JPH0392805A - Inspection device for photosemiconductor and photosemiconductor element - Google Patents

Abstract

PURPOSE:To control a vertical position with high accuracy by using a U-shaped groove with high working accuracy for a fixing part for a condenser lens. CONSTITUTION:The U-shaped groove 15 with high machining accuracy is formed in the reverse surface of the condenser lens 18 for controlling the position of an optical lens on a stem main body 12 with high accuracy and the optical lens 18 is stably and accurately fixed by using the U-shaped part of the groove 15. Further, the lens bottom surface of the optical condenser lens 18 is supported on the U-shaped groove at three points and the vertical and horizontal fixing positions of the optical condenser lens 18 are accurately controlled. Consequently, the fixing position of the optical condenser lens 18 can accurately be controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION Industrial Field of Application The present invention relates to an optical semiconductor device using an optical semiconductor device stem for mounting an optical semiconductor device used in optical communications, etc., and an inspection device for an optical semiconductor device. It is.

Conventional technology: Optical semiconductor device stems and inspection equipment for mounting optical semiconductor devices (Part 1) Optical communication devices, which are now widely used in fields such as optical measurement, are as follows. The stem will be explained below. Fig. 3 shows a conventional stem for optical semiconductor devices, and an example of a module for optical semiconductor devices using this stem is shown in Fig. 4. In Fig. 3, 3l is the stem. Main body 32 is an electrode lead, 33 is an insulation pad, 34 is a submount, 35
3 is an optical semiconductor element, and 36 is a conductive wire. In FIG. 4, 437 is a light receiving element, 438 is a support fixed substrate, 439 is an optical lens holder, 440 is an optical lens, 44l is a ferrule holder, 442 is a ferrule 443 is an optical fiber, 444 is a thermoelectric cooling element, and 445 is a ferrule holder. The bonding of the submount 34 to the stem body 3l and the bonding of the optical semiconductor element 35 to the submount 34 (not shown in Figure 3) are carried out by metal fixation. Inspection and measurement of electrical characteristics and optical characteristics of the device 35 1. A current is applied between the stem body 31 and the electrode lead 32, and the optical semiconductor device 35 is operated. (It was assembled together with the stem body into an optical semiconductor element module for coupling with an optical fiber using the structure shown in Figure 4.) In the modularization of optical semiconductor elements, the output beam from the element 35 is highly efficient. Conventionally, a set L of optical semiconductor elements 35..optical lenses 44Q. It is extremely difficult to improve industrial manufacturing and mass productivity, and this is the problem that the invention attempts to solve.
Bonding of the optical semiconductor element 35 to the sub-mount 1 and the sub-mount 1, 34, and fixing of the stem body 3l to the supporting fixed substrate 438 is carried out by heating and melting using a metal material. Stem body 3
It is not possible to precisely control the position of the submount 34 with respect to l and the fixing position of the optical semiconductor element 35 with respect to the submount 34, and furthermore, the optical semiconductor element 35 and the optical lens 440 are assembled separately. Therefore, extremely high positioning accuracy of about 1 to 2 microns was required in the horizontal direction, vertical direction, and optical axis direction.In other words, the optical semiconductor element 35 In order to couple the output beam from 1 to the optical fiber 443 with high efficiency, it is necessary to attach various lens systems and optical fibers to the outside of the stem on which the optical semiconductor element is mounted. The accuracy of fixing the position of the fiber is very strict, and after fixing the optical semiconductor element and optical lens, the optical fiber has the disadvantage that the optical output from the optical fiber fluctuates due to changes in the surrounding temperature. In addition, it has conventionally been possible to stably fix the condensing optical lens.
Hard eaves of lens material Is it difficult due to problems such as thermal expansion coefficient?
Moreover, in the modularization of optical semiconductor devices, the productivity of modules for optical semiconductor devices is extremely low because it takes a lot of time to align various parts in the direction of the optical axis. This method solves the conventional problems such as, with a simple structure, it is not only possible to focus the emitted beam from an optical semiconductor element using an optical lens whose position is regulated in advance, but also allows the beam to be focused on the same stem. For optical semiconductor elements, which has an optical semiconductor element and an optical lens on the top, the stem body can be metal-fixed again to various other packages while maintaining the connection between the optical semiconductor element and the optical lens. The present invention provides an inspection device that stably holds a stem and a stem body and efficiently measures and inspects the electrical characteristics and optical characteristics of an optical semiconductor element.

