JPH04111460A - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit device having a multilayer metal substrate structure.

(b) Prior Art A conventional hybrid integrated circuit device having a multilayer metal substrate structure will be described with reference to FIG.

The figure shows a cross-sectional structure of a hybrid integrated circuit device, which consists of two insulating metal substrates (62) (64), an adhesive insulating resin layer (66), a conductive path (68), and a pad (70).
), integrated circuit elements (72), chip elements such as chip resistors or chip capacitors (74), case materials (75)
, a pair of internal leads (76), etc.

Anodized aluminum substrates are mainly used for the insulating metal substrates (62) and (64), and the insulating resin layer (66
), conductive paths (68) and pads (70) are formed in a predetermined pattern, such as by photo-etching the copper foil pasted through the copper foil.

The integrated circuit element (72) is fixed in a predetermined position on the conductive path (68) using Ag paste or the like, and the other chip elements (74) and external leads (no reference numbers) are attached to the predetermined conductive path (68). (68) is fixed by solder.

Furthermore, when the two insulated metal substrates (62) and (64) are fixed to the case material (75) so that the mounted elements face each other, the abbreviated internal leads (76) Pad (7) so that the other end of internal lead (76) fixed to pad (70) of (62) and (64) comes into
0) is fixed by solder. This contact portion of the internal lead (76) is soldered and fixed by reflow, and the conductive paths (68) formed on the two insulated metal substrates (62) (64) are interconnected.

According to the above structure, in addition to being able to reduce the projected area of the hybrid integrated circuit device, the two insulated metal substrates (62) (6
4) A high-power integrated circuit element can be mounted on any of the above.

(c) Problems to be Solved by the Invention However, in the hybrid integrated circuit device having the above structure, the locations where conductive paths can be interconnected are limited to the ends of the insulated metal substrate. This has the problem of having to be guided to the edge of the substrate. In particular, modern hybrid integrated circuit devices equipped with microcomputers have a huge number of conductive paths that need to be interconnected, and the disadvantage is that a large amount of device mounting area is consumed by routing these conductive paths. .

In addition, when a microcomputer with 16 bits or more is installed, the width of the data bus and address bus becomes so large that it is impossible to cross them with a single wire bonding, so it is necessary to connect conductive paths that cross these buses. Until now, this has been done in several parts using a technique called jumping wire connection. Therefore, it also has the disadvantage that a large number of pads for connecting jumping wires consumes a large amount of device mounting area.

Furthermore, in the above-mentioned hybrid integrated circuit device, the internal leads are soldered after each insulated metal substrate is fixed to the case material, which not only complicates the manufacturing process but also makes subsequent functional tests difficult. It has the disadvantage that shooting is impossible.

B) Means for Solving the Problems The present invention has been made in view of the above problems, and includes a sub-substrate in which conductive paths are formed in a predetermined shape on an insulated metal substrate.
The device is located adjacent to a predetermined integrated circuit element fixedly mounted on the motherboard, and is fixed to the motherboard at a predetermined distance, thereby providing a high-density and high-integration hybrid integrated circuit device. .

(e) Operation Since the sub-board with conductive paths formed in a predetermined shape is placed at a predetermined position on the mother board, the conductive paths of the sub-board and the mother board can be interconnected at any peripheral edge of the sub-board. This makes it possible to suppress the routing of conductive paths on the motherboard.

Further, it becomes possible to connect a long span of the conductive path of the mother board by the conductive path of the sub-board, thereby suppressing the routing of the conductive path of the mother board and eliminating the need for pads for digital connection.

Furthermore, in order to arrange the sub-board adjacent to a predetermined integrated circuit element fixedly mounted on the mother board, the electrodes of the predetermined integrated circuit element are directly wire-bonded to both the mother board and the pads formed on the sub-board. becomes possible.

Furthermore, since the main surfaces of the sub-board and the mother board face in the same direction, functional tests and troubleshooting after the interconnection of the conductive paths between the sub-board and the mother board are facilitated.

(f) Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 to 3. Note that FIG. 1 is a plan view of the embodiment, and FIG. 2 is a sectional view taken along line 1-1 in FIG. Moreover, FIG. 3 is a plan view of the sub-board.

As shown in FIGS. 1 and 2, the hybrid integrated circuit device of the present invention has a substrate structure in which sub-boards (30) are spaced apart from each other at predetermined positions on a mother board (10).

The motherboard (10) has a surface anodized to 15~
An aluminum substrate with a thickness of 2.0 mm is used, and an adhesive insulating resin layer (not shown) is attached, and a copper foil is photoetched to form, for example, an address bus, a data bus, etc.
A conductive path (12) such as a control bus, a pad (14) for wire bonding with an electrode of an integrated circuit element (22),
For fixing the external lead pad (16), the band (18) for interconnecting the conductive paths formed on the motherboard (10) and the sub-board (30), and the supporting member of the sub-board (30). Pads (20) and the like are formed on the entire surface in a predetermined turn.

Integrated circuit elements such as microcomputers, programmable gate arrays, and memories (22) (24) (26
) is fixed on a predetermined die bond pad using Ag paste, etc., and is used for power integrated circuit elements (2) that generate a particularly large amount of heat.
2) (24) is fixed via a heat sink (28). Further, chip elements (not shown) such as chip resistors or chip capacitors are fixed by solder. Note that the integrated circuit element (
Wire bonding of the electrode in 26) is done on the sub-board (30)
This is done before the fixation of.

Next, the sub-board (30) will be explained with reference to FIG.

