JPH0386583U

JPH0386583U -

Info

Publication number: JPH0386583U
Application number: JP14893389U
Authority: JP
Priority date: 1989-12-25
Filing date: 1989-12-25
Publication date: 1991-09-02
Anticipated expiration: 2004-12-25
Also published as: JPH0753277Y2

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例の断面図、第２図ａ
，ｂ，ｃは同上の平面図、正面図及び側面図、第
２図ｄは第２図ａのＡ−Ａ線断面図、第３図ａ，
ｂは同上のソケツト台の平面図及び側面図、第３
図ｃは同上のソケツト台とフレームと示す正面図
、第３図ｄは第３図ａのＢ−Ｂ線断面図、第４図
ａ，ｂ，ｃは同上のフレームの平面図、正面図及
び側面図、第４図ｄは第４図ａのＣ−Ｃ線断面図
、第４図ｅは第４図ａのＤ−Ｄ線断面図、第５図
は同上の他の実施例の正面図、第６図はソケツト
台とフレームを示す正面図、第７図はフレームの
断面図、第８図は従来例の断面図であつて、１……リード足、２……ＳＯＰ型ＩＣのパツケ
ージ、３……ソケツト台、４……接触子、５……
エツジ部、６……水平部、７……フレームである
。 Figure 1 is a sectional view of an embodiment of the present invention, Figure 2a
, b, and c are the same plan view, front view, and side view; FIG. 2 d is a sectional view taken along line A-A in FIG. 2 a; FIG.
b is a plan view and a side view of the same socket base, 3rd
Figure c is a front view showing the same socket base and frame, Figure 3 d is a sectional view taken along line B-B in Figure 3 a, and Figures 4 a, b, and c are a plan view, front view, and 4d is a sectional view taken along the line C-C in FIG. 4a, FIG. 4e is a sectional view taken along the line D-D in FIG. 4a, and FIG. 5 is a front view of another embodiment of the same. , Fig. 6 is a front view showing the socket base and frame, Fig. 7 is a cross-sectional view of the frame, and Fig. 8 is a cross-sectional view of a conventional example. , 3... socket base, 4... contact, 5...
Edge portion, 6...horizontal portion, 7...frame.

Claims

[Scope of utility model registration request]

An SOP type IC package with a large number of lead legs protruding from both sides was placed on a socket base, and a large number of contacts were provided on both sides of the socket base, and the tips of the contacts were provided so as to rise diagonally upward. The edge part is brought into edge contact with the lower surface of the horizontal part of the lead foot, the horizontal part of the lead foot is pressed by a frame that fits around the outer periphery of the package, and the frame is connected to the socket base to the socket of the SOP type IC package. holding structure.