JPH0389595A - Method of soldering hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To enable soldering, which can be carried out in manufacture of many types of products in small quantities at a low cost, by completely separating parts on a circuit board into ones to be soldered and ones not to be soldered with a heat-resistant resin plate box jig and performing soldering. CONSTITUTION:A heat-resistant glass epoxy resin plate box jig 5 has a plurality of openings 5' having glass epoxy resin walls and corresponding to the arrangement of lead terminals 3 to be soldered on a circuit board 1 and, when said box jig 5 is mounted on said circuit board, the section other than said rectangular openings 5' is completely isolated from the outside. Therefore, laminated capacitors and other parts arranged on the section where the lead terminals 3 are not mounted do not come into contact with molten solder and are not affected thereby at all.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a soldering method that can be employed in the manufacturing process of hybrid integrated circuits.

[Prior Art] Conventionally, when mounting various components such as chip components on a circuit board in the manufacture of hybrid integration ports and paths, some of the various components arranged on the same surface of the circuit board required soldering. There are components that are not soldered, and the former, such as the lead terminals of chip components, pass through the edge of the circuit board or the board, and then fix these terminals on the opposite side of the board and connect them to other conductors. To make this possible, terminals are soldered using a dip method. In this dipping method, for example, as shown in FIG. 4, the lead terminals 3 of the chip component 2 mounted on the circuit board 1 are immersed in a jet of molten solder 7 with the lead terminals 3 facing downward. It's soldered.

[Problems to be Solved by the Invention] However, in the above-described soldering method, it is difficult to supply the molten solder 7 shown in FIG. It is necessary to change the position, size and shape of the jet jig, and if there are parts that will not be soldered in close proximity, it is necessary to take measures to eliminate the thermal influence on these parts. Dealing with different types of parts was complicated. For this reason, the apparatus is generally large in size, which is not desirable in terms of cost, and therefore, there is a problem that it is not suitable for high-mix, low-volume production.

It is an object of the present invention to provide a soldering method that solves the problems of the conventional methods as described above and can accommodate high-mix, low-volume production.

[Means for Solving the Problems] Therefore, the present invention provides a method for soldering, which is performed by dipping the lead terminals of a hybrid integrated circuit equipped with chip components in molten solder in order to join them to another conductor. This provides an improved method that incorporates the following ideas. In other words, soldering is performed by covering the circuit board with a box-shaped jig made of a heat-resistant resin plate, and when applying the jig, the jig is used in accordance with the position of the lead terminal to be soldered. A columnar or cylindrical opening (open space) surrounded by a heat-resistant resin wall is provided to expose only the parts necessary for soldering, including the lead terminals, and the jig and circuit board are integrated. When closed, this opening is completely blocked off from other parts.

That is, the present invention provides a method for soldering a hybrid integrated circuit characterized by using such a box-shaped jig and bringing lead terminals into contact with molten solder that enters through an opening of the box-shaped jig.

According to the soldering method of the present invention, the part to be soldered is separated from others by being surrounded by a plate-shaped heat-resistant resin, such as a glass epoxy resin, in a columnar or cylindrical shape by using the above-mentioned jig. Since the parts that do not want to be soldered are covered and sealed with heat-resistant resin, the former and latter parts are completely separated, and even if the former parts and the latter parts are adjacent, soldering will not be possible. It can be easily attached.

The method of the present invention will be further explained below with reference to Examples.

[Example] Figures 1 to 3 explain the soldering method of the present invention, and Figure 1 shows a box-shaped jig 5 used in the method of the present invention and the jig on which this jig is placed. The box-shaped jig 5 is assembled from a heat-resistant glass epoxy board, and the lead terminals 3 to be soldered are arranged on the circuit board 1. There are a plurality of openings 5' surrounded by glass epoxy plates to correspond to the arrangement of the circuit boards, and when the box-shaped jig 5 is placed on the circuit board, these cylindrical openings 5' The structure is such that all other parts are completely isolated from the outside. Therefore, components 4 such as multilayer capacitors (not shown in FIG. 1) placed at locations other than the lead terminals 3 do not come into contact with the molten solder and are not affected by the molten solder at all.

FIG. 2 is a conceptual diagram showing a cross-sectional structure of a state in which a box-shaped jig 5 is placed on the circuit board 1 and assembled integrally, as viewed from the direction of the arrow in FIG. Components 4 other than the lead terminals 3 that are not soldered are completely sealed.

Next, the thus integrated jig 5 and circuit board 1 are immersed in molten solder 7 with the lead terminals 3 facing downward, and the lead terminals 3 are soldered by the jet method.

[Effect of the invention] By using a box-shaped jig made of a heat-resistant resin plate, the parts to be soldered and the parts not to be soldered among various parts on the surface of the circuit board can be completely separated and soldered. As a result, soldering can be performed at low cost and compatible with high-mix, low-volume production.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the relationship between a jig that can be used in the method of the present invention and a circuit board on which this jig is placed. FIG. 2 is a conceptual diagram showing the cross-sectional structure of the jig mounted on the circuit board, viewed from the direction of the arrow shown in FIG. 1. FIG. 3 is a conceptual diagram, viewed from the side, of a state in which a component-mounted circuit board is immersed in molten solder using the above-mentioned jig. FIG. 4 is a conceptual diagram, viewed from the side, of a state in which a component mounting board is immersed in molten solder by a conventional method. Explanation of symbols 1...Circuit board 2...Chip parts 3...Lead terminals 4...Components such as multilayer capacitors 5...Box-shaped jig 5'...Opening Part 6... Jet jig 7... Molten solder

Claims (1)

[Claims] This is a soldering method in which the lead terminals of a hybrid integrated circuit equipped with chip components are dipped in molten solder in order to connect them to another conductor, using a box-shaped jig made of heat-resistant resin plate. The jig consists of covering the circuit board surface and immersing it in molten solder, and when the circuit board surface is covered and tightly integrated, the jig is used for soldering, including the lead terminals to be soldered. Soldering of a hybrid integrated circuit characterized in that it has an opening that allows only a portion of the circuit board to be exposed while being completely isolated from other items on the circuit board, and that soldering is performed only in that opening. Method.