JPH0410697Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a heat sink that uses a flat heat pipe to cool a heat generating element such as a large capacity thyristor or semiconductor.

(Prior art and its problems) The applicant has developed a flat heat pipe made of extruded aluminum material and has already filed an application (Japanese Patent Application No. 1983).
-265569, filing date: November 25, 1985). Also,
An application has already been filed for a heat sink using this heat pipe (Utility Application No. 60-181632).
No., filing date: November 25, 1985).

The heat sink structures described in these earlier applications all have a structure in which the heat medium flows through the path portion only in one direction, the vertical direction, and there is room for further improvement in heat transfer efficiency.

Furthermore, when the heat sink must be accommodated in a narrow space, there is a problem in that the external size of the heat sink is large.

(Purpose of the invention) The present invention provides a heat sink made of a flat heat pipe that improves heat transfer efficiency by allowing the heat medium to flow in both left and right directions in the path portion, and that can be accommodated in a narrow space. The purpose is to

(Structure of the device) (1) Technical means The present device has a set consisting of a flat sheet portion to which a heating element is directly fixed, and a path portion provided with a passage for sealing a heat medium inside. , a plurality of flat heat pipes made of an extruded aluminum material are arranged integrally and one side of the seat part and the pass part are arranged on the same plane, and the plurality of sets of the seat part and the pass part are arranged substantially perpendicularly. The heat pipes are arranged in a plane with the pass portions extending in the horizontal direction, the openings at both ends of the pass portions are communicated with the header pipe, and the heating element is placed in the seat at the center of the lower part of the heat pipe. This is a heat sink made of a flat heat pipe.

(2) Effect Since the heating element is fixed to the seat part at the bottom center of the heat pipe, the heat medium evaporated by the heat from the heating element flows from side to side in the path part, passes through the header tube, and reaches the upper part of the heat pipe. The heat reaches the pass section, where it is cooled and condensed, and then flows back to the lower part of the heat pipe.

(Example) In FIG. 1, which is a front view of a heat sink for semiconductor cooling employing the present invention, 10 is a flat heat pipe. This heat pipe 10 is made of extruded aluminum material, as will be described in detail later.
It is erected in a substantially vertical position with the longitudinal direction oriented horizontally in the shape of a so-called folding screen.

Header pipes 12 and 14 are provided at both ends of the heat pipe 10 in the left and right direction in the figure, respectively, so as to communicate with the heat pipe 10. The upper end of the header pipe 12 is sealed with a sealing plug 16, and the lower end of the header pipe 12 is sealed with a welded portion 18. Both upper and lower ends of 14 are also sealed with sealing plugs 16. After air has been sucked into the header pipes 12 and 14, a heating medium such as Freon R12 is filled up to the liquid level L to a volume of about 50%.

Further, a fin 20 is provided on the front end surface (upper surface in FIG. 2) of the heat pipe 10.
As shown in FIG. 2, the fins 20 have a substantially gate-shaped frame shape, and are arranged in large numbers at equal intervals in the longitudinal direction of the heat pipe 10.

These header pipes 12, 14, sealing plug 1
6. The fin 20 is made of a so-called brazing material whose surface is coated with a brazing material, and after the whole is assembled into a predetermined shape, it is brazed by a so-called vacuum brazing method in which it is heated and brazed in a vacuum furnace. .

As shown in FIG. 3, the heat pipe 10 integrally includes a flat sheet portion 22 and a path portion 26 in which a passage 24 is provided, and the sheet portion 2.
2 and the contact surface 2 which is the lower surface of the pass portion 26 in FIG.
This is an aluminum extrusion molded material formed by aligning the parts 8 on the same plane. The seat portion 22 and the path portion 26 are combined into one set, and as shown in FIG.
For example, four sets of seat portions 22 and pass portions 26 are successively formed in No. 0.

The heat pipe 10 has four sets of sheet portions 22 and pass portions 26 disposed in a substantially vertical plane, and the longitudinal direction of the pass portions 26, that is, the flow direction of the heat medium, is disposed substantially horizontally (laterally). They are arranged in the aforementioned folding screen shape with the arrow U pointing upwards and the arrow P pointing downwards.

