JPH04102575U - wiring structure - Google Patents

wiring structure

Info

Publication number
JPH04102575U
JPH04102575U JP3812091U JP3812091U JPH04102575U JP H04102575 U JPH04102575 U JP H04102575U JP 3812091 U JP3812091 U JP 3812091U JP 3812091 U JP3812091 U JP 3812091U JP H04102575 U JPH04102575 U JP H04102575U
Authority
JP
Japan
Prior art keywords
wiring
insertion hole
bent portion
lead wire
wiring member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3812091U
Other languages
Japanese (ja)
Inventor
滋視 榎
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP3812091U priority Critical patent/JPH04102575U/en
Publication of JPH04102575U publication Critical patent/JPH04102575U/en
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】 【目的】 この考案の目的は、大電流回路を設ける場
合、熱によるパターンの剥がれや電子部品のリード線の
切断を防止したプリント配線基板の配線構体を提供する
ことである。 【構成】 この考案は、配線パターンと任意の位置に設
けられた挿入孔(9)とを有するプリント配線基板
(1)と、導電体で形成されこの導電体の一部分を折り
曲げて折曲部(10)とした配線部材(8)とから構成
され、プリント配線基板(1)の挿入孔(9)に配線部
材(8)の折曲部(10)を挿入して配線パターンと配
線部材(8)とを接続したものである。
(57) [Summary] [Purpose] The purpose of this invention is to provide a wiring structure for a printed wiring board that prevents peeling of patterns and cutting of lead wires of electronic components due to heat when a large current circuit is installed. . [Structure] This invention consists of a printed wiring board (1) having a wiring pattern and an insertion hole (9) provided at an arbitrary position, and a bent portion (1) formed of a conductor by bending a part of the conductor. 10) and a wiring member (8), the bent part (10) of the wiring member (8) is inserted into the insertion hole (9) of the printed wiring board (1) to form the wiring pattern and the wiring member (8). ) are connected.

Description

【考案の詳細な説明】[Detailed explanation of the idea]

【0001】0001

【産業上の利用分野】[Industrial application field]

この考案は、自動車の電装ユニット等でプリント配線基板上に大電流回路を設 ける場合のプリント配線基板の配線構体に関する。 This idea is based on the installation of high-current circuits on printed wiring boards in automobile electrical units, etc. The present invention relates to a wiring structure of a printed wiring board when the wiring structure is used.

【0002】0002

【従来の技術】[Conventional technology]

パワートランジスタやパワーFET等の半導体2のプリント配線基板1への取 付けは、図8に示すように、半導体2のリード線3をプリント配線基板1に単独 で半田付けし、ノイズ吸収用のコンデンサ4にパターン5を介して電気的に接続 したものが知られている。半導体2は放熱板6上に載置される。符号7は入出力 コネクタである。 Mounting semiconductors 2 such as power transistors and power FETs on printed wiring board 1 As shown in FIG. 8, the lead wires 3 of the semiconductor 2 are attached to the printed wiring board 1 separately solder and electrically connect to noise absorption capacitor 4 via pattern 5. What has been done is known. Semiconductor 2 is placed on heat sink 6 . Code 7 is input/output It is a connector.

【0003】0003

【考案が解決しようとする課題】[Problem that the idea aims to solve]

半導体2とコンデンサ4との間には大電流が流れるために、パターン5が熱に より剥がれてしまうおそれがあるとともに、リード線3に外力が加わるとリード 線3の切断のおそれもあり、信頼性に欠けていた。 Since a large current flows between the semiconductor 2 and the capacitor 4, the pattern 5 becomes heated. There is a risk that the lead wire 3 will peel off, and if external force is applied to the lead wire 3, the lead wire There was also a risk that wire 3 would be cut, resulting in a lack of reliability.

【0004】 そこで、この考案は、大電流回路を設ける場合、熱によるパターンの剥がれや 電子部品のリード線の切断を防止したプリント配線基板の配線構体を提供するこ とを目的とする。0004 Therefore, this idea prevents the pattern from peeling off due to heat when installing a large current circuit. To provide a wiring structure for a printed wiring board that prevents lead wires of electronic components from being cut. aimed to.

