JPH0392003U - - Google Patents
Info
- Publication number
- JPH0392003U JPH0392003U JP15103389U JP15103389U JPH0392003U JP H0392003 U JPH0392003 U JP H0392003U JP 15103389 U JP15103389 U JP 15103389U JP 15103389 U JP15103389 U JP 15103389U JP H0392003 U JPH0392003 U JP H0392003U
- Authority
- JP
- Japan
- Prior art keywords
- terminal electrodes
- mounting surface
- chip
- solder resist
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
第１図は本考案の実施例に係るチツプＲネツト
ワークの表面側を示す図、第２図はその裏面側を
示す図、第３図は第２図のＡ−Ａ線に沿う断面を
示す図である。第４図は従来例のチツプＲネツト
ワークの表面側を示す図、第５図はその裏面側を
示す図、第６図は第５図のＡ−Ａ線に沿う断面を
示す図、第７図はチツプＲネツトワークをプリン
ト配線板上に載置したときの側面を示す図である
。
１……チツプＲネツトワーク、２……基板、３
，４……端子電極、５……抵抗膜、６，７……凹
溝、８……保護膜、９，１０……半田レジスト膜
。
1 is a diagram showing the front side of a chip R network according to an embodiment of the present invention, FIG. 2 is a diagram showing the back side thereof, and FIG. 3 is a cross-sectional view taken along line A-A in FIG. 2. It is a diagram. 4 is a diagram showing the front side of the chip R network of the conventional example, FIG. 5 is a diagram showing the back side thereof, FIG. The figure is a side view of the chip R network placed on a printed wiring board. 1... Chip R network, 2... Board, 3
, 4... terminal electrode, 5... resistive film, 6, 7... concave groove, 8... protective film, 9, 10... solder resist film.
Claims (1)
レジスト膜９，１０を有したものであつて、 基板２は、相対向する各端面２ｂ，２ｂと、プ
リント配線板への取り付け面２ｃとを有しており
、 複数個の端子電極３，４は、前記各端面２ｂ，
２ｂにおいて互いに所定の間隔をあけて形成され
ており、かつ、少なくとも前記取り付け面２ｃに
まで延長されて形成されており、 半田レジスト膜９，１０は、前記取り付け面２
ｃのうち、少なくとも、隣り合う端子電極３，４
間に形成されており、かつその厚みが当該隣り合
う端子電極３，４の厚みと略同じにされている ことを特徴とするチツプ形電子部品。[Claims for Utility Model Registration] A substrate 2, a plurality of terminal electrodes 3, 4, and solder resist films 9, 10, wherein the substrate 2 has opposing end surfaces 2b, 2b, and a printed circuit board. The plurality of terminal electrodes 3 and 4 have a mounting surface 2c to the wiring board, and each of the terminal electrodes 3 and 4 has a surface 2c for mounting on the wiring board.
The solder resist films 9 and 10 are formed at a predetermined distance from each other on the mounting surface 2b, and extend to at least the mounting surface 2c.
Among c, at least the adjacent terminal electrodes 3 and 4
A chip-shaped electronic component characterized in that the chip-shaped electronic component is formed between the adjacent terminal electrodes 3 and 4 and has a thickness that is approximately the same as the thickness of the adjacent terminal electrodes 3 and 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15103389U JPH0392003U (en) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15103389U JPH0392003U (en) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392003U true JPH0392003U (en) | 1991-09-19 |
Family
ID=31697351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15103389U Pending JPH0392003U (en) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392003U (en) |
-
1989
- 1989-12-29 JP JP15103389U patent/JPH0392003U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6310582U (en) | ||
| JPS6015319Y2 (en) | lead frame | |
| JPH0737337Y2 (en) | Circuit parts | |
| JPS6020300Y2 (en) | printed wiring board | |
| JPS62180973U (en) | ||
| JPS6320471U (en) | ||
| JPH0638441Y2 (en) | Mounting structure of surface mounting hybrid IC | |
| JPS5940787Y2 (en) | Solder electrode structure for connecting electronic components | |
| JPH0224570U (en) | ||
| JPS62193797U (en) | ||
| JPS6183098U (en) | ||
| JPH0292905U (en) | ||
| JPH03102764U (en) | ||
| JPS61111175U (en) | ||
| JPS6159375U (en) | ||
| JPH04121708U (en) | Chip R Network | |
| JPH0459182U (en) | ||
| JPS6382968U (en) | ||
| JPS58116791A (en) | Small electronic part | |
| JPS6210406U (en) | ||
| JPH0321810U (en) | ||
| JPS60115287A (en) | Hybrid integrated circuit device | |
| JPS60172361U (en) | Printed board | |
| JPS61203506U (en) | ||
| JPH0440505U (en) |