JPH0410560A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To enable a semiconductor element to be easily replaced with another one by a method wherein a hole is provided to a case at a prescribed position, a conductive sheet is provided to a part of a board exposed at the hole concerned, only a semiconductor element is mounted on the conductive sheet, and a lid is screwed into the peripheral part of the hole of the case to connect the semiconductor element by pressing. CONSTITUTION:A conductive sheet 6 and a semiconductor element 7 are successively mounted on a board 1 exposed through a hole 5, and the semiconductor 7 is connected by pressing with a lid 10. That is, a protrudent end 10a of the lid 10 is inserted into the corner of the hole 5, and the lid 10 is made to turn toward the tapered surface of a screw 5a high in gradient. Then, the semiconductor element 7 is pressed down with the turning of the lid 10 and connected to a conductive path 2 by pressure through the conductive sheet 6. The conductive sheet 6 is used, and the semiconductor element 7 is pressed by screwing the lid 10, whereby a writable, erasable semiconductor element 7 can be connected to the conductive path 2 provided to the board 1 without soldering. In result, the semiconductor element 7 can be easily replaced with another one by taking off the lid 10 from the hole 6 of the case 4.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to a hybrid integrated circuit equipped with a resin-sealed semiconductor element having writable and erasable data.

(B) Conventional technology Usually, as shown in FIG. 5, a hybrid integrated circuit has a plurality of circuit elements (22) fixed on a hybrid integrated circuit board (21).
A resin case material (23) is fixed and integrated with the hybrid integrated circuit board (21>) in order to hermetically seal the circuit element (22).

When a semiconductor element such as an EPROM or micro-chip capable of writing and erasing predetermined data is fixedly mounted on a hybrid integrated circuit, the semiconductor chip (24) is mounted on a substrate (21) as shown in FIG. 3. Semiconductor device (25) in which the semiconductor chip is completely sealed with resin, as shown in Figure 7.
It was common to have a structure in which the capacitor was soldered onto a substrate (21) and sealed with a case material (23).

(c) Problems to be Solved by the Invention In hybrid integrated circuits such as EFROMs or microcomputers that have built-in semiconductor elements that can write and erase predetermined data, the case material is fixed and integral. If there was a change in element data, the hybrid integrated circuit itself had to be replaced.

The reason for this is that it is extremely difficult to replace the semiconductor element itself. Furthermore, there is a risk that other elements may be damaged during replacement.

In addition, when performing high-mix, low-volume production using conventional hybrid integrated circuit structures, different data on semiconductor devices such as EFROMs require different types of manufacturing lines or manufacturing equipment, and the manufacturing period becomes longer and manufacturing costs increase. The problem is that it gets expensive.

(Means for Solving the Phantom Problems) The present invention has been made in view of the above-mentioned problems, and includes an integrated circuit board, a conductive path of a desired shape formed on the board, and a connection with the conductive path on the board. A case material is provided that is integrated with the substrate and a plurality of circuit elements and resin-sealed semiconductor elements, and a hole is provided at a predetermined position of the case material, and a conductive material is formed on the substrate exposed through the hole. A conductive sheet is disposed, only the semiconductor element is mounted on the conductive sheet, and the semiconductor element is press-connected by screwing the peripheral edge of the hole of the case material to the lid.

(E) Function As described above, according to the present invention, a hole is formed at a predetermined position in the case material, a conductive sheet is placed on the substrate exposed through the hole, and predetermined program data is written on the sheet. The semiconductor element is mounted on the semi-FB (') by screwing the peripheral edge of the hole of the case material and the lid body and pressingly connecting the semiconductor element to the conductive path without cutting. be able to.

Further, since the press connection is made by screwing the case material and the lid, there is no need to solder as described above, and the semiconductor element can be attached and detached very easily.

(F) Embodiment The hybrid integrated circuit of the present invention will be explained in detail below based on the embodiment shown in FIG.

As shown in FIG. 1, the hybrid integrated circuit of the present invention includes an integrated circuit substrate (1), a conductive path (2) of a desired shape formed on the substrate (<1), and a connection with the conductive path (2). A case material (4) that is integrally fixed to the substrate (1) and has a hole (5) at a desired position, and a plurality of circuit elements (3) that are It is composed of a fully mounted conductive plate (6) and a resin-sealed semiconductor element (7) placed on the conductive sheet (6).

A ceramic or metal substrate is used as the integrated circuit board (1), and in this embodiment, a metal substrate with excellent heat dissipation properties is used. An aluminum substrate is used as the substrate (1), and an aluminum oxide lamb film is formed on the surface of the aluminum substrate for insulation. In addition to the aluminum substrate, it is also possible to use a substrate made of iron, enamel, silicon steel, or the like.

A copper foil is adhered onto the substrate (1) via a thin insulating resin layer (not shown), and the copper foil is etched into a desired shape to form a conductive path (8) in a desired shape. A plurality of circuit elements (3) such as transistors, ICs, and LSI chips, and a plurality of electronic components (3) such as chip resistors and chip capacitors are fixed on the conductive path (2).

The circuit element (3) and electronic component (3) fixed on the substrate (1) are hermetically sealed between the substrate (1) and the fixed resin case material (4). placed within the parking space.

The case material (4) is made of thermoplastic resin as an insulating member, and is formed into a box shape so that a space is formed when it is fixed to the substrate (1).The box-shaped case material (4) The circumferential edge of the substrate (1) is sealed with an adhesive sealant (J-sheet: trade name) placed approximately at the circumferential edge of the substrate (1).
It is firmly fixed and fixed together. As a result, a predetermined sealed space (8) is formed between the substrate (1>) and the case material (4). Furthermore, a hole (5) is provided in the case material (4). The hole (5) is designed to be slightly larger than the semiconductor element (7) in order to facilitate the insertion and removal of a semiconductor element (7), which will be described later.