【0005】[0005]

【課題を解決するための手段】[Means to solve the problem]

上述の目的を達成するため、第1の考案は、配線パターンと任意の位置に設け られた挿入孔とを有するプリント配線基板と、導電体で形成されたこの導電体の 一部分を折り曲げて折曲部とした配線部材とから構成され、前記プリント配線基 板の前記挿入孔に前記配線部材の前記折曲部を挿入して前記配線パターンと前記 配線部材とを接続したものである。第2の考案は、折曲部にリード線と係合する 係合部を有するものであり、第3の考案は係合部が折曲部の一部を切欠いて形成 されたものである。第4の考案は、配線パターンに第1の挿入孔と第2の挿入孔 を設け、折曲部を第1の挿入孔の形状と略同形状の断面を有する柱状に形成し、 第1の挿入孔に折曲部を第2の挿入孔に電子部品のリード線を挿入し、前記折曲 部,前記リード線,前記配線パターンを接続したものである。 In order to achieve the above purpose, the first idea is to connect the wiring pattern and the A printed wiring board having an insertion hole formed of a conductive material and a conductive material formed of a conductive material. The printed wiring board is composed of a wiring member that is partially bent to form a bent part. The bent portion of the wiring member is inserted into the insertion hole of the board to connect the wiring pattern and the It is connected to the wiring member. The second idea is to engage the lead wire at the bent part. In the third invention, the engaging part is formed by cutting out a part of the bent part. It is what was done. The fourth idea is to provide a first insertion hole and a second insertion hole in the wiring pattern. and forming the bent part into a columnar shape having a cross section substantially the same as the shape of the first insertion hole, Insert the bent part into the first insertion hole and the lead wire of the electronic component into the second insertion hole, and , the lead wire, and the wiring pattern are connected to each other.

【0006】[0006]

【作用】[Effect]

この考案では、プリント配線基板の挿入孔に配線部材の折曲部を挿入して接続 したので、大電流を通すことが可能となり、パターン接続よりも強度も向上する 。また、配線部材の係合部には電子部品のリード線と係合する係合部を設けたの で配線部材と電子部品の両者を確実かつ堅牢に半田付けすることができることと なる。 With this idea, the bent part of the wiring member is inserted into the insertion hole of the printed wiring board and connected. Therefore, it is possible to pass a large current, and the strength is also improved compared to pattern connection. . In addition, the engaging part of the wiring member is provided with an engaging part that engages with the lead wire of the electronic component. It is possible to reliably and robustly solder both wiring members and electronic components with Become.

【0007】[0007]

【実施例】【Example】

以下に、この考案の好適な実施例を図面を参照にして説明する。 Preferred embodiments of this invention will be described below with reference to the drawings.

【0008】 図1は、本考案による配線構体の組み立て状況を示した図である。図2,図3 は、本考案による配線構体の組み立て完成状態を示した図である。尚、従来の技 術と同じ部分については説明を省略する。[0008] FIG. 1 is a diagram showing how a wiring structure according to the present invention is assembled. Figure 2, Figure 3 FIG. 1 is a diagram showing a completed state of assembly of a wiring structure according to the present invention. In addition, conventional techniques Explanation of the same parts as the technique will be omitted.

【0009】 図1(a),(b)に示すように8は、銅板等の導電性材料で成形された配線 部材である。10は、配線部材8の一部を下方に折り曲げて成形し、プリント配 線基板1に穿たれた挿入孔9に挿入される折曲部である。11は、折曲部10の 一部を切欠いて成形し、電子部品のリード線と係合する係合部である。この折曲 部11と対向する反対側の端部にも折曲部10′と係合部11′を形成してある 。14は配線部材8を入出力コネクタ7やプリント配線基板1を取付けるための 取付穴である。[0009] As shown in FIGS. 1(a) and (b), 8 is a wiring formed of a conductive material such as a copper plate. It is a member. 10, a part of the wiring member 8 is bent downward and molded to form a printed wiring board. This is a bent portion inserted into an insertion hole 9 drilled in the wire board 1. 11 is the bending portion 10; This is an engaging portion that is formed by cutting out a portion and engages with the lead wire of an electronic component. this bend A bent part 10' and an engaging part 11' are also formed at the opposite end facing the part 11. . 14 is for attaching the wiring member 8 to the input/output connector 7 and the printed wiring board 1. It is a mounting hole.

