JPH0336151U - - Google Patents
Info
- Publication number
- JPH0336151U JPH0336151U JP1989096919U JP9691989U JPH0336151U JP H0336151 U JPH0336151 U JP H0336151U JP 1989096919 U JP1989096919 U JP 1989096919U JP 9691989 U JP9691989 U JP 9691989U JP H0336151 U JPH0336151 U JP H0336151U
- Authority
- JP
- Japan
- Prior art keywords
- mounting portion
- length
- chip mounting
- lead frame
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームを使用した半
導体装置の模式断面図、第２図は従来のリードフ
レームを使用した半導体装置の模式断面図である
。
図中、１……リードフレーム、１Ａ，１Ｂ……
チツプ搭載部、２……半導体チツプ、３……導電
性接着剤、３ａ，３ｂ……はみ出し、４……ワイ
ヤである。
FIG. 1 is a schematic sectional view of a semiconductor device using the lead frame of the present invention, and FIG. 2 is a schematic sectional view of a semiconductor device using a conventional lead frame. In the figure, 1... lead frame, 1A, 1B...
Chip mounting portion, 2... semiconductor chip, 3... conductive adhesive, 3a, 3b... protrusion, 4... wire.
Claims (1)
ており、且つ該チツプ搭載部１Ａの各辺の長さが
搭載する半導体チツプ２の対応する各辺の長さよ
り小であることを特徴とするリードフレーム。 A lead frame characterized in that the upper surface of the chip mounting portion 1A protrudes from the surrounding area, and the length of each side of the chip mounting portion 1A is smaller than the length of each corresponding side of the semiconductor chip 2 to be mounted. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989096919U JPH0336151U (en) | 1989-08-19 | 1989-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989096919U JPH0336151U (en) | 1989-08-19 | 1989-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336151U true JPH0336151U (en) | 1991-04-09 |
Family
ID=31646092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989096919U Pending JPH0336151U (en) | 1989-08-19 | 1989-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336151U (en) |
-
1989
- 1989-08-19 JP JP1989096919U patent/JPH0336151U/ja active Pending