JPH0410196Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an integrated circuit board bottom plate used in manufacturing a ceramic substrate on which an integrated circuit is mounted.

[Conventional technology]

A ceramic substrate provided with a conductive metallized pattern is generally used as a substrate on which an integrated circuit chip is mounted and sealed. This type of ceramic substrate is usually manufactured through the following manufacturing process.

First, alumina powder or barium titanate, flux, solvent, and deflocculant are ground and mixed. A binder plasticizer is then mixed to form the material into a sheet, which is then dried. After drying, a metallization pattern is printed on the material with a paste made of tungsten or the like. This material is then punched into a plurality of rectangular plate shapes and heated and fired in a mixed gas of hydrogen and nitrogen. At that time, the binder is first removed using heat at a temperature of around 350°C, and then magnetization is performed using heat at a temperature of 1200 to 1600°C. The metallized pattern of the porcelain material (substrate) is plated and manufactured into a product.

By the way, when performing the above-mentioned firing process, conventionally, as shown in FIG. 3, a bottom plate 32 is placed on a base plate 30 via a spacer 31, and the porcelain material 33 to be fired is placed on this bottom plate 32. I'm leaving it there. The base plate 30 and the spacer 31 are made of ceramic or molybdenum, and the base plate 32 is made of, for example, a molybdenum base plate (Reference Publication No. 1987-19408). The bottom plates 32 (hereinafter referred to as boats) on which the porcelain material 33 is placed are stacked in multiple stages via spacers 31, and are automatically fed into the electric furnace 34 by a pusher or the like (not shown). Several dozen boats can be fired in the electric furnace 34, from loading into the furnace to firing,
The process from the furnace exit to removal is carried out continuously.

[Problems to be solved by the invention] On the other hand, since the bottom of the electric furnace 34 is generally made of alumina-based bricks, each time the process is repeated, contact with the base plate 30 causes significant wear of both. . As a result, accidents frequently occur in which multiple boats become jammed in the electric furnace 34 due to the boat tilting and falling, or due to the deformation of the base plate 30, a boat to be post-treated runs aground on a boat undergoing pre-treatment. I had a problem that occurs frequently. In order to recover from the accident, it is necessary to lower the temperature of the electric furnace 34, dismantle the furnace, and take out the clogged boat, which takes at least one week. In addition, in the event of an accident, the porcelain material and the floor plate during firing are damaged.
These are generally expensive, and once an accident occurs, the resulting damage can be enormous.

Therefore, in view of the above problems, the purpose of the present invention is to provide a bottom plate for integrated circuit boards that is suitable for preventing accidents caused by wear of the bottom of the furnace and the base plate, and improving product productivity. be.

[Means to solve the problem]

According to the present invention, the present invention includes a molybdenum plate having at least one through hole, a support for passing the through hole, and a base plate for fixing one end of the support. A base plate for an integrated circuit board is obtained, which is characterized in that the molybdenum plate is supported by pillars.

〔Example〕

Hereinafter, the present invention will be explained with reference to the drawings.

FIG. 1 shows an example of a floor plate used to realize the present invention, and FIG. 2 shows an example of a combination of the floor plates. Referring to FIG. 1, a bottom plate 1 made of, for example, molybdenum is provided with at least one through hole 2. The through holes 2 may be located at any location on the molybdenum plate 1, but are preferably located at least at positions that do not interfere with the arrangement of the products 33 to be placed. Also, the shape and size of the through hole 2 may be arbitrary, but for convenience of explanation,
It is assumed to be round with an inner diameter of A [φ].

Next, as shown in FIG. 2, the molybdenum plates 1 are supported by supports, for example, molybdenum rods 20 passing through the through holes, and stacked in multiple stages. The molybdenum rod 20 has a cylindrical shape with a diameter of B [φ] (<A [φ]), but any shape can be selected as long as it can pass through the drilled through hole 2. be. As shown in FIG. 2, the molybdenum rod 20 is
One end of the base plate 30 is fixed or fixed to a base plate 30 made of ceramic or the like, and absorbs the total weight of the molybdenum plate 1 and the stress that the molybdenum plate 1 receives from the outside. In addition, spacers 31 are provided between the molybdenum rods 2 between the base plate 30 and the molybdenum plates 1 and between the molybdenum plates 1 to prevent contact between them.
It is held near 0.

In this way, in this embodiment, the through hole 2 drilled in the molybdenum plate 1 is penetrated by the molybdenum rod 20 fixed or fixed to the base plate 30, so even if the base plate 21 is worn out or exposed to external shock. Even if the molybdenum plates 1 are tilted due to this, the loaded molybdenum plates 1 will not fall down, and the firing process of continuously processed products can proceed smoothly.

〔effect〕

As explained above, according to the present invention, it is possible to provide a bottom plate for integrated circuits that is suitable for preventing accidents caused by wear of the bottom of the furnace and the base plate, and improving product productivity. .

[Brief explanation of the drawing]

FIG. 1 is a front view of a molybdenum plate constituting a bottom plate for an integrated circuit according to this embodiment, FIG. 2 is a configuration diagram of a bottom plate for an integrated circuit according to this embodiment, and FIG. It is a schematic diagram showing an example of use of such a bottom plate for an integrated circuit board. 1...Molybdenum base plate, 2...Through hole, 20...
... Molybdenum rod, 30 ... Base plate, 31 ... Spacer, 32 ... Bottom plate, 33 ... Porcelain material.

Claims (1)

[Scope of utility model registration request] The molybdenum plate is provided with a molybdenum plate having at least one through hole bored therein, a support for passing the through hole, and a base plate for fixing one end of the support. A bottom plate for an integrated circuit board characterized by supporting.