンサを例に
とり説明する。 In the embodiment, an electrolytic capacitor will be explained as an example.
第１図において、一般の電解コンデンサ１は、
電極箔３と電解紙４とを巻回して形成したコンデ
ンサ素子２を、アルミニウム等からなる有底筒状
の外装ケース５に収納し、この外装ケース５の開
口部に弾性ゴム等からなる封口体６を装着した構
成からなる。また、リード８は、電極箔３と電気
的に接続され、コンデンサ素子２から導かれると
ともに封口体６を貫いて外部に突出している。更
に、外装ケース５の外表面には、塩化ビニール等
の合成樹脂からなるスリーブ７が被覆される。 In FIG. 1, a general electrolytic capacitor 1 is
A capacitor element 2 formed by winding an electrode foil 3 and an electrolytic paper 4 is housed in a bottomed cylindrical outer case 5 made of aluminum or the like, and a sealing body made of elastic rubber or the like is placed in the opening of the outer case 5. 6 is installed. Further, the lead 8 is electrically connected to the electrode foil 3, guided from the capacitor element 2, and protrudes to the outside through the sealing body 6. Further, the outer surface of the outer case 5 is covered with a sleeve 7 made of synthetic resin such as vinyl chloride.
このような電解コンデンサ１の外表面には、第
３図に示したような、外装材９が装着される。こ
の外装材９は、一体構造の合成樹脂からなり、中
止部に電解コンデンサ１を収納し得る凹状の収納
部１１を備えている。 An exterior material 9 as shown in FIG. 3 is attached to the outer surface of such an electrolytic capacitor 1. This exterior material 9 is made of synthetic resin and has a concave housing section 11 in which the electrolytic capacitor 1 can be housed.
この外装材９は、合成樹脂からなる連続帯１５
に熱処理を施して、連続帯１５の中心線上に円筒
状の凹状収納部１１を形成するとともに、隣接す
る凹部から、互いに等間隔の位置で切断して製造
する。なお、凹状収納部１１の内径寸法および縦
寸法は、電解コンデンサ１等の電子部品全体を収
納し得る寸法であればよい。 This exterior material 9 includes a continuous band 15 made of synthetic resin.
The continuous band 15 is heat-treated to form a cylindrical concave storage portion 11 on the center line of the continuous band 15, and the adjacent concave portions are cut at positions equidistant from each other. Note that the inner diameter dimension and vertical dimension of the concave storage portion 11 may be any size as long as the entire electronic component such as the electrolytic capacitor 1 can be accommodated therein.
外装材９は、電解コンデンサ１を収納部１１に
収納するとともに、外装材９の開口部には、粘着
テープ１０が貼着される。この粘着テープ１０
は、外装材９の開口端部および電解コンデンサ１
の端面に粘着し、電解コンデンサ１全体を収納部
１１の内部に固定する。 The exterior material 9 accommodates the electrolytic capacitor 1 in a housing portion 11, and an adhesive tape 10 is adhered to the opening of the exterior material 9. This adhesive tape 10
is the open end of the exterior material 9 and the electrolytic capacitor 1
, and fixes the entire electrolytic capacitor 1 inside the housing part 11.
電解コンデンサ１から導かれた複数のリード８
は、互いに反対方向に折り曲げられるようにして
外装材９の開口端部と当接している。このリード
８は、電解コンデンサ１を基板に搭載する際、基
板の導体部分と当接し、リフロー半田法等の手段
により、電解コンデンサ１と基板との電気的およ
び機械的接続を可能にする。 A plurality of leads 8 led from the electrolytic capacitor 1
are in contact with the open end of the exterior material 9 in such a way that they are bent in opposite directions. When the electrolytic capacitor 1 is mounted on the board, the lead 8 comes into contact with the conductor portion of the board, and enables electrical and mechanical connection between the electrolytic capacitor 1 and the board by means such as reflow soldering.
