JPH0410672Y2 - - Google Patents
Info
- Publication number
- JPH0410672Y2 JPH0410672Y2 JP1985185326U JP18532685U JPH0410672Y2 JP H0410672 Y2 JPH0410672 Y2 JP H0410672Y2 JP 1985185326 U JP1985185326 U JP 1985185326U JP 18532685 U JP18532685 U JP 18532685U JP H0410672 Y2 JPH0410672 Y2 JP H0410672Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- multilayer capacitor
- external electrodes
- capacitor element
- insulating paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、積層コンデンサ素子の両端に設け
られた外部電極に、金属性の端子を介してリード
線が設けられた積層コンデンサに関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a multilayer capacitor in which lead wires are provided via metal terminals to external electrodes provided at both ends of a multilayer capacitor element.
積層コンデンサは、第4図で示すように、内部
電極7,7…が印刷された磁気シート6,6…を
数層積層し、2組の内部電極7,7…にそれぞれ
導通するよう、両端に外部電極2,2を設けたも
のである。このコンデンサは、上記のような積層
構造を有するため、通常は立方体形を呈してい
る。
As shown in Fig. 4, a multilayer capacitor is made by laminating several layers of magnetic sheets 6, 6... on which internal electrodes 7, 7... are printed, and connecting both ends of the magnetic sheets 6, 6... to conduction to two sets of internal electrodes 7, 7..., respectively. External electrodes 2, 2 are provided on the periphery. Since this capacitor has the above-mentioned laminated structure, it usually has a cubic shape.
従来、金属製の端子3,3を介して、上記積層
コンデンサの両端から、同一直線上にリード線
5,5を引き出す試みが提案されている。即ち、
キヤツプ状の端子3,3の閉じられた一方の端面
にリード線5,5を取り付け、これを積層コンデ
ンサ素子1の両端に設けられた外部電極2,2に
嵌め込み、両端のリード線5,5を同一直線上に
配置するものである。 Conventionally, an attempt has been proposed in which lead wires 5, 5 are drawn out on the same straight line from both ends of the multilayer capacitor via metal terminals 3, 3. That is,
Lead wires 5, 5 are attached to one closed end surface of the cap-shaped terminals 3, 3, and these are fitted into external electrodes 2, 2 provided at both ends of the multilayer capacitor element 1. are arranged on the same straight line.
上記端子3,3の間には、絶縁性の確保、積層
磁気コンデンサ素子1の保護、同コンデンサ素子
1への端子3,3の固定等の目的で、絶縁塗料4
が塗布されている。 An insulating coating 4 is applied between the terminals 3 and 3 for the purpose of ensuring insulation, protecting the multilayer magnetic capacitor element 1, fixing the terminals 3 to the capacitor element 1, etc.
is coated.
しかし、本件考案者らが上記積層コンデンサを
試作した結果、次のような3つの問題が明らかに
なつた。
However, as a result of prototype production of the above multilayer capacitor by the inventors of the present invention, the following three problems were found.
第一に、上記コンデンサでは、立方体形の積層
コンデンサ素子1と、円形のキヤツプ状の端子
3,3との間に比較的大きな間隙が形成される。
この間隙に存在する空気は、積層コンデンサ素子
1に絶縁塗料4を塗布し、これを加熱する際に急
激に熱膨張する。 First, in the capacitor described above, a relatively large gap is formed between the cubic multilayer capacitor element 1 and the circular cap-shaped terminals 3, 3.
The air existing in this gap undergoes rapid thermal expansion when the insulating paint 4 is applied to the multilayer capacitor element 1 and heated.
ところが、上記絶縁塗料4を塗布することによ
つて、端子3,3の開口端部が塞がれてしまう
と、第4図において矢印で示すように、膨張した
空気が溶融状態の絶縁塗料4を突き破つて、その
表面から噴出する。 However, if the open ends of the terminals 3, 3 are blocked by applying the insulating paint 4, the expanded air flows into the molten insulating paint 4, as shown by the arrow in FIG. It breaks through and erupts from its surface.
