JPH0410341U - - Google Patents
Info
- Publication number
- JPH0410341U JPH0410341U JP5072390U JP5072390U JPH0410341U JP H0410341 U JPH0410341 U JP H0410341U JP 5072390 U JP5072390 U JP 5072390U JP 5072390 U JP5072390 U JP 5072390U JP H0410341 U JPH0410341 U JP H0410341U
- Authority
- JP
- Japan
- Prior art keywords
- water
- cooled heat
- heat sinks
- bodies
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000498 cooling water Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Description
第１図は本考案の半導体スタツクの一実施例を
示す平面図、第２図は第１図の−線に沿つて
矢印方向に見た正面図、第３図は第１図の−
線に沿つて切断し矢印方向に見た断面図、第４図
は従来の半導体スタツクの一例を示す平面図、第
５図は第４図の−線に沿つて矢印方向に見た
正面図である。
１……半導体素子、２……水冷ヒートシンク、
３……絶縁座、４，５……押え板、７……口金、
２１，２２……冷却水パイプ、２３……絶縁チユ
ーブ。
FIG. 1 is a plan view showing an embodiment of the semiconductor stack of the present invention, FIG. 2 is a front view taken along the - line in FIG. 1 in the direction of the arrow, and FIG.
4 is a plan view showing an example of a conventional semiconductor stack, and FIG. 5 is a front view taken along the line - in FIG. 4 and viewed in the direction of the arrow. be. 1... Semiconductor element, 2... Water-cooled heat sink,
3... Insulating seat, 4, 5... Holding plate, 7... Cap,
21, 22... Cooling water pipe, 23... Insulating tube.
Claims (1)
ヒートシンクを交互に複数個積層した半導体スタ
ツク本体と、 この半導体スタツク本体の積層方向の両側に配
設され、各前記半導体素子と前記各水冷ヒートシ
ンクに押圧力を与えるための第１および第２の押
え体と、 この第１および第２の押え体間であつて、前記
半導体素子と前記水冷ヒートシンクの外周側に配
置され、前記押え体間を直接機械的に連結し、前
記各水冷ヒートシンク内の冷却水が流通可能な少
なくとも２つの絶縁チユーブ とを備えた半導体スタツク。[Claims for Utility Model Registration] A semiconductor stack body in which a plurality of semiconductor elements and a plurality of water-cooled heat sinks through which cooling water can flow are laminated alternately; first and second presser bodies for applying a pressing force to the semiconductor element and each of the water-cooled heat sinks; disposed between the first and second presser bodies on the outer peripheral side of the semiconductor element and the water-cooled heat sink; and at least two insulating tubes that directly mechanically connect the holding bodies and allow cooling water in each of the water-cooled heat sinks to flow therethrough.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5072390U JPH0410341U (en) | 1990-05-17 | 1990-05-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5072390U JPH0410341U (en) | 1990-05-17 | 1990-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410341U true JPH0410341U (en) | 1992-01-29 |
Family
ID=31569519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5072390U Pending JPH0410341U (en) | 1990-05-17 | 1990-05-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410341U (en) |
-
1990
- 1990-05-17 JP JP5072390U patent/JPH0410341U/ja active Pending