JPH0381632U - - Google Patents
Info
- Publication number
- JPH0381632U JPH0381632U JP1989141552U JP14155289U JPH0381632U JP H0381632 U JPH0381632 U JP H0381632U JP 1989141552 U JP1989141552 U JP 1989141552U JP 14155289 U JP14155289 U JP 14155289U JP H0381632 U JPH0381632 U JP H0381632U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- electrodes
- electrode surface
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
Landscapes
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第５図はこの考案の一実施例を示し、
第１図はＩＣチツプの接続構造の完成状態を示す
断面図、第２図はＩＣチツプを回路基板上に位置
決めした状態の断面図、第３図はＩＣチツプと回
路基板の間に封止樹脂を注入した状態の断面図、
第４図は回路基板の上方より紫外線を照射した状
態の断面図、第５図は回路基板の下方より紫外線
を照射した状態の断面図である。
１……ＩＣチツプ、２……回路基板、３……バ
ンプ電極、４……パツト電極、６……封止樹脂。
Figures 1 to 5 show an embodiment of this invention,
Figure 1 is a cross-sectional view showing the completed state of the IC chip connection structure, Figure 2 is a cross-sectional view of the IC chip positioned on the circuit board, and Figure 3 is a sealing resin between the IC chip and the circuit board. A cross-sectional view of the injected state,
FIG. 4 is a sectional view of the circuit board with ultraviolet rays irradiated from above, and FIG. 5 is a sectional view of the circuit board with ultraviolet rays irradiated from below. 1... IC chip, 2... Circuit board, 3... Bump electrode, 4... Pad electrode, 6... Sealing resin.
Claims (1)
接続電極が設けられ、かつこの接続電極によつて
囲まれた領域内に減圧孔が形成された基板と、 前記電子部品の電極面と前記基板の接続電極面
との間を負圧にした状態で前記電子部品の周縁部
および前記基板の減圧孔部分を密封状態に覆う封
止樹脂と、 からなる電子部品の接続構造。[Claims for Utility Model Registration] An electronic component provided with a plurality of electrodes, a plurality of connection electrodes corresponding to the electrodes of the electronic component, and a reduced pressure in an area surrounded by the connection electrodes. a substrate in which a hole is formed, and a seal that seals a peripheral portion of the electronic component and a depressurization hole portion of the substrate while maintaining a negative pressure between an electrode surface of the electronic component and a connecting electrode surface of the substrate. Connection structure for electronic components consisting of adhesive resin and .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989141552U JPH0381632U (en) | 1989-12-08 | 1989-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989141552U JPH0381632U (en) | 1989-12-08 | 1989-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381632U true JPH0381632U (en) | 1991-08-21 |
Family
ID=31688436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989141552U Pending JPH0381632U (en) | 1989-12-08 | 1989-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381632U (en) |
-
1989
- 1989-12-08 JP JP1989141552U patent/JPH0381632U/ja active Pending
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