空気が噴出した跡は、絶縁塗料4の硬化後、空
孔や空隙となつて残り、絶縁性の低下をもたら
す。また、上記空孔の中には、噴出口が端子3,
3より外側に突起となつて残るものがあるため、
積層磁気コンデンサを配線基板に搭載する際の障
害となる。 After the insulating paint 4 has hardened, the traces of the air blown out remain as pores and voids, resulting in a decrease in insulation properties. Further, in the above-mentioned hole, a jet port is located at the terminal 3,
Because there is something that remains as a protrusion on the outside of 3,
This becomes an obstacle when mounting a multilayer magnetic capacitor on a wiring board.
第二に、端子3,3の開口端部が塞がれると、
絶縁塗料4がその中の空気に阻まれて、端子3,
3と積層コンデンサ素子1との間隙に浸透しに
くゝなる。このため、絶縁塗料4が上記間隙の中
に充填されず、絶縁性の確保、積層磁器コンデン
サ素子1の保護、同コンデンサ素子への端子3,
3の固定といつた、絶縁塗料4本来の機能が充分
得られない。 Second, when the open ends of the terminals 3, 3 are closed,
The insulating paint 4 is blocked by the air inside it, and the terminals 3,
3 and the multilayer capacitor element 1 becomes difficult to penetrate. Therefore, the insulating paint 4 is not filled into the gap, ensuring insulation, protecting the multilayer ceramic capacitor element 1, and connecting the terminal 3 to the capacitor element.
The original function of the insulating paint 4, such as the fixation of 3, cannot be fully obtained.
第三に、円形の端子3,3と角形の外部電極
2,2とは、嵌合時に外部電極2,2の4個所の
角部で線接触するだけであるため、機械的、電気
的に必ずしも良好な嵌合状態が形成されにくい。
このため、単に嵌合し、或いは絶縁塗料4で覆つ
ただけでは、端子3,3が外部電極2,2から脱
落しやすかつたり、充分な電気的接続が得られな
い。 Thirdly, the circular terminals 3, 3 and the rectangular external electrodes 2, 2 are in line contact only at the four corners of the external electrodes 2, 2 when mated, so there is no mechanical or electrical contact between them. It is not always easy to form a good fitted state.
Therefore, if the terminals 3, 3 are simply fitted together or covered with the insulating paint 4, the terminals 3, 3 tend to fall off from the external electrodes 2, 2, and a sufficient electrical connection cannot be obtained.
この点を改善するためには、端子3,3を内周
側で外部電極2,2に半田付けすることが有効で
ある。しかし、端子3,3は、直径が僅か数ミリ
メートルというごく小さなものであるあるため、
外から隠れた端子3,3の内周側を外部電極2,
2に半田付けすることは、極めて困難である。 In order to improve this point, it is effective to solder the terminals 3, 3 to the external electrodes 2, 2 on the inner peripheral side. However, since the terminals 3 and 3 are extremely small with a diameter of only a few millimeters,
The inner circumferential side of the terminals 3, 3 hidden from the outside is connected to the external electrode 2,
It is extremely difficult to solder to 2.
この考案は、上記の問題点を解決するためにな
されたもので、絶縁塗装に空孔や空隙等た発生せ
ず、しかも絶縁塗料の端子3,3と積層コンデン
サ素子1との間への絶縁塗料4の浸透が充分行わ
れ、また、端子3,3が内周側で外部電極2,2
と確実に半田付けされた積層コンデンサを提供す
ることを目的とする。 This idea was made in order to solve the above problems, and it does not create holes or voids in the insulating coating, and it also provides insulation between the terminals 3, 3 of the insulating coating and the multilayer capacitor element 1. The paint 4 is sufficiently penetrated, and the terminals 3 and 3 are connected to the outer electrodes 2 and 2 on the inner circumferential side.
The purpose is to provide a multilayer capacitor that is reliably soldered.