【0010】 このような構成において、配線部材8の折曲部10はプリント配線基板1に設 けた挿入孔9に挿入し、この折曲部10,10′の個所に形成された係合部11 ,11′に半導体2やコンデンサ4のリード線3,4Aを係合する。配線部材8 の取付穴14には入出力コネクタ7のリード線7Aを取付ける。半導体2をプリ ント配線基板1に取付けた状態は、図2に示すようになり、半導体2のリード線 3は配線部材8の係合部11に係合する。尚、図1,図2では配線部材8とリー ド線3との係合状態がよく分るように半導体2の1本のリード線3のみを配線部 材8と係合した状態を図示し、他のリード線3については省略したが、図3に示 すように他のリード線についても配線部材8を用いて配線することもできる。図 4,図5,図6は本考案の他の実施例である。0010 In such a configuration, the bent portion 10 of the wiring member 8 is installed on the printed wiring board 1. The engaging portion 11 is inserted into the girder insertion hole 9 and formed at the bent portions 10 and 10'. , 11' are engaged with the lead wires 3 and 4A of the semiconductor 2 and the capacitor 4. Wiring member 8 The lead wire 7A of the input/output connector 7 is attached to the attachment hole 14 of. Print semiconductor 2 The state in which the semiconductor 2 is attached to the wiring board 1 is as shown in Figure 2, and the lead wires of the semiconductor 2 are 3 engages with the engagement portion 11 of the wiring member 8. In addition, in FIGS. 1 and 2, the wiring member 8 and the lead Only one lead wire 3 of the semiconductor 2 is connected to the wiring section so that the engagement state with the lead wire 3 can be clearly seen. The figure shows the state in which the lead wire 3 is engaged with the lead wire 8, and the other lead wires 3 are omitted, but they are shown in FIG. Other lead wires can also be wired using the wiring member 8 as shown in FIG. figure 4, FIG. 5, and FIG. 6 are other embodiments of the present invention.

【0011】 図4は配線部材8の折曲部10の先端部12に傾斜を設けたものである。こう することにより配線部材8をプリント基板1に実装する際に折曲部10が挿入孔 9により入り易くなる。[0011] In FIG. 4, the tip end portion 12 of the bent portion 10 of the wiring member 8 is provided with an inclination. like this By doing so, when mounting the wiring member 8 on the printed circuit board 1, the bent portion 10 is inserted into the insertion hole. 9 makes it easier to enter.

【0012】 図5は配線部材8の係合部11の中をこれと係合するリード線3の巾又は直径 よりも若干小さくすることにより(A<B)リード線3が係合部11に挟持され るようにしたものである。0012 FIG. 5 shows the width or diameter of the lead wire 3 that engages inside the engaging portion 11 of the wiring member 8. By making it slightly smaller than (A<B), the lead wire 3 can be held between the engaging part 11. It was designed so that

