JPH0410223B2 - - Google Patents

Info

Publication number
JPH0410223B2
JPH0410223B2 JP63276564A JP27656488A JPH0410223B2 JP H0410223 B2 JPH0410223 B2 JP H0410223B2 JP 63276564 A JP63276564 A JP 63276564A JP 27656488 A JP27656488 A JP 27656488A JP H0410223 B2 JPH0410223 B2 JP H0410223B2
Authority
JP
Japan
Prior art keywords
package
aluminum alloy
integrated circuit
microwave integrated
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP63276564A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02122548A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP63276564A priority Critical patent/JPH02122548A/ja
Priority to DE68926211T priority patent/DE68926211T2/de
Priority to EP89119744A priority patent/EP0366082B1/en
Publication of JPH02122548A publication Critical patent/JPH02122548A/ja
Priority to US07/668,794 priority patent/US5132776A/en
Publication of JPH0410223B2 publication Critical patent/JPH0410223B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Laser Beam Processing (AREA)
  • Plasma Technology (AREA)
JP63276564A 1988-10-28 1988-10-31 マイクロ波集積回路装置用パッケージ Granted JPH02122548A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63276564A JPH02122548A (ja) 1988-10-31 1988-10-31 マイクロ波集積回路装置用パッケージ
DE68926211T DE68926211T2 (de) 1988-10-28 1989-10-24 Träger für eine Halbleiteranordnung
EP89119744A EP0366082B1 (en) 1988-10-28 1989-10-24 Member for carrying semiconductor device
US07/668,794 US5132776A (en) 1988-10-28 1991-03-06 Member for carrying a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63276564A JPH02122548A (ja) 1988-10-31 1988-10-31 マイクロ波集積回路装置用パッケージ

Publications (2)

Publication Number Publication Date
JPH02122548A JPH02122548A (ja) 1990-05-10
JPH0410223B2 true JPH0410223B2 (pl) 1992-02-24

Family

ID=17571244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63276564A Granted JPH02122548A (ja) 1988-10-28 1988-10-31 マイクロ波集積回路装置用パッケージ

Country Status (1)

Country Link
JP (1) JPH02122548A (pl)

Also Published As

Publication number Publication date
JPH02122548A (ja) 1990-05-10

Similar Documents

Publication Publication Date Title
US6653741B2 (en) Thermal interface material and heat sink configuration
US7187083B2 (en) Thermal interface material and solder preforms
KR960010166B1 (ko) 확산접합된 스패터링타게트조립체 및 그 제조방법
US4760240A (en) Process for laser welding of aluminum based elements
US4078711A (en) Metallurgical method for die attaching silicon on sapphire devices to obtain heat resistant bond
JP5041102B2 (ja) 鉛フリーはんだ合金、接合用部材及びその製造法、並びに電子部品
JPWO2002078085A1 (ja) 電子部品用パッケージおよびその製造方法
WO1994003037A1 (en) Sealable electronics packages and methods of producing and sealing such packages
JPH02304958A (ja) 電子回路装置
US5132776A (en) Member for carrying a semiconductor device
JPH08102570A (ja) セラミックス回路基板
JP2748629B2 (ja) 半導体装置収納用ハウジングおよびその製造方法
JP3469261B2 (ja) 拡散接合されたスパッタリングターゲット組立体及びその製造方法
JPH02122548A (ja) マイクロ波集積回路装置用パッケージ
JP2003306730A (ja) Ａｌ−ＳｉＣ系複合体および放熱部品
JP2002299532A (ja) Ａｌ−ＳｉＣ系複合体および放熱部品
JPS6325501B2 (pl)
JP2584842B2 (ja) 鉛系高融点はんだ合金
JP2001284509A (ja) Ａｌ−ＳｉＣ複合体
Iikawa et al. Aluminum alloy package for microwave amplifier
JPH05326574A (ja) 半導体素子のダイボンディング方法
JPH03295871A (ja) アルミナセラミックと金属との接合方法
JPH02208031A (ja) 回路基板の製造方法
JPS63165095A (ja) 積層型構造体の製造方法
JPH03281093A (ja) 耐熱性高気密性ハンダ