A lid body (10) to be described later is provided on the peripheral edge of the hole (5>), and a threaded part (5a) which contributes to the press connection of the semiconductor element (7) by threading is provided.

FIG. 2 is an enlarged plan view of the main part of the case material (4) in which the hole (5) is provided, and the area between the peripheral edge of the rectangular hole (5) and the dotted line is a screw hole. This is the attachment part (5a), and the area surrounded by the dashed line indicates the area fixed to the substrate (1).

The threaded part (5a) is formed in a rectangular shape between one side of the peripheral edge of the hole (5). In other words, in FIG.
) are A, B, C, and D. When corner A is viewed in the direction of arrow The tapered surface is shaped like a step,
Further, when corner C is viewed from the direction of arrow Y, as shown in the same figure (Y), the tapered surface at C is formed in a step-like shape. That is,
The threaded portions (5a) are formed stepwise at each corner of the hole (5).

Incidentally, a plate-shaped conductive sheet (6) is placed on the substrate (1) exposed through the hole (5). Conductive sheet (
6) is an elastic insulating sheet made of rubber or synthetic resin, which is formed into a plate shape as shown in Fig. 4, and has a plurality of linear conductors (6a) embedded in its thickness direction, making it conductive. A plurality of linear conductors (6a) protrude from both sides of the sheet (6). Such conductive sheet (6)
It is described in Japanese Patent Application Laid-Open No. 59-58709.

This conductive sheet (6) is formed to be similar to or slightly smaller than the hole (5), and a resin-sealed semiconductor element (7) is placed on this sheet (5).

The semiconductor element (7) is, for example, a flip-flop type semiconductor element (7) in which a writable and erasable ROM chip such as an EPROM SEEPROM microcomputer is sealed with resin. The semiconductor element (7) has a plurality of electrodes (
7a) is provided, and the electrode (7a) can be connected to the conductive path (2) via the conductive sheet (6).

Needless to explain, the substrate (1) exposed through the hole (5)
A plurality of conductive paths (2) for connecting to semiconductor elements (7) are formed extending on the top.

A conductive sheet (6) and a semiconductor element (7) are sequentially mounted on the substrate (1) exposed by the case material (5), and the semiconductor element (7) is pressed and connected using the lid (10). That is, the hole (5
) The protruding end (10a) of the lid (10)
is inserted, and the lid body 10) is rotated so that the slope of the tapered surface of the threaded portion (5a) is higher. Then, the semiconductor element (7) is screwed and pressed as the lid (10) rotates, and is pressed and connected to the conductive path (2) via the conductive sheet (6). In this embodiment, a highly elastic rubber sheet (11) is placed on the upper surface of the semiconductor element (7) in order to increase the pressing force due to screwing of the lid (10).

According to the present invention, the semiconductor element (7) can be written and erased without soldering by using the conductive sheet (6) and screwing and pressing the semiconductor element (7) with the lid (10). can be connected to the conductive path (2) on the substrate (1>).

As a result, the semiconductor element (7) can be easily replaced by removing the lid (10) from the hole (5) of the case material (4).

(G) Effects of the Invention As detailed above, according to the present invention, a hole is formed in a predetermined position of the case material, a conductive sheet is placed on the substrate exposed by the hole, and a conductive sheet is placed on the substrate exposed through the hole. By mounting a semiconductor element having predetermined program data on the casing material, screwing the peripheral edge of the hole in the case material to the cover body, and connecting the semiconductor element with pressure, the semiconductor element can be connected to the conductive path without soldering. As a result, it is extremely easy to replace the semiconductor element due to a defect or data rewriting.

Further, in the present invention, since the semiconductor element is press-connected by screwing between the lid and the case material, the reliability of the connection strength between the semiconductor wire and the conductive path can be improved.

Further, in the hybrid integrated circuit of the present invention, the inspection of the semiconductor element and the inspection of the hybrid integrated circuit before incorporating the semiconductor element are different, so it is particularly effective in the case of high-mix low-volume production.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is an enlarged plan view of the main part of the case material, Fig. 3 is a diagram showing the screwing part of the hole in the case material, and Fig. 4 is a conductive FIGS. 5, 6, and 7 are sectional views showing conventional examples. (1) is an integrated circuit board, (2) is a conductive path, (3) is a circuit element, (4> is a case material, (5) is a hole, (5)
a) is a screwed part, (6) is a conductive sheet, and (7) is a semiconductor element.

Claims (6)

[Claims] (1) A case in which an integrated circuit board, a conductive path of a desired shape formed on the substrate, a plurality of circuit elements connected to the conductive path on the substrate, and a resin-sealed semiconductor element are integrated with the substrate. A hole is provided at a predetermined position of the case material, a conductive sheet is placed on the substrate exposed through the hole, and the resin-sealed semiconductor element is mounted on the conductive sheet, A hybrid integrated circuit characterized in that the semiconductor element is press-connected by screwing the peripheral edge of the hole of the case material to a lid body. (2) Claim 1, wherein the circuit element is sealed in a sealed space formed by the substrate and the case material.
Hybrid integrated circuit as described. (3) The hybrid integrated circuit according to claim 1, wherein a plurality of conductive paths extend on the substrate on which the conductive sheet is disposed. (4) The hybrid integrated circuit according to claim 1, wherein the conductive sheet is formed of an insulating sheet, and a large number of linear conductors protrude from both sides of the conductive sheet. (5) The hybrid integrated circuit according to claim 1, wherein a threaded portion for threading the lid is provided at a peripheral end of the hole. (6) The hybrid integrated circuit according to claim 5, wherein the surface of the threaded portion is tapered.