JPH0391999A - Board mounting device - Google Patents

Abstract

PURPOSE:To enable the automatic mounting of an electronic component of irregular shape by a method wherein a suction collet provided with a suction hole whose shape is correspondent to the asymmetrical shape of the sucked face of the electronic component is moved in the directions of three axes, and a mechanism which rotates the collet is provided. CONSTITUTION:A suction collet 201 provided with a suction hole 203 whose shape is correspondent to the asymmetrical shape of the sucked face of an electronic component 6 is so constituted as to be movable in the directions of three axes and rotatable, and a mounting device of this design is so constituted so as to enable the collet 201 to mount the electronic component 6 on a board by sucking it. Therefore, even an electronic component of irregular shape can be handled by suction making one of centering pawls 209 function effectively. By this setup, an electronic component possessed of a sucked face of asymmetrical shape can be transferred by suction through a suction collet, so that the automation of the mounting of components on a board can be improved and the board mounting can be improved in accuracy.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a board mounting device that automates and streamlines the board assembly process for electronic components. When mounting an irregularly shaped electronic component having a suction surface on a board, as shown in Fig. 6,
A suction collet (201) having nine holes (204) for vacuum suction as shown in FIG.
A tray for storing odd-shaped electronic components (6) having asymmetric leads, such as a BOR chip, which is mounted by a suction centering unit (2) having a centering claw (209) and a lead (61) and a heat sink (62) soldered to it. The mounting of the electronic components on the board (4) is completed by picking up the electronic components from (7) one by one using tweezers and placing them on the printed cream solder aid while positioning them.

[Problem to be solved by the invention]

Since it is impossible to mount such odd-shaped parts with soldered leads and the like using an automatic machine, this portion of the board mounting has been done manually.

Therefore, manual work using a bin set causes defects such as lead deformation and chip damage, and a significant drop in work efficiency.

This invention was made to solve these problems, and aims to provide a board mounting device that automatically mounts irregularly shaped electronic components such as BCR chips with leads. [Means for Solving the Problems] A board mounting apparatus according to the present invention is configured such that a suction collet having a suction hole shaped to correspond to an asymmetric suction surface of an electronic component is movable in three axes directions and rotatable in the same direction. This suction collet is used to suction electronic components and mount them on the board.

[Effect]

Since the suction collet according to the present invention can suction and transport electronic components having an asymmetrically shaped suction surface, automation of board mounting is greatly improved and board mounting accuracy is improved.

〔Example〕

An embodiment of the present invention will be explained based on FIGS. 1 to 5.

That is, in Figures 1 to 5, (1) is the main body of the plate mounting apparatus, (2) is the 4-axis excitation of X, Y, Z, θ,
A suction centering unit that suctions and transfers the components one by one, (3) a board transport conveyor that transports and positions the printed circuit board (4) to be mounted, and (5) a third
As shown in the figure, the leads (61) and heat sink (62)
) Irregular electronic components such as BOR chips (
A tray loader that transfers and supplies a plurality of shaped product trays (7) arranged and stored in a tray to a tray positioning table (8) having a bit feed function one by one; (9) is an empty tray; The storage box α0 is an electronic component having a symmetrical outer shape. Here, the suction centering unit (2) is constructed as shown in FIG.

That is, in the figure, (201) is a suction collet that vacuum-chucks the chip, (202) is a positioning groove of the suction collet (201), and (203) is a shape similar to that of the lead (61) of the BOR chip (6). Suction hole machined in the shape of (
200 is the collet guide that fits with the collet (201) with a clearance fit, (205) is the collet (201'')
(206) is a compression spring that returns the collet guide that rises when replacing the collet, (207) is a compression spring that regulates the fixed position of the collet and pushes out the raised collet when replacing the collet. ), the spring receiver (209) receives the suction collet holder (2
10) vertical movement of the suction centering unit (
2) Due to the two-axis operation, BO closes when rising and opens when descending.
The centering claw (211) is a chuck spring that determines the gripping force of the centering claw (209), (212) is the fulcrum boss with the center of rotation of the centering claw (209), (
213) is the Tomoe compression spring that presses the fulcrum boss (212) downward, (214) is the spring collar that positions the EE compression spring (ZIS), and (215) is the compression spring (213).
) is a thrust bearing that receives the θ-axis rotation of the suction collet holder (210), fulcrum boss (212), etc. while receiving a thrust load from the suction collet holder (216).
The base plate (21B) is attached to the base plate (216) and is attached to the base plate (216) and passes through the suction collet holder (210) to the suction collet (201), which is the basis of the suction centering unit (2). The joint (219) connected to the centering claw (209) is a case with a cam shape that provides opening/closing action to the centering claw (209).

