JPH0386501A - Ceramic sheet manufacturing method - Google Patents

Ceramic sheet manufacturing method

Info

Publication number
JPH0386501A
JPH0386501A JP1221738A JP22173889A JPH0386501A JP H0386501 A JPH0386501 A JP H0386501A JP 1221738 A JP1221738 A JP 1221738A JP 22173889 A JP22173889 A JP 22173889A JP H0386501 A JPH0386501 A JP H0386501A
Authority
JP
Japan
Prior art keywords
ceramic sheet
sheet
ceramic
protrusion
firing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1221738A
Other languages
Japanese (ja)
Other versions
JP2727470B2 (en
Inventor
Takehiko Yoneda
米田 毅彦
Takuya Fujimaru
藤丸 琢也
Takaharu Nagae
隆治 永江
Hiromitsu Tagi
多木 宏光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1221738A priority Critical patent/JP2727470B2/en
Publication of JPH0386501A publication Critical patent/JPH0386501A/en
Application granted granted Critical
Publication of JP2727470B2 publication Critical patent/JP2727470B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding

Landscapes

  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Abstract

PURPOSE:To enable easily molding by lessening a forming distortion, crack and flaw, by a method wherein at the time of blanking of a ceramic sheet prior to firing, a recessed part and protrusion are formed respectively in one side and the opposite side at the same time. CONSTITUTION:A ceramic sheet 1 prior to firing is set up onto a lower die 2. An upper die 3 is lowered, a blanking pin 4 encroaches upon to a fixed depth and the lowering is stopped under a state where the ceramic sheet 1 is not blanked completely. A recessed part 1a and protrusion 1b are formed respectively in one side and the opposite side of the ceramic sheet 1 after molding. Although the protrusion 1b is removed in the case of unnecessity and firing for unification is performed as the protrusion is left behind in the case of necessity, in the ceramic sheet 1 made in this manner, since density of the sheet is almost uniform, the sheet 1 becomes a completed product without generating a form distortion, crack and flaw.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、セラミックケース、電子部品用回路基板など
に利用可能なセラミックシートの製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a ceramic sheet that can be used for ceramic cases, circuit boards for electronic components, and the like.

(従来の技術) 従来、セラミック基板上に凹部、凸部を形成させるため
に、ケミカルエツチング法、積層法、または乾式プレス
法等が利用されていた。
(Prior Art) Conventionally, a chemical etching method, a lamination method, a dry pressing method, etc. have been used to form concave portions and convex portions on a ceramic substrate.

前記積層法については1例えば特開昭48−55906
号公報に記載がある。
Regarding the lamination method, see 1, for example, JP-A-48-55906.
There is a description in the bulletin.

第2図(a)〜(c)は従来のケミカルエツチング法に
よるセラミックシート製造方法の工程を説明するための
断面図である。第2図(a)において、まず焼成後のセ
ラミック基板20上の所定の場所にマスキング材21を
塗布する。第2図(b)において、エツチング液にてエ
ツチングし、マスキング材21部分以外にセラミック基
板20は凹部22を形成する。
FIGS. 2(a) to 2(c) are cross-sectional views for explaining the steps of a conventional method for manufacturing a ceramic sheet using a chemical etching method. In FIG. 2(a), first, a masking material 21 is applied to a predetermined location on the ceramic substrate 20 after firing. In FIG. 2(b), the ceramic substrate 20 is etched with an etching solution to form recesses 22 in areas other than the masking material 21.

第2図(c)において、マスキング材21を除去し、完
成品とする。
In FIG. 2(c), the masking material 21 is removed to form a finished product.

第3図は従来の積層法によるセラミックシート製造方法
の説明図である。同図し;おいて、焼成前のセラミック
シート30と任意の位置を打ち抜いたセラミックシート
31とを張り合わせ、ホットプレス装置32によりホッ
トプレス(矢印の加圧方向)し、両セラミックシート3
0.31を一体化した後、焼成して完成品を得る。
FIG. 3 is an explanatory diagram of a conventional method for manufacturing a ceramic sheet using a lamination method. In the same figure, the ceramic sheet 30 before firing and the ceramic sheet 31 punched out at an arbitrary position are pasted together, hot pressed (in the pressing direction of the arrow) by a hot press device 32, and both ceramic sheets 31
After integrating 0.31, it is fired to obtain a finished product.

