JPH0392053U - - Google Patents

Info

Publication number
JPH0392053U
JPH0392053U JP1990000719U JP71990U JPH0392053U JP H0392053 U JPH0392053 U JP H0392053U JP 1990000719 U JP1990000719 U JP 1990000719U JP 71990 U JP71990 U JP 71990U JP H0392053 U JPH0392053 U JP H0392053U
Authority
JP
Japan
Prior art keywords
metal plate
chip
stage
resin
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990000719U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990000719U priority Critical patent/JPH0392053U/ja
Publication of JPH0392053U publication Critical patent/JPH0392053U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP1990000719U 1990-01-09 1990-01-09 Pending JPH0392053U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990000719U JPH0392053U (2) 1990-01-09 1990-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990000719U JPH0392053U (2) 1990-01-09 1990-01-09

Publications (1)

Publication Number Publication Date
JPH0392053U true JPH0392053U (2) 1991-09-19

Family

ID=31504660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990000719U Pending JPH0392053U (2) 1990-01-09 1990-01-09

Country Status (1)

Country Link
JP (1) JPH0392053U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007164741A (ja) * 2005-12-12 2007-06-28 Figla Co Ltd 建築現場の管理システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482554A (en) * 1987-09-24 1989-03-28 Mitsubishi Electric Corp Resin-sealed semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482554A (en) * 1987-09-24 1989-03-28 Mitsubishi Electric Corp Resin-sealed semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007164741A (ja) * 2005-12-12 2007-06-28 Figla Co Ltd 建築現場の管理システム

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