この考案の構成を、第1図〜第3図に用いた符
号を引用しながら説明すると、この考案による金
属端子を用いた積層コンデンサは、端面中央部に
リード線15,15を取り付けると共に、この周
囲に開口部20を形成した円形状の金属製の端子
13,13を、ほぼ立方体形を呈する積層コンデ
ンサ素子11の両端部に設けられた外部電極1
2,12に嵌め込み、同端子13,13を、その
周面に施された半田メツキで外部電極12,12
に半田付けし、さらに上記積層コンデンサ素子1
1を絶縁塗料14で覆つたことを特徴とするもの
である。
The structure of this invention will be explained by referring to the reference numerals used in FIGS. Circular metal terminals 13, 13 having openings 20 formed around them are connected to external electrodes 1 provided at both ends of a multilayer capacitor element 11 having a substantially cubic shape.
2, 12, and the terminals 13, 13 are connected to the external electrodes 12, 12 by solder plating applied to their peripheral surfaces.
and further solder the multilayer capacitor element 1 to
1 is covered with an insulating paint 14.
この積層コンデンサでは、端子13,13が、
予め周面に施された半田メツキ18,18によつ
て外部電極12,12に半田付けされているた
め、端子13,13の内周面側において、外部電
極12,12との半田付けが確実に行われる。
In this multilayer capacitor, terminals 13, 13 are
Since the terminals 13, 13 are soldered to the external electrodes 12, 12 by the solder plating 18, 18 applied to the peripheral surface in advance, the soldering with the external electrodes 12, 12 is ensured on the inner peripheral surface side of the terminals 13, 13. It will be held in
また、積層コンデンサでは、コンデンサ素子1
1がほぼ立方体形を呈しているのに対し、この両
端に嵌め込まれた端子13,13は、円形状であ
るため、第2図で示すように、端子13,13と
コンデンサ素子11の両端の端子12,12との
間に大きな間隙が生じる。この場合に、端子1
3,13の一方の開口部20,20…側が絶縁塗
料14で塞がれてしまつても、加熱時に、端子1
3,13と積層コンデンサ素子11との間の間隙
に存在する空気が他方の端面側の開口部20,2
0…側から逃げるため、膨張した空気が絶縁塗料
14を突き破つて噴出するようなことがない。 In addition, in a multilayer capacitor, capacitor element 1
1 has an almost cubic shape, whereas the terminals 13, 13 fitted at both ends are circular, so that the terminals 13, 13 and both ends of the capacitor element 11 are connected to each other, as shown in FIG. A large gap is created between the terminals 12, 12. In this case, terminal 1
Even if one of the openings 20, 20... side of terminals 3, 13 is covered with insulating paint 14, the terminal 1
3, 13 and the multilayer capacitor element 11, the air exists in the gap between the multilayer capacitor element 11 and the openings 20, 2 on the other end surface side.
Since the air escapes from the 0... side, the expanded air does not break through the insulating paint 14 and blow out.
次に、第1図〜第3図を参照しながら、この考
案の実施例について説明する。
Next, an embodiment of this invention will be described with reference to FIGS. 1 to 3.
まず、第1図と第2図で示された実施例につい
て説明すると、磁器シート16,16…が複数層
積層され、これらシートに印刷された2組の内部
電極17,17…が交互に配置されている。さら
にこの積層体の両端に、上記2組の内部電極1
7,17…にそれぞれ導通する外部電極12,1
2が設けられ、積層コンデンサ素子11が構成さ
れている。 First, to explain the embodiment shown in FIGS. 1 and 2, a plurality of ceramic sheets 16, 16... are laminated, and two sets of internal electrodes 17, 17... printed on these sheets are arranged alternately. has been done. Furthermore, the two sets of internal electrodes 1 are placed at both ends of this laminate.
External electrodes 12, 1 conductive to 7, 17, respectively.
2 are provided to constitute the multilayer capacitor element 11.