なお、この発明の実施例において使用する外装
材９は、単体でなくともよい。すなわち、第３図
に示したように、連続帯状に形成された複数の外
装材９に、連続的に電解コンデンサ１を供給し、
粘着テープ１０を外装材９の連続帯の中心線状に
沿つて接着させて、電解コンデンサ１を固定して
もよい。このように構成した場合、各個別の電解
コンデンサ１は、連続状に供給されるとともに、
基板に搭載する工程において個別に分離されるこ
とになる。したがつて、電解コンデンサ１の連続
的製造が容易になると同時に、基板に搭載する際
の自動化も容易になる。 Note that the exterior material 9 used in the embodiments of the present invention does not have to be a single piece. That is, as shown in FIG. 3, electrolytic capacitors 1 are continuously supplied to a plurality of exterior materials 9 formed in a continuous band shape,
The electrolytic capacitor 1 may be fixed by adhering the adhesive tape 10 along the center line of the continuous band of the exterior material 9. With this configuration, each individual electrolytic capacitor 1 is supplied in a continuous manner, and
They will be separated individually in the process of mounting them on the board. Therefore, it becomes easy to continuously manufacture the electrolytic capacitor 1, and at the same time, it becomes easy to automate the mounting on the board.
また、電解コンデンサ１から導かれたリード８
の先端を、外装材９の開口端部に当接させる際、
予め偏平状に加工してもよい。この場合、基板の
配線とリードとの接地面積が拡大するので、良好
な接続状態が期待でき、信頼性の向上が容易とな
る。 Also, the lead 8 led from the electrolytic capacitor 1
When bringing the tip of the holder into contact with the open end of the exterior material 9,
It may be processed into a flat shape in advance. In this case, since the ground area between the wiring on the board and the leads is increased, a good connection state can be expected, and reliability can be easily improved.
また、外装材９の開口端部および電解コンデン
サ１の端面に貼着される粘着テープ１０として両
面に接着剤が塗布されたものを用いた場合、基板
上での安定性が向上し、半田付け工程における電
解コンデンサ１の離脱、移動等を防ぐこともでき
る。 In addition, when adhesive tape 10 is applied to the open end of the exterior material 9 and the end face of the electrolytic capacitor 1 and is coated with adhesive on both sides, the stability on the board is improved, and the soldering It is also possible to prevent detachment, movement, etc. of the electrolytic capacitor 1 during the process.
また、この発明の実施例においては、電解コン
デンサを例に採り説明したが、この発明は、電解
コンデンサに限定されるものではなく、他のリー
ドを有する電子部品にも応用することができるこ
とは言うまでもない。 Further, in the embodiments of the present invention, an electrolytic capacitor was taken as an example for explanation, but it goes without saying that the present invention is not limited to electrolytic capacitors and can be applied to other electronic components having leads. stomach.
以上のように、この発明は、外部接続用のリー
ドが同一方向に導かれた電子部品と、中心部に電
子部品を収納し得る凹状の収納部を備えた一体構
造の合成樹脂からなる外装材とからなり、前記外
装材の収納部に電子部品を収納し、外装材の開口
部に粘着テープを貼着して、前記電子部品を外装
材の収納部に固定するとともに、電子部品のリー
ドの先端を外装材の開口部縁部に当接させたこと
を特徴としているので、外装材の開口端部が基板
表面と当接して電子部品の自立を可能にする。ま
た、電子部品から導かれたリードは、外装材の開
口端部と当接し、基板の配線と接触することにな
る。したがつて、従来の電子部品の構造を殆ど変
更することなく、その電子部品のリードレス化を
実現することができる。
As described above, the present invention provides an exterior material made of an integrated synthetic resin, which includes an electronic component in which external connection leads are guided in the same direction, and a concave storage portion in the center that can accommodate the electronic component. The electronic component is stored in the housing portion of the exterior material, and an adhesive tape is pasted to the opening of the exterior material to fix the electronic component to the housing portion of the exterior material, and the leads of the electronic component are fixed to the housing portion of the exterior material. Since the tip is brought into contact with the edge of the opening of the exterior material, the open end of the exterior material comes into contact with the surface of the board, allowing the electronic component to stand on its own. Further, the leads led from the electronic component come into contact with the open end of the exterior material and come into contact with the wiring on the board. Therefore, it is possible to make the electronic component leadless without changing the structure of the conventional electronic component.