Means for Solving the Problems In order to achieve the above objects, the technical solution of the present invention is
First, in order to control the vertical position of the condensing optical lens with high precision, a U-shaped groove with high machining accuracy is used in the fixing part of the condensing lens. Second, the above U
A condensing optical lens is placed on the groove, and a low-melting glass material is used to fix the condensing optical lens. By heating and melting, the stem body and the bottom surface of the condensing glass are fixed stably and accurately. It is something. Furthermore, thirdly, by providing the insulated electrode pad for applying current on the upper surface of the stem, it is possible to apply current to the optical semiconductor element without applying unnecessary external force. {Friend: Electrical and
A stem storage holder that holds the entire stem is used to inspect and measure optical properties, and a pressurized electrode pin placed on the insulating pad allows for stable and efficient device inspection. This makes it possible to measure characteristics.

Function of the present invention (Firstly, in order to precisely regulate the position of the optical lens on the stem body for mounting the optical semiconductor element, a U-shaped groove with high machining accuracy is provided on the lower surface of the condensing lens, The U-shaped part of this groove can be used to securely and precisely fix the optical lens.Secondly, by using a low melting point glass material with a coefficient of thermal expansion similar to that of the lens to fix the optical lens, High temperature stability of the optical lens Maintains the bonding state between the optical semiconductor element and the optical lens when the element is assembled.Furthermore, thirdly, it is possible to maintain the bonding state between the optical semiconductor element and the optical lens when the element is assembled. By providing the insulating electrode pad used, stable current application is possible without applying external stress to the optical semiconductor element.Furthermore,
Fourthly, 41, the stem inspection device is provided with a stem storage section for stably holding the entire stem, and a pressurized electrode pin is placed on the metallized portion on the electrode extraction insulating pad, so that the stem itself can be attached and detached. Not only can this be easily performed, but also the electroerosion optical characteristics of the optical semiconductor element mounted on the stem can be efficiently and stably measured.

EXAMPLE Hereinafter, a stem for an optical semiconductor element and an inspection apparatus according to an embodiment of the present invention, and a module for an optical semiconductor element using this stem will be described with reference to the drawings. Figure 1 (
This is an external view of the stem and inspection device. In the figure, 11 is the inspection device, 12 is the stem, 13 is the insulating electrode pad, 14 is the pressurized electrode pin for inspection, 15 is the position,
The U-shape 16 for regulating the placement is a low melting point glass material, 17 is a stem storage holder, 18 is an optical lens for condensing light, 19 is a submount, 20 is an optical semiconductor element such as a semiconductor laser, 2l
The conductive wire 22 is the light emitting wire 23, 2 of the optical semiconductor element.
4Lt, forward light from the optical semiconductor element and monitor 9 25 is a stem extraction hole, and 26 is a metallized part for electrode extraction. In Fig. 2, 40 is a conduction wire, 231 is based on the package, 232 is a light receiving element, 233 is a submount for the light receiving element, 234 is a conduction wire, 235 is a Bakken lead pin, 236 is an optical lens holder, 237 238 is an optical lens, 238 is a ferrule holder, 239 is a ferrule)'L/, and 240 is an optical fiber. In the stem body 12 of FIG. 1, a U-shaped groove 15 for position regulation is formed by cutting with high precision. Furthermore, the condensing optical lens 18 has a structure in which the bottom surface of the lens is supported at three points on the U-shaped groove, and the vertical and horizontal fixing positions of the condensing optical lens 18 are precisely controlled. .