上記積層コンデンサ素子11の両端にリング状
の端子13,13が嵌め込まれ、この内周側が予
め施された半田メツキ18,18によつて、上記
外部電極12,12に半田付けされている。さら
に、これら端子13,13の間に絶縁塗料14が
塗布されている。 Ring-shaped terminals 13, 13 are fitted into both ends of the multilayer capacitor element 11, and the inner peripheral sides thereof are soldered to the external electrodes 12, 12 by solder plating 18, 18 applied in advance. Furthermore, an insulating paint 14 is applied between these terminals 13, 13.
端子13,13の一方の端面には、中央から放
射状に伸びるスポーク状のリード線取付部21,
21が設けられ、この中央部にリード線15,1
5が溶接等の手段で取り付けられている。そし
て、この中央部の周囲に開口部20,20…が形
成されている。図示の場合、リード線取付部2
1,21…は、4本のスポーク状のものであり、
従つて、開口部20,20…は、リード…15,
15が取り付けられた中央部の周囲に90°間隔で
設けられた扇形のものからなつている。 On one end surface of the terminals 13, 13, there is a spoke-shaped lead wire attachment part 21 extending radially from the center.
21 is provided, and lead wires 15, 1 are provided in the center of this.
5 is attached by means such as welding. Openings 20, 20, . . . are formed around this central portion. In the case shown, lead wire attachment part 2
1, 21... are four spoke-like objects,
Therefore, the openings 20, 20... lead...15,
It consists of fan-shaped parts placed at 90° intervals around the central part where the number 15 is attached.
開口部20,20…の形状は、上記のような扇
形に限らず、例えば、円形,矩形、正方形、三角
形等が一般に採用される。 The shape of the openings 20, 20, . . . is not limited to the fan shape as described above, and generally, for example, a circular, rectangular, square, triangular, etc. shape is employed.
第3図の実施例は、上記実施例において使用し
たのと同様な端子13,13において、その円周
上の1個所に、円周方向に対して斜めに切断線1
9を設けたものである。この場合、端子13,1
3として積層コンデンサ素子11に対してやゝき
つめのものを使用することにより、端子13,1
3の弾力を利用して、同端子13,13を外部電
極12,12に遊びがないように嵌め込むことが
できる。これによつて、端子13,13と外部電
極12,12との半田付けがしやすくなる。 In the embodiment shown in FIG. 3, in the terminals 13, 13 similar to those used in the above embodiment, a cutting line is placed at one point on the circumference at an angle with respect to the circumferential direction.
9. In this case, terminal 13,1
By using a capacitor 3 that is slightly tighter than the multilayer capacitor element 11, the terminals 13 and 1
3, the terminals 13, 13 can be fitted into the external electrodes 12, 12 without any play. This makes it easier to solder the terminals 13, 13 and the external electrodes 12, 12.
上記切断線19は、円周方向に対して斜めに設
けられているため、これに積層コンデンサ素子1
1の陵部が嵌り込んでしまうような不都合が生じ
ない。 Since the cutting line 19 is provided obliquely with respect to the circumferential direction, the multilayer capacitor element 1
Inconveniences such as the crest of No. 1 getting stuck in will not occur.
以上説明した通り、この考案によれば、端子1
3,13の内周側が外部電極12,12に確実に
半田付けされた積層コンデンサが得られる。ま
た、絶縁塗料14に気孔や空隙が発生する等のト
ラブルを未然に防止することができると共に、絶
縁塗料14を、端子13,13と積層コンデンサ
素子11との間隙に充分浸透させることができ
る。
As explained above, according to this invention, terminal 1
A multilayer capacitor in which the inner circumferential sides of 3 and 13 are reliably soldered to the external electrodes 12 and 12 is obtained. Furthermore, troubles such as the formation of pores and voids in the insulating paint 14 can be prevented, and the insulating paint 14 can be sufficiently penetrated into the gaps between the terminals 13, 13 and the multilayer capacitor element 11.
これによつて、端子13,13の脱落や電気的
接続状態の不良、或いは絶縁塗料14の気孔や空
隙による不良が低減され、高い歩留りが得られる
と共に、絶縁性、積層コンデンサ素子11の保
護、及び端子13,13の固定機能に優れた積層
コンデンサを提供することができる。 As a result, defects such as falling off of the terminals 13, 13, poor electrical connection, or defects due to pores and voids in the insulating paint 14 are reduced, and a high yield is obtained. Also, it is possible to provide a multilayer capacitor with excellent fixing function of the terminals 13, 13.