第4図は従来の乾式プレス法によるセラミックシート製
造方法の説明図である。同図において。
FIG. 4 is an explanatory diagram of a method of manufacturing a ceramic sheet using a conventional dry press method. In the same figure.

成型金型として上パンチ40と下バンチ41を用い、セ
ラミックシートを成形する粒粉体42を前記上バンチ4
0と下パンチ41間の所定の位置に充填後、加圧成型を
行って成型体を作製し、この成型体を焼成することによ
り完成品を得る。
Using an upper punch 40 and a lower bunch 41 as a molding die, a granular powder 42 for forming a ceramic sheet is placed in the upper bunch 4.
After filling a predetermined position between the 0 and the lower punch 41, pressure molding is performed to produce a molded body, and this molded body is fired to obtain a finished product.

(発明が解決しようとする課題) しかし前記ケミカルエツチング法では、セラミックの種
類によってエツチング液を選択しなくてはならず、さら
にアルミナセラミック、4窒化ケイ素セラミツク、炭化
チタンセラミック、ジルコニアセラミックなどの化学的
に非常に安定なセラミックに対して、このケミカルエツ
チング法は量産性に欠けるという問題がある。
(Problems to be Solved by the Invention) However, in the chemical etching method, the etching solution must be selected depending on the type of ceramic. Although ceramics are extremely stable, this chemical etching method has a problem in that it lacks mass productivity.

また前記積層法では、ホットプレス時の凹部と凸部の周
辺に加わる圧力が不均一となり、シート密度の異なる部
分が形成され、焼成時に形状歪み。
In addition, in the lamination method, the pressure applied around the concave and convex portions during hot pressing becomes uneven, forming parts with different sheet densities, and causing shape distortion during firing.

クラック、ひびが発生するという問題がある。There is a problem that cracks occur.

また前記乾式プレス法では、セラミックを形成する粒粉
体42のサイズ(一般には100〜300.)の限界の
ため、金型充填が不可能な形状領域がある。
Further, in the dry pressing method, there are shape regions in which mold filling is impossible due to a limit in the size (generally 100 to 300 mm) of the granular powder 42 forming the ceramic.

例えば、成型体の肉厚の下限界は0.5〜0.8■であ
る。さらに、大型平板基板の場合、成型圧力が400〜
1500kg/dの時、103角で40〜150tの総
圧力が必要であり、大型になればなる程、成型機上の制
約が発生するし、平板状基板の全体に均一な圧力を加え
ることが、金型平行度と前記粒粉体42の均一充填との
問題を考えると、著しく困難であるという問題がある。
For example, the lower limit of the wall thickness of the molded body is 0.5 to 0.8 . Furthermore, in the case of large flat substrates, the molding pressure is 400~
At 1500 kg/d, a total pressure of 40 to 150 tons is required for 103 squares, and the larger the size, the more restrictions there will be on the molding machine, and it is difficult to apply uniform pressure to the entire flat substrate. However, considering the problems of mold parallelism and uniform filling of the granular powder 42, there is a problem that it is extremely difficult.

また単にセラミックシートに凹部のみを形成すると、セ
ラミックシートの凹部は潰されて形成されることになり
、シート密度が変化し、焼成時の形状歪み、クラック、
ひびの発生の原因になるという問題がある。
Furthermore, if only the recesses are formed in the ceramic sheet, the recesses in the ceramic sheet will be crushed and formed, which will change the sheet density and cause shape distortion, cracks, etc. during firing.
There is a problem in that it causes cracks to form.

本発明の目的は、形成歪み、クラック、ひびの発生が少
なく、かつ簡単に成型できるセラミックシートの製造方
法を提供することにある。
An object of the present invention is to provide a method for producing a ceramic sheet that is less prone to forming distortions, cracks, and cracks and can be easily molded.