【0013】 また、図6(a),(b)は折曲部10をプレス加工により略V字状に形成し たものであり、断面図図6(b)に示すように、折曲部10とリード線3とを一 緒に挿入孔9に挿入して固定するものである。このようにすれば折曲部10のV 字部(係合部11となる)でリード線3を挟持できる。また、挿入孔9を従来の 円形とすることができ、取付強度も向上する。図2に示すように各部品を取付け た後、配線部材8とパワートランジスタ等の半導体2とは確実かつ堅牢に半田付 けできる。この実施例ではコンデンサ4のリード線4Aと配線部材8とも確実か つ堅牢に半田付けできる。また入出力コネクタ7のリード線7Aも配線部材8に 確実に取付く。[0013] In addition, in FIGS. 6(a) and 6(b), the bent portion 10 is formed into a substantially V-shape by press working. As shown in the cross-sectional view of FIG. 6(b), the bent portion 10 and the lead wire 3 are aligned. It is inserted into the insertion hole 9 together and fixed. By doing this, the V of the bent portion 10 The lead wire 3 can be held between the shaped portions (which become the engaging portions 11). In addition, the insertion hole 9 is It can be made circular, and the mounting strength is also improved. Attach each part as shown in Figure 2. After that, the wiring member 8 and the semiconductor 2 such as a power transistor are reliably and firmly soldered. I can do it. In this example, are the lead wires 4A of the capacitor 4 and the wiring member 8 secure? Can be soldered firmly. In addition, the lead wire 7A of the input/output connector 7 is also connected to the wiring member 8. Attach securely.

【0014】 また、図7(a),(b)に示すにように、プリント基板1に半導体2のリー ド線3を挿入する挿入孔14と、配線部材8の折曲部10を挿入する挿入孔15 と、挿入孔14,15をつなぐ配線パターン16とを設け、さらに、折曲部10 をプレス加工により角柱状又は、丸柱状に形成する。[0014] Furthermore, as shown in FIGS. 7(a) and 7(b), the lead of the semiconductor 2 is placed on the printed circuit board 1. An insertion hole 14 into which the cable 3 is inserted, and an insertion hole 15 into which the bent portion 10 of the wiring member 8 is inserted. and a wiring pattern 16 connecting the insertion holes 14 and 15. is formed into a prismatic or round column shape by press working.

【0015】 挿入孔14にリード線3を挿入し、挿入孔15に折曲部10を挿入し、通常の 半田付けと同様に、配線パターン16に半田付けする。このようにすれば、プリ ント基板1に特殊な形状の挿入孔をあける必要もなく、取付けも通常の半田付け で良い。また、図6に示した実施例のように挿入孔9と折曲部10の間にすき間 があると半田付けの際に半田が上らず、接続不良が発生するが、折曲部を丸柱形 にプレス加工で成形しておけば、すき間ができず半田付不良も防止できる。尚、 配線パターン16は通常の銅箔であるが、挿入孔14,15を近接して設けると ともに、配線パターン16に半田盛りを施せば、抵抗値を下げることができるの で、大電流が流れても問題は無い。[0015] Insert the lead wire 3 into the insertion hole 14, insert the bent part 10 into the insertion hole 15, and then Solder is applied to the wiring pattern 16 in the same manner as soldering. If you do this, you can There is no need to drill a specially shaped insertion hole on the main board 1, and installation can be done by normal soldering. That's fine. In addition, as in the embodiment shown in FIG. If there is a bend, the solder will not go up during soldering and a connection failure will occur. If it is formed by press processing, there will be no gaps and poor soldering can be prevented. still, The wiring pattern 16 is made of ordinary copper foil, but if the insertion holes 14 and 15 are provided close to each other, In both cases, the resistance value can be lowered by applying solder to the wiring pattern 16. There is no problem even if a large current flows.

【0016】[0016]

【考案の効果】[Effect of the idea]

以上説明したように、本考案の配線構体によれば、導電体の一部を折り曲げて 形成した折曲部を有する配線部材をプリント配線基板に設けた挿入孔に折曲部を 挿入して電気的に接続したので、配線パターンのみで配線したときよりも大電流 を流すことができる。また、従来のパターンの代わりに配線部材があるため、パ ターンの剥がれは全く生じない。又、折曲部の一部分を切欠いて係合部を設け、 ここに電子部品のリード線を係合するようにしたので、半導体のリード線に外力 が加わってもリード線の切断のおそれもなく、半導体のリード線と配線部材とは 強固かつ堅牢に半田付けすることができる。 As explained above, according to the wiring structure of the present invention, a part of the conductor is bent. Insert the wiring member having the bent portion into the insertion hole provided on the printed wiring board. Since it is inserted and electrically connected, the current is higher than when wiring with only the wiring pattern. can flow. Also, since there is a wiring member instead of a conventional pattern, the pattern No peeling of turns occurs at all. Further, a part of the bent part is cut out to provide an engaging part, Since the lead wire of the electronic component is engaged here, no external force is applied to the lead wire of the semiconductor. There is no risk of lead wires being cut even when Can be soldered firmly and robustly.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】(a)は半導体取付け前の状態を示す分解斜視
図、(b)は配線部材の斜視図。
FIG. 1(a) is an exploded perspective view showing a state before mounting a semiconductor, and FIG. 1(b) is a perspective view of a wiring member.