Furthermore, around the condensing optical lens 18, a low melting point glass material 16 whose coefficient of thermal expansion is very similar to that of the optical lens 18 is used.
The stem body l2 and the condensing optical lens +8ii are stably fixed with good positional accuracy.

In this embodiment, a low melting point glass material 16 shaped like a pellet is placed under the optical lens l8, and the lens is fixed on the U-shaped groove using a three-point support structure by heating the entire stem. are doing.

Experiments have shown that when the lens is fixed using this method, the vertical and horizontal positional deviations are within ±5 μm, which is a highly accurate value. Furthermore, in this heat melting and fixing method, by optimizing the shape of the barrel, it is possible to completely prevent the low melting point glass material l6 from adhering to the beam passing surface of the optical lens 18. 12 and the submount 19, and the submount 19 and the optical semiconductor element 20.
Furthermore, an insulating electrode pad l3 is attached to the stem body 12 in FIG. It becomes.

In this embodiment, the condensing lens 18 is l;L Ta
A force using an F3 ball lens (a lens made of other materials is also acceptable) (1) Furthermore, a holder part 17 is provided in the inspection device body l1 (to accommodate the stem body 12), and a holder part 17 is provided to accommodate the stem body 12. For this purpose, a stem extraction hole 25 into which tweezers or the like can be inserted is also provided.Thereby, the stem body 12 to which the optical semiconductor element 20 is fixed can be easily inserted and extracted. {Yo Stem body 1 B and inspection device 1 1 i; L Force support using Kovar material Other materials may be used as long as they are made of a material with high thermal conductivity.Furthermore, in this example, the optical semiconductor element module Alternatively, other coupling methods may be used, such as a configuration using a rod lens with a spherical tip or an optical fiber with a tapered tip, depending on the shape of the package. Although a cylindrical system was adopted, DI
Even in shapes such as P, butterfly, and resemblance,
There's no problem.

Effects of the Invention As described above, the present invention (Firstly, by using the U-shaped groove for position regulation to fix the condensing optical lens,
The fixing position of the condensing optical lens can be controlled with great precision.Secondly, the condensing optical lens can be fixed by heating and melting using a low-melting glass material. It becomes possible to stably and highly precisely fix the lower surface of the optical lens for light over the entire surface. Third, by providing an insulated electrode pad for applying current on the stem body, it becomes possible to apply current without applying unnecessary external force to the optical semiconductor element, which improves the reliability of element assembly. It can improve mass productivity.Fourthly, stem storage holder starvation
By providing the electrode pins, it becomes possible to efficiently and stably inspect and measure the electrical and optical characteristics of the optical semiconductor element fixed to the stem. As described above, according to the present invention, it is possible to improve the reliability of optical semiconductor devices in the assembly and inspection of optical semiconductor devices, and at the same time to provide a stem and inspection device for optical semiconductor devices that are extremely mass-producible, resulting in practical effects. is a dog.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are external plan views of an optical semiconductor device and an optical semiconductor device inspection device according to an embodiment of the present invention, and FIG. 3 and 4 are external views and sectional views of essential parts of conventional optical semiconductor devices and modules.

Claims (4)

[Claims] (1) An optical semiconductor device characterized in that an optical semiconductor element stem for mounting an optical semiconductor element has a position regulating U-shaped groove for fixing a condensing optical lens. (2) The optical semiconductor device according to claim 1, characterized in that a condensing optical lens is fixed on the position regulating U-shaped groove using a low melting point glass material. (3) The optical semiconductor device according to claim 1, which has an insulated electrode pad for applying current on the upper surface of the stem. (4) In the inspection device for optical semiconductor devices, claim (3)
In order to inspect and measure the electrical characteristics and optical characteristics of the optical semiconductor element fixed to the stem as described above, the holder has a holder section for storing the stem, and is arranged on the insulating pad section according to claim (3). 1. An inspection device for an optical semiconductor device, characterized in that it is equipped with a pressure-type electrode pin.