また、電子部品を収納する外装材は、連続的加
工ができるので、リードレス型の電子部品を連続
的に製造することができるととにも、基板への連
続供給が容易となる。 Furthermore, since the exterior material that houses the electronic components can be continuously processed, leadless electronic components can be manufactured continuously, and it is easy to continuously supply the electronic components to the substrate.
また、外装材は、電子部品の外部全体を覆うの
で、外部の機械的ストレスを緩和し、電子部品の
信頼性を向上させることができる。 Moreover, since the exterior material covers the entire exterior of the electronic component, it is possible to alleviate external mechanical stress and improve the reliability of the electronic component.
以上のように、この発明は、従来の電子部品の
構造を殆ど変更することなくリードレス化を実現
した有益な発明である。 As described above, this invention is a useful invention that realizes leadless electronic components without changing the structure of conventional electronic components.
第１図は、この発明の実施例を示す一部断面
図、第２図は、従来のリードレス型の電解コンデ
ンサの構造を示す断面図、第３図は、この発明に
おいて使用する外装材の外観形状および電解コン
デンサを収納した状態を示す斜視図である。
１……電解コンデンサ、２……コンデンサ素
子、３……電極箔、４……電解紙、５……外装ケ
ース、６……封口体、７……スリーブ、８，１３
……リード、９……外装材、１０……粘着テー
プ、１１……収納部、１２……樹脂層、１４……
外部接続用端子。
FIG. 1 is a partial sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing the structure of a conventional leadless electrolytic capacitor, and FIG. 3 is a partial sectional view showing the structure of a conventional leadless electrolytic capacitor. FIG. 3 is a perspective view showing the external shape and the state in which the electrolytic capacitor is housed. DESCRIPTION OF SYMBOLS 1... Electrolytic capacitor, 2... Capacitor element, 3... Electrode foil, 4... Electrolytic paper, 5... Exterior case, 6... Sealing body, 7... Sleeve, 8, 13
... Lead, 9 ... Exterior material, 10 ... Adhesive tape, 11 ... Storage section, 12 ... Resin layer, 14 ...
Terminal for external connection.
Claims (1)
子部品と、中心部に電子部品を収納し得る凹状の
収納部を備えた一体構造の合成樹脂からなる外装
材とからなり、前記外装材の収納部に電子部品を
収納し、外装材の開口部に粘着テープを貼着し
て、前記電子部品を外装材の収納部に固定すると
ともに、電子部品のリードの先端を外装材の開口
部縁部に当接させたことを特徴とする電子部品。1 Consists of an electronic component with leads for external connection guided in the same direction, and an exterior material made of a synthetic resin with an integral structure and a concave storage part in the center that can accommodate the electronic component, and the exterior material Store the electronic component in the housing, attach adhesive tape to the opening of the exterior material, fix the electronic component to the housing of the exterior material, and attach the tip of the lead of the electronic component to the edge of the opening of the exterior material. An electronic component characterized by being brought into contact with the part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29567585A JPS62155507A (en) | 1985-12-27 | 1985-12-27 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29567585A JPS62155507A (en) | 1985-12-27 | 1985-12-27 | Electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62155507A JPS62155507A (en) | 1987-07-10 |
| JPH038095B2 true JPH038095B2 (en) | 1991-02-05 |
Family
ID=17823730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29567585A Granted JPS62155507A (en) | 1985-12-27 | 1985-12-27 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62155507A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6228893B2 (en) * | 2014-05-28 | 2017-11-08 | 新電元工業株式会社 | Mounting structure and mounting method |
-
1985
- 1985-12-27 JP JP29567585A patent/JPS62155507A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62155507A (en) | 1987-07-10 |
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