JPH04100263A - Semiconductor package - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to semiconductor packages. More specifically, L
The present invention relates to a semiconductor package incorporating a chip carrier on which a semiconductor chip such as an SI chip is mounted.

BACKGROUND OF THE INVENTION With the diversification of electronic devices, various semiconductor packages are being used. When a plurality of semiconductor chips are assembled into one semiconductor package, the semiconductor chips are sometimes mounted on a substrate called a reserved chip carrier, and this chip carrier is fixed to the semiconductor package.

FIG. 3 shows a schematic diagram of a conventional semiconductor package in which a chip carrier is incorporated. In FIG. 3, the semiconductor package 1 has a hollow rectangular parallelepiped shape as a whole, and a plurality of lead electrodes 3 penetrate through the side walls. The chip carrier 2 carrying the semiconductor chip 5 is fixed at a predetermined position on the bottom of the semiconductor package 1 with solder or the like. after that,
Each electrode of the semiconductor chip 5 mounted on the chip carrier 2 and the lead electrode 3 are connected with bonding wires (not shown).

The problem that Hatsuko is trying to solve Conventional semiconductor packages that incorporate chip carriers are simply hollow box-shaped parts with the chip carrier placed at the bottom and glued together. In such a semiconductor package, the mounting position of the chip carrier must be determined accurately. If the position of the chip carrier is not accurate, the distance between the electrodes of the semiconductor chip and the corresponding lead electrodes will not be constant, resulting in poor wiring or a longer wiring process. In addition, in the case of a chip carrier on which an optical element is mounted, if the positioning is not performed accurately when mounting it on a semiconductor package, the optical coupling efficiency between the optical element and external optical equipment will decrease.

Conventionally, therefore, the chip carrier was fixed by accurately measuring the relative position of the chip carrier and the semiconductor package, but this method was extremely time-consuming and inefficient.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor package in which a chip carrier that solves the problems of the prior art described above can be easily and accurately assembled.

Means for Solving the Problems According to the present invention, an internally incorporated chip carrier on which a semiconductor chip is mounted, and electrodes that electrically connect an external device and the semiconductor chip mounted on the chip carrier are connected. A semiconductor package comprising a recess into which the chip carrier is inserted and fixed at a position inside the semiconductor package where the chip carrier is installed, and an adhesive for adhering the chip carrier to a part of the periphery of the recess. Provided is a semiconductor package characterized in that it has a void for storing a surplus amount.

Function: The semiconductor package of the present invention has a recess into which the chip carrier is inserted and fixed, at a position on the bottom surface inside the package where the chip carrier is installed. In addition, for example, this recess has an extra cutout in a part of its periphery to form a gap between the chip carrier and the chip carrier. This is where the excess is stored to prevent the chip carrier from lifting up.

Therefore, it is possible to accurately and easily incorporate a chip carrier into the semiconductor package of the present invention.

Furthermore, if the planar shape of the chip carrier and the planar shape of the recess of the semiconductor package of the present invention are not point symmetrical, the direction of the chip carrier fixed in the recess will always be constant.

EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to Examples, but the following disclosure is merely an example of the present invention and does not limit the technical scope of the present invention in any way.

Embodiment FIG. 1 shows a schematic diagram of a case where a chip carrier is incorporated into a semiconductor package of the present invention. In FIG. 1, a semiconductor package 1, like the conventional semiconductor package shown in FIG. 3, has a hollow rectangular parallelepiped shape as a whole, and a plurality of lead electrodes 3 penetrate through the side walls. A recess 4 into which a chip carrier 2 carrying a semiconductor chip 5 is inserted is formed at the bottom of the semiconductor package. The recess 4 has a notch 41 formed in a part of its periphery, and the chip carrier 2
When the chip carrier 2 is inserted, a gap is created between the notch 41 and the chip carrier 2. An excess amount of the adhesive for bonding the chip carrier 2 accumulates in this gap.

FIGS. 2(a) and 2(b) respectively show plan views when the chip carrier 2 is inserted into the recess 4 of the semiconductor package of the present invention. FIG. 2(a) shows the chip carrier 2
2 is a case in which the planar shape of the chip carrier 2 is a rectangle, and in FIG. If the planar shape of the chip carrier 2 is made into a shape that is not point symmetrical as shown in FIG. be.

As described in detail, in the semiconductor package of the present invention, the position of the chip carrier can be accurately determined without performing positioning when the chip carrier is assembled into the semiconductor package. Therefore, the assembly process can be simplified and production efficiency can be increased.

3. Lead electrode, 4... recess, 5...Semiconductor chip

Claims (1)

[Claims] In a semiconductor package comprising an internally incorporated chip carrier carrying a semiconductor chip, and an electrode for electrically connecting an external device to the semiconductor chip mounted on the chip carrier, the chip inside the semiconductor package A recess into which the chip carrier is inserted and fixed is provided at a position where the carrier is installed, and a gap is provided around a part of the recess to store a surplus of the adhesive for adhering the chip carrier. semiconductor package.