JPH04107937A - Controller of bonding tool-driving motor in wire bonder - Google Patents

Abstract

PURPOSE:To make the position control of a bonding tool accurate by constituting an apparatus in such a manner that the next signal is sent from a command signal transmitter to a driver when it is confirmed that the drive quantity of a motor has reached the command quantity by a command signal. CONSTITUTION:When a motor MZ arranged inside a drive box 1 is driven, a horn 2 oscillates in the vertical direction and a bonding tool 3 moves vertically. MX and MY are X-direction and Y-direction motors, respectively. Also, the input side of a signal controller 16 is connected with a driver 14 and forward-reverse switching determinator 15 and its output side is connected with a command signal transmitter 13. The driver 14 outputs a coin signal to the signal controller 16 when the drive quantities of the motors MX, MY, MZ reach command quantities. Also, the signal controller 16 inputs a due-out inhibition signal to the command signal transmitter 13, until the coin signal is received, to hinder that the next command signal is transmitted from the transmitter 13 to the driver 14. Thus, a wire can be bonded to a semiconductor with good positional accuracy.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a control device for a motor for driving a bonding tool in a wire bonder. The present invention relates to means for accurately controlling a motor whose direction is switched.

(Prior Art) A bonding tool of a wire bonder such as a capillary tool or a wedge tool bonds a wire to a semiconductor such as a chip or a wafer while controlling its position by a motor to form a wire loop or bump.

(Problems to be Solved by the Invention) The motor described above switches between forward and reverse rotation directions at high speed and frequently, but the actual operation of the motor cannot completely follow the command signal, resulting in a delay in operation.

FIG. 4 is an operational diagram showing the delay in this operation.

As is clear from this figure, at the time t when the command is switched from positive to reverse, the operation of the motor is not completed and a droop pulse occurs. As a result, the movement of the bonding tool becomes inaccurate, causing problems such as errors in the accuracy of the bonding position of the wire.

SUMMARY OF THE INVENTION An object of the present invention is to provide a means for controlling a motor of a bonding tool that solves the above-mentioned problems.

(Means for Solving the Problems) The present invention provides a control device for the motor described above, which controls the position of a bonding tool by rotating the motor in forward and reverse directions, and bonds a wire inserted through the bonding tool to a semiconductor. A command signal transmitter transmits a command signal to the drive unit of the motor and transmits a rotation direction signal of the motor to the forward/reverse switching determination unit, and a command signal transmitting unit that transmits a command signal to the drive unit of the motor and transmits a rotation direction signal of the motor to the forward/reverse switching determination unit, and a drive amount of the motor is determined based on the command signal. and a signal control section that prevents the next signal from being transmitted from the command signal transmitting section to the driving section until the command amount is reached.

(Function) According to the above configuration, when it is confirmed that the amount of drive of the motor has reached the amount commanded by the command signal, the next signal is transmitted from the command signal transmitter to the drive unit, so that the droop pulse is reduced. The operation of the motor is matched with the command without causing any problems.
The position of the bonding tool can be precisely controlled.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows the main parts of the wire bonder. 1 is a drive box from which a horn 2 protrudes. A bonding tool 3 is held at the tip of the horn 2. 4 is a wire inserted through the bonding tool 3, 5 is a chip-shaped semiconductor, and 10 is a substrate such as a lead frame on which the semiconductor 5 is mounted.

A motor MZ is disposed inside the drive box 1. 6 is a cam driven by the motor MZ, and 7 is a cam follower provided at the rear end of the horn 2. When the motor MZ is driven, the horn 2 swings vertically and the bonding tool 3 moves vertically. Further, the drive box 1 is placed on an X table 8 and a Y table 9. MX, MY
are the X-direction motor and the Y-direction motor, respectively.

Therefore, by rotating the motors MX, MY, and MZ in forward and reverse directions, the position of the bonding tool 3 is controlled in the XYZ directions, and the wire 4 is bonded to the semiconductor 5. Such position control of the bonding tool 3 is similarly performed when forming flip-chip bumps on a wafer.

FIG. 2 is a block diagram of the electric circuit. Reference numeral 11 denotes an address control section, which sends an address signal to the storage section 12.

Reference numeral 13 denotes a command signal transmitting unit that issues pulses based on a data signal sent from the storage unit 12; and 14, a command signal issued from the transmitting unit 13 causes the motor MX to
.

A driving section 15 controls MY and MZ, a forward/reverse switching determining section 15 receives a motor rotation direction signal dir from the transmitting section 13, and a signal control section 16 includes a gate. The input side of the signal control section I6 is connected to the driving section 14 and the forward/reverse switching determining section 15, and the output side thereof is connected to the command signal transmitting section 13. The drive unit 14 outputs a coin signal to the signal control unit 16 when the drive amount of the motors MX, MY, and MZ reaches the command amount. Further, this signal control section 16 is configured as shown in c.

By inputting a dispensing prohibition signal to the command signal transmitting section 13 until the in signal is received, the next command signal is prevented from being transmitted from the transmitting section 13 to the drive section 14.

FIG. 3 is an operational diagram of the motor. Since the signals transmitted from the transmitting section 13 to the driving section 14 switch rapidly and frequently, the operations of the motors MX, MY, and MZ are transmitted from the command signal transmitting section 13 to the driving section 14, as shown in the figure. later than the instructions. However, by configuring the electric circuit as described above, the coin signal is transmitted from the drive unit 14, and the coin signal is transmitted from the drive unit 14 until the payout prohibition signal is released, that is, the motor M
Since the next signal is not transmitted from the transmitter 13 to the drive unit 14 until it is confirmed that X, MY, and MZ have operated according to the command amount, droop pulses are not generated as in the conventional means described above. Instead, each motor MX, MY.

The MZ can be operated accurately as instructed.

(Effects of the Invention) As described above, the present invention provides control of the above-mentioned motor in which the motor is rotated in forward and reverse directions to control the position of the bonding tool, and the wire inserted through the bonding tool is bonded to the semiconductor. The device includes a command signal transmitter that transmits a command signal to the drive unit of the motor and transmits a rotation direction signal of the motor to the forward/reverse switching determination unit, and a drive amount of the motor that is determined based on the command signal. Since the wire bonder motor control device is constituted by a signal control section that prevents the next signal from being transmitted from the command signal transmitting section to the driving section until the command amount is reached,
By accurately controlling a motor that frequently switches between forward and reverse rotation directions at high speeds, wires can be bonded to semiconductors with precise positioning.

1 is a perspective view of the wire bonder, FIG. 2 is a block diagram of the electric circuit, FIG. 3 is an operation diagram, and FIG. 4 is an operation diagram of the conventional means.

3... Bonding tool 4... Wire 5... Semiconductor 13... Command signal transmitting section 14... Drive section 15... Forward/reverse switching determination section 16... Signal control section MX, MY, MZ... Name of motor agent Patent attorney Akira Okaji Haga 2 masterpieces 1
Figure 2

Claims (1)

[Claims] The motor control device controls the position of a bonding tool by rotating the motor in forward and reverse directions, and bonds a wire inserted through the bonding tool to a semiconductor, and sends a command signal to a drive section of the motor. a command signal transmitting section that transmits a rotation direction signal of the motor to the forward/reverse switching determination section; 1. A control device for a bonding tool drive motor in a wire bonder, comprising: a signal control section that prevents the next signal from being transmitted to the wire bonder.