(課題を解決するための手段) 上記目的を解決するため、本発明は、焼成前のセラミッ
クシートを所定の構造に打ち抜く時に、完全に打ち抜か
ず、任意の深さを持つ凹部を形成した時点で打ち抜き動
作を終了させることにより、セラミックシート上の一方
側に凹部を、また反対側に凸部を同時に形成するように
し、その後、前記セラミックシートを焼成一体化させる
ことを特徴とし、また必要によって前記凸部を除去した
後、セラミックシートを焼成一体化させることを特徴と
する。
(Means for Solving the Problem) In order to solve the above object, the present invention provides that when punching a pre-fired ceramic sheet into a predetermined structure, the punching is not completed completely, but after forming a recessed portion having an arbitrary depth. By finishing the punching operation, a concave portion is simultaneously formed on one side of the ceramic sheet, and a convex portion is formed on the opposite side, and then the ceramic sheet is fired and integrated, and if necessary, the above-mentioned The method is characterized in that after the protrusions are removed, the ceramic sheets are fired and integrated.

(作 用) 上記手段を採用したため、セラミックシート化が可能な
ものに対して、簡単に行える打ち抜き方法によって、焼
成前のセラミックシートに対する打ち抜き時に、一方側
に凹部を、また反対側に凸部を同時に形成することによ
り、凹部と凸部の周辺の圧力は略均−で、シート密度が
略均−となり。
(Function) By employing the above means, it is possible to form recesses on one side and protrusions on the opposite side when punching a ceramic sheet before firing, using an easily performed punching method for objects that can be made into ceramic sheets. By forming the sheets at the same time, the pressure around the concave portions and convex portions is approximately equal, and the sheet density is approximately equal.

焼成時の形状歪み、クラック、ひびの発生が少なくなる
Shape distortion, cracks, and crazing during firing are reduced.

(実施例) 以下1本発明の実施例を図面に基づいて説明する。(Example) An embodiment of the present invention will be described below based on the drawings.

第1図(a)〜(c)は本発明によるセラミックシート
の製造方法の一実施例の工程を説明するための断面図で
あって、1はセラミックシート、1aはセラミックシー
トlの凹部、tbはセラミックシート1の凸部、2は打
ち抜き金型の下部金型、3は打ち抜き金型の上部金型、
4は上部金型3に突設させた打ち抜きピンである。
FIGS. 1(a) to 1(c) are cross-sectional views for explaining the steps of an embodiment of the method for manufacturing a ceramic sheet according to the present invention, in which 1 is a ceramic sheet, 1a is a concave portion of ceramic sheet l, tb is a convex portion of ceramic sheet 1, 2 is a lower die of a punching die, 3 is an upper die of a punching die,
4 is a punching pin protruding from the upper mold 3.

本実施例において、セラミックとして96%アルミナを
使用する。また焼成前のセラミックシート1としては、
前記96%アルミナに1分散媒体としてI、P、A、(
イソ、プロピル、アルコール)、トルエンを、また可塑
剤としてり、B、P、(ジ、ブチル。
In this example, 96% alumina is used as the ceramic. Moreover, as the ceramic sheet 1 before firing,
In the 96% alumina, I, P, A, (
iso, propyl, alcohol), toluene as a plasticizer, B, P, (di, butyl).

フタレート)を、また結合剤としてP、V、B、(ポリ
、ビニル、ブチラール)を加え、これらを十分ミキシン
グした後、ドクターブレード法により、厚さLm、幅L
OOOm、長100mの有機溶剤系のシートを作製し、
使用した。
phthalate) and P, V, B, (poly, vinyl, butyral) as a binder, and after thoroughly mixing these, use the doctor blade method to form a sheet with a thickness of Lm and a width of L.
OOOm, an organic solvent-based sheet with a length of 100 m was prepared,
used.

第1図(a)において、焼成前のセラミックシート1を
下部金型2上にセットする。第1図(b)において、上
部金型3を下降させ、打ち抜きピン4がセラミックシー
ト1の所定の深さまで喰い込み。
In FIG. 1(a), a ceramic sheet 1 before firing is set on a lower mold 2. As shown in FIG. In FIG. 1(b), the upper mold 3 is lowered and the punching pins 4 bite into the ceramic sheet 1 to a predetermined depth.

完全に打ち抜かない状態で下降を停止させる。第1図(
c)において、成型機のセラミックシート1には、一方
便に凹部1aが、また反対側には凸部1bが同時に形成
されることになる。
Stop the descent without completely punching out. Figure 1 (
In c), the ceramic sheet 1 of the molding machine is simultaneously formed with concave portions 1a on one side and convex portions 1b on the opposite side.