The rest of the structure is the same as the conventional one shown in FIGS. 6 and 7, so the explanation will be omitted.

With this structure, the BOR chip (6) to which the heat sink (62) and leads (61) were soldered in the pre-board assembly process is transferred from the intermediate characteristic inspection device to the molded product tray ( 7), and set into the tray loader (5) in a state where a plurality of sheets are stacked together in a tray basket. Next, when a start switch (not shown) is turned on, only one tray (7) in the basket is loaded onto the D tray positioning table (8) by the tray loader (5).
) and is fixed.

Furthermore, the positioning table (8)
> storage row moves to the suction-enabled standby position of the suction centering unit (2) and stops. At the same time, the suction centering unit (2) starts a two-axis downward movement, and while opening the centering claw (209), the suction collet (
201) to the top surface of the BOR chip lead (61). Thereafter, the BOR chip (6) is sucked into a collet tip suction hole (203) connected to a vacuum source, and while rising, the chip is handled while being controlled by two centering claws (209) in one direction.

Further, a printed circuit board (4) on which cream solder printing and symmetrical chip component mounting have been completed in advance by a similar ordinary chip mounting device is positioned and fixed by the board conveyor (3). And the previous adsorption centered E
The CR chip (6) is placed and mounted on the printed cream solder (c) of the board (4) by the Z-axis downward movement of the suction centering unit (2).

At this time, if the suction direction from the shaped product tray (7) is different from the board mounting direction, the board mounting directions are aligned by rotating the suction centering unit (2) on the O axis before the two-axis lowering operation. This series of suction and centering mounting operations is repeated, and when the mounting of the first row of the article tray (7) is completed, the tray positioning table (8) is moved by l bit and the series of operations is continued. Once all chips have been mounted on the tray (7), the empty tray on the table is discharged into the storage box (9) by the empty tray ejection cylinder mounted on the tray positioning table (8). Then, the table returns to the tray loader side and simultaneously receives the next actual tray.

In this way, one of the centering claws (209) is made to function effectively even for irregularly shaped electronic components, and suction handling is made possible. Since it is held within the clearance range with the external dimensions of the chip, it is possible to automate board assembly with a soldering tolerance of +7701.

In this example, we have described the mounting of a 9-BOR chip after heat sinking and soldering of the leads have been completed, but if a similar chip tray is prepared for normal chips without leads, it is possible to mount the chip on the board by simply replacing the tray. Become.

〔Effect of the invention〕

As described above, the board mounting apparatus according to the present invention is capable of automatically mounting electronic components with asymmetrical adsorption onto the board), reducing the occurrence of defects due to manual handling work, and automating and rationalizing the board assembly work. realization. can.

[Brief explanation of drawings]

Figures 1 to 5 are diagrams showing one embodiment of the present invention.
Figure (a). (c2) is a front view and side view, Fig. 2 0)
．． (B) is an enlarged sectional view and perspective view of the main part, Figure 3 (A),
(Opening) is an enlarged perspective view of the main part, Figure 4 (A). (B) is a plan view and a front view of the components to be mounted, FIG. 5 is a perspective view of the board on which mounting has been completed, FIGS. 6 and 7 are views showing a conventional board mounting apparatus of this type, and FIG. (a), ←) are a perspective view and a side view showing the mounting process, and Fig. 7 is a perspective view of the main parts. 201) is a suction collet, (203
) is the suction hole, (3) is the substrate conveyor, (4) is the substrate, (5) is the tray loader, (6) is the BOR chip, (7
) is a molded product tray, and (8) is a tray positioning table. Note: The same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] A suction collet having a suction hole shaped to correspond to the asymmetrically shaped suction surface of an electronic component, and a mechanism for moving and rotating this suction collet in three axial directions, the electronic component being suctioned by the suction collet. A board mounting device that mounts the board on the board.