JPH0385652U - - Google Patents

Info

Publication number
JPH0385652U
JPH0385652U JP1989147035U JP14703589U JPH0385652U JP H0385652 U JPH0385652 U JP H0385652U JP 1989147035 U JP1989147035 U JP 1989147035U JP 14703589 U JP14703589 U JP 14703589U JP H0385652 U JPH0385652 U JP H0385652U
Authority
JP
Japan
Prior art keywords
integrated circuit
heat dissipation
shaft
cooling structure
dissipation fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989147035U
Other languages
Japanese (ja)
Other versions
JPH0648863Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989147035U priority Critical patent/JPH0648863Y2/en
Publication of JPH0385652U publication Critical patent/JPH0385652U/ja
Application granted granted Critical
Publication of JPH0648863Y2 publication Critical patent/JPH0648863Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第一の実施例を示す図であり
、第２図は本考案の第二の実施例を示す図であり
、第３図は従来の構造を示す図である。 図において、１……基板、２……集積回路、４
……伝熱板、６……低融点金属、７……放熱フイ
ン、７ａ……軸、９……モジユール、をそれぞれ
示す。 FIG. 1 is a diagram showing a first embodiment of the present invention, FIG. 2 is a diagram showing a second embodiment of the present invention, and FIG. 3 is a diagram showing a conventional structure. In the figure, 1...Substrate, 2...Integrated circuit, 4
. . . heat transfer plate, 6 . . . low melting point metal, 7 . . . heat dissipation fin, 7 a .

Claims (1)

【実用新案登録請求の範囲】 基板１上に実装された集積回路２を有するモジ
ユール９の放熱面側に伝熱板４を介して放熱フイ
ン７が立植してなる集積回路の冷却構造において
、 前記集積回路２の直上に前記放熱フイン７の軸
７ａを位置決めし、該軸７ａと前記伝熱板４とが
接する部分を熱伝導性に優れた低融点金属６にて
接続したことを特徴とする集積回路の冷却構造。[Claims for Utility Model Registration] In an integrated circuit cooling structure in which a heat dissipation fin 7 is installed on the heat dissipation surface side of a module 9 having an integrated circuit 2 mounted on a substrate 1 via a heat transfer plate 4, The shaft 7a of the heat dissipation fin 7 is positioned directly above the integrated circuit 2, and the portion where the shaft 7a and the heat exchanger plate 4 are in contact is connected with a low melting point metal 6 having excellent thermal conductivity. cooling structure for integrated circuits.
JP1989147035U 1989-12-22 1989-12-22 Integrated circuit cooling structure Expired - Lifetime JPH0648863Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147035U JPH0648863Y2 (en) 1989-12-22 1989-12-22 Integrated circuit cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147035U JPH0648863Y2 (en) 1989-12-22 1989-12-22 Integrated circuit cooling structure

Publications (2)

Publication Number Publication Date
JPH0385652U true JPH0385652U (en) 1991-08-29
JPH0648863Y2 JPH0648863Y2 (en) 1994-12-12

Family

ID=31693568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147035U Expired - Lifetime JPH0648863Y2 (en) 1989-12-22 1989-12-22 Integrated circuit cooling structure

Country Status (1)

Country Link
JP (1) JPH0648863Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093187A1 (en) * 2003-04-16 2004-10-28 Fujitsu Limited Electronic component package, electronic component package assembly and printed board unit
JP2009048783A (en) * 2007-08-13 2009-03-05 Sobo Yu Automatic disconnecting structure of switch

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093187A1 (en) * 2003-04-16 2004-10-28 Fujitsu Limited Electronic component package, electronic component package assembly and printed board unit
JP2009048783A (en) * 2007-08-13 2009-03-05 Sobo Yu Automatic disconnecting structure of switch

Also Published As

Publication number Publication date
JPH0648863Y2 (en) 1994-12-12

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