前記打ち抜きビン4による凹部1a、凸部1bの形成時
、凹部1aと凸部1bの形成部分への圧力は下方向に逃
げるため略均−となり、凹部1aと凸部1bの形成部品
のシート密度はほとんど変化しない。
When forming the concave portions 1a and convex portions 1b using the punched bottle 4, the pressure on the forming portions of the concave portions 1a and convex portions 1b escapes downward, so that the pressure becomes approximately equal, and the sheet density of the parts forming the concave portions 1a and convex portions 1b increases. remains almost unchanged.

また凹部1aと凸部1bの形成部品以外のセラミックシ
ート1は、上部金型3に、例えばバネ(図示せず)を取
り付け、摺動部(図示せず)に固定しておけば、加わる
圧力をバネ定数によって選択できるため、シート密度が
変化しない。
Furthermore, the ceramic sheet 1 other than the parts forming the concave portions 1a and the convex portions 1b can be fixed to the sliding portion (not shown) by attaching, for example, a spring (not shown) to the upper mold 3. can be selected by the spring constant, so the sheet density does not change.

このようにして作製されたセラミックシート1は、不必
要であれば凸部1bを除去し、必要であれば凸部1bを
残したまま焼成一体化されるが。
The thus produced ceramic sheet 1 is fired and integrated by removing the protrusions 1b if unnecessary and leaving the protrusions 1b if necessary.

シート密度が略均−であるので、形状歪み、クラック、
ひびを発生することなく完成品となる。
Since the sheet density is approximately uniform, shape distortion, cracks,
The finished product is made without any cracks.

また上記の打ち抜きビン4に必要な圧力は、従来の乾式
プレス法や積層法に比較して、10〜30%の圧力で容
易に凹部1a、凸部1bが形成できた。
Moreover, the pressure required for the above-mentioned punched bottle 4 was 10 to 30% of the pressure required for the conventional dry press method or lamination method, and the concave portions 1a and convex portions 1b could be easily formed.

なお1本実施例では、セラミックスとして96%アルミ
ナを用いたが、他のセラミックス、例えばジルコニア、
4窒化ケイ素、炭化チタンなども使用でき、またセラミ
ックシート1として有機溶剤系のシートを用いたが、水
溶性系のシート、例えば分散媒体として水、可塑剤とし
てグリセリン。
In this example, 96% alumina was used as the ceramic, but other ceramics such as zirconia,
Silicon nitride, titanium carbide, etc. can also be used, and although an organic solvent-based sheet was used as the ceramic sheet 1, a water-soluble sheet, for example, water as the dispersion medium and glycerin as the plasticizer.

エチレングリコールなと、結合材としてP、V、A。Ethylene glycol and P, V, and A as binders.

(ポリ、ビニル、アルコール)、メチルセルロースなど
により構成されるセラミックシートなども使用できる。
Ceramic sheets made of (poly, vinyl, alcohol), methyl cellulose, etc. can also be used.

また寸法面においては、セラミックシート化が可能な寸
法(l@在ではドクターブレード法により、幅1m程度
のシートが量産されている〉であれば、本発明によるセ
ラミックシートの製造方法は適用できる。
In addition, in terms of dimensions, the method for producing a ceramic sheet according to the present invention can be applied to any size that can be made into a ceramic sheet (currently, sheets with a width of about 1 m are mass-produced by the doctor blade method).

また本発明によるセラミックシートの製造方法と、既存
の打ち抜き法、スリット形成法を組合せて、各種形状の
セラミック基板を形成することが考えられる。
Furthermore, it is possible to form ceramic substrates of various shapes by combining the ceramic sheet manufacturing method according to the present invention with existing punching methods and slit forming methods.