【図2】取付時における斜視図。FIG. 2 is a perspective view when installed.

【図3】配線部材を2つ使用した状態の斜視図。FIG. 3 is a perspective view of a state in which two wiring members are used.

【図4】(a),(b)ともに配線部材の他例を示す
図。
FIGS. 4(a) and 4(b) are diagrams showing other examples of wiring members.

【図5】(a),(b)ともに配線部材の他例を示す
図。
FIGS. 5(a) and 5(b) are diagrams showing other examples of wiring members.

【図6】(a),(b)ともに配線部材の他例を示す
図。
FIGS. 6(a) and 6(b) are diagrams showing other examples of wiring members.

【図7】(a),(b)ともに配線部材の他例を示す
図。
FIGS. 7(a) and 7(b) are diagrams showing other examples of wiring members.

【図8】従来例を示す斜視図。FIG. 8 is a perspective view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 プリント配線基板 2 半導体 3 リード線 4 コンデンサ 8 配線部材 9 挿入孔 10 折曲部 11 係合部 1 Printed wiring board 2 Semiconductor 3 Lead wire 4 Capacitor 8 Wiring components 9 Insertion hole 10 Bend part 11 Engagement part

─────────────────────────────────────────────────────
──────────────────────────────────────────────── ───

【手続補正書】[Procedural amendment]

【提出日】平成4年2月3日[Submission date] February 3, 1992

【手続補正1】[Procedural amendment 1]

【補正対象書類名】明細書[Name of document to be amended] Specification

【補正対象項目名】図面の簡単な説明[Name of item to be corrected] Brief explanation of the drawing

【補正方法】変更[Correction method] Change

【補正内容】[Correction details]

【図面の簡単な説明】[Brief explanation of drawings]

【図1】 (a)は半導体取付け前の状態を示す分解斜
視図、(b)は配線部材の斜視図。
FIG. 1(a) is an exploded perspective view showing a state before mounting a semiconductor, and FIG. 1(b) is a perspective view of a wiring member.

【図2】 取付時における斜視図。[Fig. 2] Perspective view when installed.

【図3】 配線部材を2つ使用した状態の斜視図。FIG. 3 is a perspective view of a state in which two wiring members are used.

【図4】 配線部材の他例を示す図FIG. 4 is a diagram showing another example of the wiring member .

【図5】 配線部材の他例を示す図FIG. 5 is a diagram showing another example of the wiring member .

【図6】 (a),(b)ともに配線部材の他例を示す
図。
FIG. 6 (a) and (b) are diagrams showing other examples of wiring members.

【図7】 (a),(b)ともに配線部材の他例を示す
図。
FIG. 7 (a) and (b) are diagrams showing other examples of wiring members.