Two tab-mounted thyristors 30 (heating elements), for example, are fixed to the lower central portion of the heat pipe 10 arranged in this manner with screws 32 passing through the sheet portion 22. A filler such as silicone resin is applied between the thyristor 30 and the contact surface 28 in order to further improve the adhesion between the thyristor 30 and the contact surface 28. This thyristor 3
The portion of the heat pipe 10 where the fin 20 is provided is not provided with the fin 20.

Next, the action will be explained. In the heat sink described above, the heat pipe 10 is arranged in a so-called folding screen-like posture, and the thyristor 30 is fixed to the lower central part of the heat pipe 10, so that the path portion 26 of the lower part of the heat pipe 10 heated by the thyristor 30 The heat medium inside the heat pipe evaporates and flows through the path section 26 in two directions, left and right in FIG. Here, the heat medium is cooled and condensed into a liquid state, and flows back to the lower part of the heat pipe 10 again.

Therefore, the heat from the thyristor 30 flows in two directions, left and right, through the two path sections 26 at the bottom of the heat pipe 10, so the heat medium transfers the amount of heat through the four paths, and the heat transfer efficiency increases. improves. Therefore, the surface temperature of the heat pipe 10 is averaged out to be substantially uniform compared to the conventional case.

In the heat pipe 10 described above, one heat pipe 10 is provided with, for example, four path portions 24, and a heat medium passage 20 is formed in each path portion 24, so that the heat transfer capacity of the heat pipe 10 is large.

The pass portion 24 and the seat portion 22 are integrally formed by aluminum extrusion processing, and the metal structure is continuous, so
Heat transfer resistance is small, and heat flow from the path portion 24 is rapidly transmitted to the seat portion 22. The heat flow transmitted to the seat portion 22 is transmitted to the thyristor 30 that is in close contact with the lower surface 25 of the seat portion 22, thereby cooling the thyristor 30.

Moreover, the lower surface 25 of the heat pipe 10 in FIGS. 2 and 3, that is, the contact surface 28, is on the same plane, and the thyristor 30 and the heat pipe 10 are in close contact with each other over the entire surface. Heat is also transferred from the lower surface 25 of the pass portion 24. Therefore, the heat flow between the heat pipe 10 and the thyristor 30 is transmitted from the wide heat transfer surface of the lower surface 25 of the seat portion 22 and the path portion 24, and the heat flow between the heat pipe 10 and the thyristor 30
Cool down even more rapidly.

(Effect of the invention) As explained above, in the present invention, the heat pipe 10 is arranged in the above-mentioned so-called folding screen-like posture, and the thyristor 30 is fixed to the lower central part of the heat pipe 10. The heat medium in the lower path portion 26 of the heat pipe 10 evaporates, flows through the path portion 26 in two directions to the left and right in FIG. The heat medium reaches the path section 26, where it is cooled and condensed into a liquid state, and then returns to the heat pipe 1.
It can be refluxed to the bottom of 0.

Therefore, the heat from the thyristor 30 flows in two directions, left and right, through the two path sections 26 at the bottom of the heat pipe 10, so that the heat medium can transfer the amount of heat through the four paths, resulting in improved heat transfer. Efficiency can be improved. Therefore, the surface temperature of the heat pipe 10 is averaged out to be substantially uniform compared to the conventional case.

[Brief explanation of drawings]

FIG. 1 is a front view of a heat sink employing the present invention, FIG. 2 is a view taken in the direction of the arrow in FIG. 1, and FIG. 3 is a partial cross-sectional view taken at - in FIG. 10... Heat pipe, 12, 14... Header pipe, 22... Seat part, 26... Pass part, 30...
...thyristor.

Claims (1)

[Scope of utility model registration request] A plurality of sets consisting of a flat sheet part to which a heating element is directly fixed and a path part provided with a passage for enclosing a heat medium therein are integrally arranged, and the sheet part and the path part are arranged together. A flat heat pipe formed of an extruded aluminum material with one side of the heat pipe arranged on the same plane is arranged in such a manner that the plurality of sets of sheet parts and path parts are arranged in a substantially perpendicular plane, and the path part extends in the horizontal direction. A heat sink made of a flat heat pipe, characterized in that the openings at both ends of the path part are connected to a header pipe, and a heating element is arranged in a seat part at the lower center of the heat pipe.