JPH0381602U - - Google Patents
Info
- Publication number
- JPH0381602U JPH0381602U JP14297589U JP14297589U JPH0381602U JP H0381602 U JPH0381602 U JP H0381602U JP 14297589 U JP14297589 U JP 14297589U JP 14297589 U JP14297589 U JP 14297589U JP H0381602 U JPH0381602 U JP H0381602U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- insulating film
- resistant insulating
- pair
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は考案の実施例を示し第１図Ａはこの考
案を適用したチツプ電子部品の平面図、第１図Ｂ
は断面図、第２図は考案の他の実施例を示し第２
図Ａはこの考案を適用したチツプ電子部品の平面
図、第２図Ｂは断面図、第３図はプリント基板へ
の実装例を示す図である。
１，７……耐熱性絶縁フイルム、２，８，９…
…銅箔被膜、３，１０……回路素子被膜、４，１
１……保護被膜、５，１２，１４……ニツケル・
メツキ被膜、６，１３，１５……半田メツキ被膜
、１６……スルーホール。
Figure 1 shows an embodiment of the invention, Figure 1A is a plan view of a chip electronic component to which this invention is applied, and Figure 1B.
2 is a sectional view, and FIG. 2 shows another embodiment of the invention.
Figure A is a plan view of a chip electronic component to which this invention is applied, Figure 2B is a sectional view, and Figure 3 is a diagram showing an example of mounting on a printed circuit board. 1, 7... Heat resistant insulating film, 2, 8, 9...
...Copper foil coating, 3,10...Circuit element coating, 4,1
1...Protective film, 5, 12, 14...Nickel.
Plating film, 6, 13, 15...Solder plating film, 16...Through hole.
Claims (1)
ム上に形成された一対の電極と、上記耐熱性絶縁
フイルム上に形成され且つ上記一対の電極間を導
通する回路素子被膜と、この回路素子被膜上を覆
つて上記回路素子被膜を保護する保護被膜とを具
備したことを特徴とするチツプ電子部品。 A heat-resistant insulating film, a pair of electrodes formed on the heat-resistant insulating film, a circuit element coating formed on the heat-resistant insulating film and conductive between the pair of electrodes, and a circuit element coating formed on the heat-resistant insulating film that conducts between the pair of electrodes. A chip electronic component characterized by comprising a protective film that covers and protects the circuit element film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14297589U JPH0381602U (en) | 1989-12-11 | 1989-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14297589U JPH0381602U (en) | 1989-12-11 | 1989-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381602U true JPH0381602U (en) | 1991-08-21 |
Family
ID=31689778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14297589U Pending JPH0381602U (en) | 1989-12-11 | 1989-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381602U (en) |
-
1989
- 1989-12-11 JP JP14297589U patent/JPH0381602U/ja active Pending
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