JPS63201399U - - Google Patents
Info
- Publication number
- JPS63201399U JPS63201399U JP9321387U JP9321387U JPS63201399U JP S63201399 U JPS63201399 U JP S63201399U JP 9321387 U JP9321387 U JP 9321387U JP 9321387 U JP9321387 U JP 9321387U JP S63201399 U JPS63201399 U JP S63201399U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- shield coating
- board according
- coating portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図乃至第３図は本考案プリント配線板の実
施例を示すもので、第１図はチツプ部品実装前の
要部の平面図、第２図は第１図Ａ−Ａ断面図、第
３図はチツプ部品を実装した状態の断面図である
。
１…プリント配線板、２……絶縁基板、３……
回路パターン、４……チツプ部品、５，６……接
合ランド部、７……アンダーレジスト、８……放
熱性を有するシールド被膜、９……オーバーコー
ト、１０，１１……半田付け部。
1 to 3 show an embodiment of the printed wiring board of the present invention, in which FIG. 1 is a plan view of the main part before chip components are mounted, FIG. 2 is a sectional view taken along line A-A in FIG. FIG. 3 is a cross-sectional view of a state in which chip components are mounted. 1...Printed wiring board, 2...Insulating board, 3...
Circuit pattern, 4... Chip component, 5, 6... Bonding land portion, 7... Under resist, 8... Shield coating having heat dissipation properties, 9... Overcoat, 10, 11... Soldering portion.
Claims (1)
プリント配線板において、 前記回路パターンのチツプ接合部を囲繞する放
熱性を有するシールド被膜部を被着することによ
り構成したことを特徴とするプリント配線板。 (2) 前記シールド被膜部は放熱性を有する電磁
波シールド性を有する鉄、ニツケル、銅、亜鉛、
金、銀、アルミニユーム等金属ペーストあるいは
これらの金属の数種の合金ペーストを被着して成
る実用新案登録請求の範囲第１項記載のプリント
配線板。 (3) 前記シールド被膜部は、アンダーレジスト
を介層して成る実用新案登録請求の範囲第１項記
載のプリント配線板。 (4) 前記シールド被膜部は、レジスト被膜に被
覆して成る実用新案登録請求の範囲第１項記載の
プリント配線板。[Scope of Claim for Utility Model Registration] (1) A printed wiring board consisting of a circuit pattern and a chip component mounted thereon, which is constructed by depositing a shield coating portion having heat dissipation properties that surrounds the chip joint portion of the circuit pattern. A printed wiring board characterized by: (2) The shield coating part is made of iron, nickel, copper, zinc,
The printed wiring board according to claim 1, which is coated with a metal paste such as gold, silver, or aluminum, or an alloy paste of several of these metals. (3) The printed wiring board according to claim 1, wherein the shield coating portion is formed by interposing an under resist. (4) The printed wiring board according to claim 1, wherein the shield coating portion is coated with a resist coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321387U JPS63201399U (en) | 1987-06-17 | 1987-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321387U JPS63201399U (en) | 1987-06-17 | 1987-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201399U true JPS63201399U (en) | 1988-12-26 |
Family
ID=30955602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9321387U Pending JPS63201399U (en) | 1987-06-17 | 1987-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201399U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5411967A (en) * | 1977-06-30 | 1979-01-29 | Fuji Photo Film Co Ltd | Method of controlling extruder |
| JPS5936921U (en) * | 1982-08-31 | 1984-03-08 | 株式会社クボタ | Elevation control float for rice transplanter |
| JPS6077499A (en) * | 1983-10-05 | 1985-05-02 | 富士通株式会社 | Wiring structure of high frequency device |
| JPS6247200B2 (en) * | 1981-03-19 | 1987-10-06 | Fujisawa Pharmaceutical Co | |
| JPS62272599A (en) * | 1986-05-21 | 1987-11-26 | 株式会社日立製作所 | electronic equipment |
-
1987
- 1987-06-17 JP JP9321387U patent/JPS63201399U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5411967A (en) * | 1977-06-30 | 1979-01-29 | Fuji Photo Film Co Ltd | Method of controlling extruder |
| JPS6247200B2 (en) * | 1981-03-19 | 1987-10-06 | Fujisawa Pharmaceutical Co | |
| JPS5936921U (en) * | 1982-08-31 | 1984-03-08 | 株式会社クボタ | Elevation control float for rice transplanter |
| JPS6077499A (en) * | 1983-10-05 | 1985-05-02 | 富士通株式会社 | Wiring structure of high frequency device |
| JPS62272599A (en) * | 1986-05-21 | 1987-11-26 | 株式会社日立製作所 | electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63201399U (en) | ||
| JPS63201398U (en) | ||
| JPS63201400U (en) | ||
| JPS58103163U (en) | Circuit board with components attached | |
| JPH0189723U (en) | ||
| JPS5825056U (en) | printed circuit board | |
| JPH0381602U (en) | ||
| JPS5815384U (en) | printed wiring body | |
| JPS5822738U (en) | circuit board | |
| JPS63197326U (en) | ||
| JPH0379440U (en) | ||
| JPS62199955U (en) | ||
| JPH03112971U (en) | ||
| JPH03128967U (en) | ||
| JPH0221777U (en) | ||
| JPH0379469U (en) | ||
| JPH0348265U (en) | ||
| JPS62120380U (en) | ||
| JPH0395663U (en) | ||
| JPH0361336U (en) | ||
| JPS624174U (en) | ||
| JPH0195796U (en) | ||
| JPS61123568U (en) | ||
| JPH02136351U (en) | ||
| JPH02106865U (en) |