JPH038496U - - Google Patents
Info
- Publication number
- JPH038496U JPH038496U JP6779789U JP6779789U JPH038496U JP H038496 U JPH038496 U JP H038496U JP 6779789 U JP6779789 U JP 6779789U JP 6779789 U JP6779789 U JP 6779789U JP H038496 U JPH038496 U JP H038496U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- brought
- close contact
- side plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の実施例の分離した形で示す斜
視図、第２図は本考案の実施例の平面図、第３図
は従来例の図で、ａは分離した形で示す斜視図、
ｂは平面図である。
図において、１は印刷配線板、２は半導体部品
、３，３０は遮蔽板、５は筐体、６は放熱板、７
−１，７−２は間隔柱、８−１，８−２は小ねじ
、１０はＬ形金具、１０ａはねじ孔、１１は小ね
じ、１５は放熱体、１５ａは放熱フイン、３０Ａ
は折曲側板、３０ａは孔をそれぞれ示す。
Fig. 1 is a perspective view of an embodiment of the present invention shown in separated form, Fig. 2 is a plan view of the embodiment of the present invention, Fig. 3 is a view of a conventional example, and a is a perspective view shown in separated form. ,
b is a plan view. In the figure, 1 is a printed wiring board, 2 is a semiconductor component, 3 and 30 are shielding plates, 5 is a housing, 6 is a heat sink, and 7
-1, 7-2 are spacing columns, 8-1, 8-2 are machine screws, 10 is an L-shaped fitting, 10a is a screw hole, 11 is a machine screw, 15 is a heat sink, 15a is a heat sink, 30A
indicates a bent side plate, and 30a indicates a hole.
Claims (1)
着した印刷配線板装置において、 Ｌ形金具１０の一方の側板部を、該印刷配線板
１に搭載した半導体部品２のパツケージの面に密
着させ、他方の側板部を該遮蔽板３０に密着させ
たことを特徴とする印刷配線板装置の放熱構造。[Scope of Claim for Utility Model Registration] In a printed wiring board device in which a shielding plate 30 is attached to a printed wiring board 1 via a spacing post, one side plate portion of an L-shaped fitting 10 is mounted on the printed wiring board 1. A heat dissipation structure for a printed wiring board device, characterized in that the semiconductor component 2 is brought into close contact with the surface of the package, and the other side plate is brought into close contact with the shielding plate 30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989067797U JPH0727679Y2 (en) | 1989-06-09 | 1989-06-09 | Printed wiring board equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989067797U JPH0727679Y2 (en) | 1989-06-09 | 1989-06-09 | Printed wiring board equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH038496U true JPH038496U (en) | 1991-01-28 |
| JPH0727679Y2 JPH0727679Y2 (en) | 1995-06-21 |
Family
ID=31601691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989067797U Expired - Lifetime JPH0727679Y2 (en) | 1989-06-09 | 1989-06-09 | Printed wiring board equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727679Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63170958U (en) * | 1987-04-24 | 1988-11-07 |
-
1989
- 1989-06-09 JP JP1989067797U patent/JPH0727679Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63170958U (en) * | 1987-04-24 | 1988-11-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727679Y2 (en) | 1995-06-21 |