(発明の効果) 本発明によれば、セラミックシート化が可能なものに対
して、簡単に、形状歪み、クラック、ひびの発生が少な
いセラミックシートの成型ができるセラミックシートの
製造方法を提供できる。
(Effects of the Invention) According to the present invention, it is possible to provide a method for manufacturing a ceramic sheet that can be easily formed into a ceramic sheet with less shape distortion, cracks, and cracks.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)〜(C)は本発明によるセラミックシート
の製造方法の一実施例の工程を説明するための断面図、
第2図(a)〜(C)は従来のセラミックシートの製造
方法の工程を説明するための断面図、第3図、第4図は
従来のセラミックシートの製造方法の他の例を示す説明
図である。 1 ・・・セラミックシート、 1a・・・凹部、1b
・・・凸部、 2・・・下部金型、 3・・・上部金型
、 4 ・・・打ち抜きピン。 第 図 第 2 図 第 図 父 本ットアレ人 第 図
FIGS. 1(a) to (C) are cross-sectional views for explaining the steps of an embodiment of the method for manufacturing a ceramic sheet according to the present invention;
Figures 2 (a) to (C) are cross-sectional views for explaining the steps of a conventional ceramic sheet manufacturing method, and Figures 3 and 4 are illustrations showing other examples of the conventional ceramic sheet manufacturing method. It is a diagram. 1... Ceramic sheet, 1a... Concave portion, 1b
...Convex portion, 2...Lower mold, 3...Upper mold, 4...Punching pin. Fig. 2 Fig. Fig. Fig. Fig. 2 Fig. Fig. Fig. Fig. Fig. 2 Fig. Fig. Fig. Fig. Fig.

Claims (1)

【特許請求の範囲】[Claims] (1)焼成前のセラミックシートを所定の構造に打ち抜
く時に、完全に打ち抜かず、任意の深さを持つ凹部を形
成した時点で打ち抜き動作を終了させることにより、セ
ラミックシート両表面の一方側に凹部を、また反対側に
凸部を同時に形成するようにし、その後、前記セラミッ
クシートを焼成一体化させることを特徴とするセラミッ
クシートの製造方法。(2)前記凸部を除去した後、セ
ラミックシートを焼成一体化させることを特徴とする請
求項(1)記載のセラミックシートの製造方法。
(1) When punching a pre-fired ceramic sheet into a predetermined structure, the punching operation is not completely punched out, but the punching operation is ended when a recess with an arbitrary depth is formed, thereby creating a recess on one side of both surfaces of the ceramic sheet. and a convex portion on the opposite side at the same time, and then the ceramic sheets are fired and integrated. (2) The method for manufacturing a ceramic sheet according to claim (1), wherein the ceramic sheet is fired and integrated after the convex portion is removed.
JP1221738A 1989-08-30 1989-08-30 Manufacturing method of ceramic sheet Expired - Lifetime JP2727470B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1221738A JP2727470B2 (en) 1989-08-30 1989-08-30 Manufacturing method of ceramic sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1221738A JP2727470B2 (en) 1989-08-30 1989-08-30 Manufacturing method of ceramic sheet

Publications (2)

Publication Number Publication Date
JPH0386501A true JPH0386501A (en) 1991-04-11
JP2727470B2 JP2727470B2 (en) 1998-03-11

Family

ID=16771461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1221738A Expired - Lifetime JP2727470B2 (en) 1989-08-30 1989-08-30 Manufacturing method of ceramic sheet

Country Status (1)

Country Link
JP (1) JP2727470B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06246731A (en) * 1993-02-26 1994-09-06 Noritake Co Ltd Production of ceramic plate material having projection
US9608619B2 (en) 2005-07-11 2017-03-28 Peregrine Semiconductor Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge
US9680416B2 (en) 2004-06-23 2017-06-13 Peregrine Semiconductor Corporation Integrated RF front end with stacked transistor switch
US12520525B2 (en) 2005-07-11 2026-01-06 Psemi Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6330843A (en) * 1986-07-25 1988-02-09 Iic Kagaku Kogyo Kk Pattern forming method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6330843A (en) * 1986-07-25 1988-02-09 Iic Kagaku Kogyo Kk Pattern forming method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06246731A (en) * 1993-02-26 1994-09-06 Noritake Co Ltd Production of ceramic plate material having projection
US9680416B2 (en) 2004-06-23 2017-06-13 Peregrine Semiconductor Corporation Integrated RF front end with stacked transistor switch
US9608619B2 (en) 2005-07-11 2017-03-28 Peregrine Semiconductor Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge
US12520525B2 (en) 2005-07-11 2026-01-06 Psemi Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge

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Publication number Publication date
JP2727470B2 (en) 1998-03-11

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