【図8】 従来例を示す斜視図。FIG. 8 is a perspective view showing a conventional example.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 配線パターンと任意の位置に設けられた
挿入孔とを有するプリント配線基板と、導電体で形成さ
れたこの導電体の一部分を折り曲げて折曲部とした配線
部材とから構成され、前記プリント配線基板の前記挿入
孔に前記配線部材の前記折曲部を挿入して前記配線パタ
ーンと前記配線部材とを接続したことを特徴とする配線
構体。
1. A printed wiring board having a wiring pattern and an insertion hole provided at an arbitrary position, and a wiring member formed of a conductive material by bending a part of the conductive material to form a bent part. . A wiring structure, wherein the bent portion of the wiring member is inserted into the insertion hole of the printed wiring board to connect the wiring pattern and the wiring member.
【請求項2】 前記折曲部は電子部品のリード線と係合
する係合部を有することを特徴とする請求項1記載の配
線構体
2. The wiring structure according to claim 1, wherein the bent portion has an engaging portion that engages with a lead wire of an electronic component.
【請求項3】 前記折曲部の前記係合部は前記折曲部の
一部を切欠いて形成したことを特徴とする請求項1記載
の配線構体。
3. The wiring structure according to claim 1, wherein the engaging portion of the bent portion is formed by cutting out a part of the bent portion.
【請求項4】 前記配線パターンに第1の挿入孔と第2
の挿入孔を設け、前記折曲部を前記第1の挿入孔の形状
と略同形状の断面を有する柱状に形成し、前記第1の挿
入孔に前記折曲部を前記第2の挿入孔に前記電子部品の
リード線を挿入し、前記折曲部、前記リード線、前記配
線パターンを接続したことを特徴とする請求項1記載の
配線構体。
4. The wiring pattern has a first insertion hole and a second insertion hole.
an insertion hole is provided, the bent portion is formed into a columnar shape having a cross section approximately the same shape as the first insertion hole, and the bent portion is inserted into the first insertion hole and inserted into the second insertion hole. 2. The wiring structure according to claim 1, wherein a lead wire of said electronic component is inserted into said bent portion, said lead wire, and said wiring pattern are connected to said bent portion.
JP3812091U 1990-04-25 1991-04-25 wiring structure Pending JPH04102575U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3812091U JPH04102575U (en) 1990-04-25 1991-04-25 wiring structure

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4423890 1990-04-25
JP2-44238 1990-04-25
JP3812091U JPH04102575U (en) 1990-04-25 1991-04-25 wiring structure

Publications (1)

Publication Number Publication Date
JPH04102575U true JPH04102575U (en) 1992-09-03

Family

ID=31948492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3812091U Pending JPH04102575U (en) 1990-04-25 1991-04-25 wiring structure

Country Status (1)

Country Link
JP (1) JPH04102575U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015023042A (en) * 2013-07-16 2015-02-02 三菱電機株式会社 Circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015023042A (en) * 2013-07-16 2015-02-02 三菱電機株式会社 Circuit board

Similar Documents

Publication Publication Date Title
US6354871B1 (en) Connector-mounted substrate and method for assembling the same
JPS5998591A (en) Double-sided circuit connection method
JPH06275328A (en) Printed circuit board lead terminal and mounting method
KR100353231B1 (en) Printed-Wiring Board Manufacturing Method, the Printed-Wiring Board, and Double-sided Pattern Conducting Component Used Therein
JPH08331865A (en) Inverter device
JPH04102575U (en) wiring structure
CN114600211B (en) Contact system with a joining auxiliary element and method for joining
JP2002299000A (en) Method of joining flexible printed circuit board and connection terminal
JP3424685B2 (en) Electronic circuit device and method of manufacturing the same
JP3058502U (en) Flat flexible cable and its terminal parts
US20060240684A1 (en) Soldering method &amp; its applied circuit board
JPS63301473A (en) Connecting terminal
JPS6236371B2 (en)
JPH03252192A (en) Hybrid integrated circuit component and assembly thereof
JP3201336B2 (en) Large current substrate and manufacturing method thereof
JP2001250606A (en) Connection terminal for circuit board and circuit board having the same
JP3354308B2 (en) Large current circuit board and method of manufacturing the same
JPH0616426Y2 (en) connector
JP2006210684A (en) Connection structure between printed circuit boards
JP2556435Y2 (en) Ground structure of heat sink
JPH0710969U (en) Printed board
JPH0541521Y2 (en)
JPH06223911A (en) PCB connector
JPS61142790A (en) Mounting of part for printed circuit board
JP3042148U (en) Printed wiring board