第1図は、この考案の実施例を示す積層コンデ
ンサの絶縁塗料を省略した一部切断分解斜視図、
第2図は、同積層コンデンサの断面図、第3図
は、他の実施例を示す積層コンデンサの絶縁塗料
を省略した分解斜視図、第4図は、金属端子を用
いた積層コンデンサの従来例を示す断面図であ
る。
11……積層コンデンサ素子、12……積層コ
ンデンサ素子の外部電極、13……端子、14…
…絶縁塗料、15……リード線、18……半田メ
ツキ、19……切断線、20……端子の開口部、
21……リード線取付部。
FIG. 1 is a partially cutaway exploded perspective view of a multilayer capacitor showing an embodiment of this invention, with insulation paint omitted;
Fig. 2 is a cross-sectional view of the same multilayer capacitor, Fig. 3 is an exploded perspective view of a multilayer capacitor showing another embodiment without the insulating paint, and Fig. 4 is a conventional example of a multilayer capacitor using metal terminals. FIG. DESCRIPTION OF SYMBOLS 11... Multilayer capacitor element, 12... External electrode of multilayer capacitor element, 13... Terminal, 14...
... Insulating paint, 15 ... Lead wire, 18 ... Solder plating, 19 ... Cutting wire, 20 ... Terminal opening,
21...Lead wire attachment part.
Claims (1)
ると共に、この周囲に開口部20を形成した円
形状の金属製の端子13,13を、ほぼ立方体
形を呈する積層コンデンサ素子11の両端部に
設けられて外部電極12,12に嵌め込み、同
端子13,13を、その周面に施された半田メ
ツキで外部電極12,12に半田付けし、さら
に上記積層コンデンサ素子11を絶縁塗料14
で覆つたことを特徴とする金属端子を用いた積
層コンデンサ。 2 端子13が、円周上の1個所に円周方向に対
して斜めの切断線19が設けられたものからな
る実用新案登録請求の範囲第1項に記載の積層
コンデンサ。[Claims for Utility Model Registration] 1. A multilayer capacitor having a substantially cubic shape, with lead wires 15, 15 attached to the center of the end face, and circular metal terminals 13, 13 with an opening 20 formed around the lead wires 15, 15. The multilayer capacitor element 11 is provided at both ends of the element 11 and fitted into the external electrodes 12, 12, and the terminals 13, 13 are soldered to the external electrodes 12, 12 by solder plating applied to the peripheral surface of the element 11. Insulating paint 14
A multilayer capacitor using a metal terminal characterized by being covered with a metal terminal. 2. The multilayer capacitor according to claim 1, in which the terminal 13 is provided with a cutting line 19 oblique to the circumferential direction at one location on the circumference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985185326U JPH0410672Y2 (en) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985185326U JPH0410672Y2 (en) | 1985-11-29 | 1985-11-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6292631U JPS6292631U (en) | 1987-06-13 |
| JPH0410672Y2 true JPH0410672Y2 (en) | 1992-03-17 |
Family
ID=31133847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985185326U Expired JPH0410672Y2 (en) | 1985-11-29 | 1985-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410672Y2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4323499Y1 (en) * | 1965-03-31 | 1968-10-03 | ||
| JPS423554Y1 (en) * | 1965-03-31 | 1967-03-02 | ||
| JPS6038273Y2 (en) * | 1977-01-11 | 1985-11-15 | 株式会社村田製作所 | Cylindrical terminal |
| JPS597202B2 (en) * | 1980-12-08 | 1984-02-17 | 日東工業株式会社 | Chip holder used in the painting process for electronic component chips without lead wires, and method for producing painted electronic component chips without lead wires using the chip holder |
-
1985
- 1985-11-29 JP JP1985185326U patent/JPH0410672Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6292631U (en) | 1987-06-13 |
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