JPH0388367U - - Google Patents
Info
- Publication number
- JPH0388367U JPH0388367U JP15142889U JP15142889U JPH0388367U JP H0388367 U JPH0388367 U JP H0388367U JP 15142889 U JP15142889 U JP 15142889U JP 15142889 U JP15142889 U JP 15142889U JP H0388367 U JPH0388367 U JP H0388367U
- Authority
- JP
- Japan
- Prior art keywords
- view
- release paper
- double
- sided tape
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 6
- 208000028341 floppy head Diseases 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図ないし第１０図は本考案の一実施例を示
す図であつて、第１図はフレキシブルプリント基
板の平面図、第２図はフレキシブルプリント基板
の剥離紙を剥がす状態を示した斜視図、第３図は
第１の切込みを入れた状態の基板シートの裏面図
、第４図は原形両面テープを貼付した状態の基板
シートの裏面図、第５図は第４図の矢視図、第
６図はベースフイルムの輪郭部を打ち抜いた状態
を示す基板シートの裏面図、第７図ａは打抜前の
基板シートの平面図、第７図ｂは同基板シートの
裏面図、第８図は第７図ｂの矢視図、第９図は
フロツピーヘツドの平面図、第１０図は第９図の
矢視図、第１１図ないし第１６図は従来例とし
て示した図であつて、第１１図は基板シートの裏
面図、第１２図は第１１図の矢視図、第１３
図は基板シートからフレキシブルプリント基板を
打ち抜く状態を示す断面図、第１４図は基板シー
トからフレキシブルプリント基板を打ち抜いた状
態を示す平面図、第１５図はフレキシブルプリン
ト基板の平面図、第１６図はフレキシブルプリン
ト基板から剥離紙を剥がす状態を示す斜視図であ
る。
２１……ベースフイルム、２２……配線、２３
……両面テープ、２４……剥離紙、２５……粘着
層。
1 to 10 are views showing one embodiment of the present invention, in which FIG. 1 is a plan view of a flexible printed circuit board, and FIG. 2 is a perspective view showing a state in which the release paper of the flexible printed circuit board is peeled off. , FIG. 3 is a back view of the substrate sheet with the first notch made, FIG. 4 is a back view of the substrate sheet with the original double-sided tape pasted, and FIG. 5 is a view taken in the direction of the arrow in FIG. 4. FIG. 6 is a back view of the substrate sheet showing the state in which the outline of the base film has been punched out, FIG. 7 a is a plan view of the substrate sheet before punching, FIG. 7 b is a back view of the same substrate sheet, The figure is a view in the direction of the arrow in FIG. 7b, FIG. 9 is a plan view of the floppy head, FIG. 10 is a view in the direction of the arrow in FIG. 9, and FIGS. 11 to 16 are views shown as conventional examples. Fig. 11 is a back view of the substrate sheet, Fig. 12 is a view in the direction of the arrow in Fig. 11, and Fig. 13
The figure is a cross-sectional view showing a state in which a flexible printed circuit board is punched out from a board sheet, FIG. 14 is a plan view showing a state in which a flexible printed circuit board is punched out from a board sheet, FIG. 15 is a plan view of the flexible printed board, and FIG. FIG. 3 is a perspective view showing a state in which a release paper is peeled off from a flexible printed circuit board. 21...Base film, 22...Wiring, 23
...Double-sided tape, 24...Release paper, 25...Adhesive layer.
Claims (1)
フイルムを両面テープで接続してなり、この両面
テープは一片の剥離紙と、この剥離紙の、前記各
ベースフイルムに対応する位置にのみ設けられた
粘着層とからなることを特徴とするフレキシブル
プリント基板。 It is made by connecting multiple base films with a certain pattern of wiring drawn on them with double-sided tape, and this double-sided tape is attached only to a piece of release paper and to the position of the release paper that corresponds to each base film. A flexible printed circuit board characterized by comprising an adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15142889U JPH0388367U (en) | 1989-12-27 | 1989-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15142889U JPH0388367U (en) | 1989-12-27 | 1989-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388367U true JPH0388367U (en) | 1991-09-10 |
Family
ID=31697729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15142889U Pending JPH0388367U (en) | 1989-12-27 | 1989-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388367U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220784A (en) * | 2006-02-15 | 2007-08-30 | Sumitomo Bakelite Co Ltd | Adhesive substrate, manufacturing method of circuit substrate, and circuit board |
| JP2008153483A (en) * | 2006-12-19 | 2008-07-03 | Sumitomo Bakelite Co Ltd | Circuit board |
| JP2008219945A (en) * | 2008-06-02 | 2008-09-18 | Toshiba Corp | Recording / reproducing apparatus and recording / reproducing method |
| WO2009098765A1 (en) * | 2008-02-07 | 2009-08-13 | Sumitomo Bakelite Co., Ltd. | Circuit board |
| JPWO2016088693A1 (en) * | 2014-12-01 | 2017-04-27 | 株式会社村田製作所 | Electronics |
-
1989
- 1989-12-27 JP JP15142889U patent/JPH0388367U/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220784A (en) * | 2006-02-15 | 2007-08-30 | Sumitomo Bakelite Co Ltd | Adhesive substrate, manufacturing method of circuit substrate, and circuit board |
| JP2008153483A (en) * | 2006-12-19 | 2008-07-03 | Sumitomo Bakelite Co Ltd | Circuit board |
| WO2009098765A1 (en) * | 2008-02-07 | 2009-08-13 | Sumitomo Bakelite Co., Ltd. | Circuit board |
| JP2008219945A (en) * | 2008-06-02 | 2008-09-18 | Toshiba Corp | Recording / reproducing apparatus and recording / reproducing method |
| JPWO2016088693A1 (en) * | 2014-12-01 | 2017-04-27 | 株式会社村田製作所 | Electronics |
| JPWO2016088592A1 (en) * | 2014-12-01 | 2017-04-27 | 株式会社村田製作所 | Electronic device, electrical element and tray for electrical element |
| US10270150B2 (en) | 2014-12-01 | 2019-04-23 | Murata Manufacturing Co., Ltd. | Electronic apparatus |
| US10424824B2 (en) | 2014-12-01 | 2019-09-24 | Murata Manufacturing Co., Ltd. | Electronic apparatus, electrical element, and electrical element tray |
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