This figure is a diagram explaining the planar structure of the sub-board (30) on which circuit pattern formation and element fixation have been completed. Conductive paths (36) and pads (38) (40) (42) formed by photo-etching copper foil adhered to one or both sides with an insulating resin layer.
and an integrated circuit element (46) fixed on a predetermined die bond pad using Ag paste or the like.

For the sub-board (30), a copper alloy with a thickness of approximately 0.5 mm containing tin, chromium, nickel, iron, etc. is used in consideration of solder adhesion to the mother board (10) and strength.

The conductive path (36) of the sub-board (30) is connected to the sub-board (30)
Conductive paths (12) interconnecting the circuit elements above and formed on the motherboard (10) via pads (42) (18)
conductive paths (12) interconnected with and simply formed on the motherboard (10) via pads (42) (18);
Jump to connect.

In a given process, the tab (34) is approximately 3
The supporting portion (34) is bent perpendicularly to the surface of the sub-board (30) at a position of mm, thereby regulating the arrangement interval between the sub-board (30) and the mother board (10) to approximately 3 mm.

Note that this support portion (34) may be formed by drawing the metal of the sub-board (30), or may be formed by an individual support member, or even simply by forming the support portion (34) on the sub-board (30).
It is also possible to form it by bending the end portion of it. Also,
Although FIG. 3 shows the sub-board (30) having a multi-sided configuration, it may also have a single-sided configuration.

The embodiment will be described in further detail with reference to FIGS. 1 and 2 again.

When the support part (34) of the sub-board (30) is soldered and fixed to the band (20) formed on the mother board (10), the electronic circuit components of the sub-board (30) are bonded to each other, as shown in FIG. Therefore, considering the heat dissipation characteristics, the mother board (10)
A predetermined integrated circuit element (24) fixed to the sub-board (30) is exposed through the hole (32) formed in the sub-substrate (30), and a puff (40) is placed adjacent to the integrated circuit element (24). Therefore, despite the laminated substrate structure, it is possible to form a highly heat generating electronic circuit on the sub-substrate (30), and the electronic circuit that can be formed separately on the sub-substrate (30) is not limited.

Furthermore, the integrated circuit element (22) has a pad (4) of the mother board (10) and a pad (44) of the sub-board (30) arranged adjacent to each other. Such a pad arrangement is suitable for, for example, a ROM in which an address signal is supplied from the mother board (10) and its output data is supplied to the sub-board (30), and the address signal is supplied from the electrode of the integrated circuit element (22). The pad (14) of the mother board (10) or sub board (30)
) (44) The present invention, which allows direct wire bonding to wire bonding, has a remarkable effect of reducing the wire bonding process and the area of the conductive path.

These predetermined integrated circuit elements (22) and (24) are arranged so that their electrode surfaces are approximately at the same height as the sub-substrate (30) surface.
That is, the electrodes of the predetermined integrated circuit elements (22, 24) and the para-t' (40, 44) of the sub-substrate (30) are fixed via the heat sink (28) so that they are arranged on the same plane. Therefore, at least the above-mentioned integrated circuit element (22
) (24) and the pad (40) of the sub-board (30)
In wire bonding between (44), there is no need to move the bonding head significantly in the vertical direction, and the wire bonding efficiency is improved, especially in a hybrid integrated circuit device in which multi-bin integrated circuits are used.

Furthermore, by wire bonding the pad (42) formed on the sub-board (30) and the pad (18) formed on the mother board (10), the electronic circuit of the sub-board (30) and the mother board (10) are bonded. The interconnections of the electronic circuits are made, and the conductive paths (12) formed on the motherboard (10) are
) jumping connections are made.

As is already clear, since the hybrid integrated circuit device of the present invention has a substrate structure in which the sub-board (30) is spaced apart from a predetermined position on the mother board (10), the fixing process of the sub-board (30), the sub-board (30) The conductive path on the motherboard (1
0) The interconnection process of the conductive paths above is performed in the same way as for integrated circuit elements or chip elements fixed on the motherboard (10), and the manufacturing and testing processes except for the casing are completed on the motherboard (10). do. Furthermore, although the hybrid integrated circuit device of the present invention is finally sealed with a case material (not shown), it can be housed within the hollow structure of a conventional case material.

Although one embodiment of the present invention has been described above, the present invention can be modified in various ways with respect to the planar shape of the sub-board, etc., and is not limited to the embodiment.

(G) Effects of the Invention As described above, the hybrid integrated circuit device of the present invention has the following advantages: (1) The conductive path of the mother board and the conductive path of the sub-board can be interconnected at any position; This avoids a reduction in mounting area due to routing.

(2) Since a long span of the conductive path on the mother board can be connected by the conductive path on the sub-board, pads for jumping connections are not required, and a reduction in the mounting area can be avoided.

(3) Since metal substrates are used for both the mother board and the sub-board, the heating elements can be freely arranged.

(4) Since the sub-boards are spaced and fixed on the mother board, the entire area of the mother board can be used for mounting elements.

(5) Since the sub-board is placed adjacent to a predetermined integrated circuit element fixedly mounted on the mother board, the integrated circuit element electrode can be directly wire-bonded to both the mother board pad and the sub-board pad. The number of bondings is reduced and the area of the conductive path is reduced.

(6) Since the main surfaces of the sub-board and the mother board face in the same direction, it is easy to perform functional tests and troubleshooting after interconnecting the conductive paths between the sub-board and the mother board.

(7) A high degree of integration is achieved because chip elements are used as integrated circuits.

(8) Since a copper alloy that is easy to process is used for the sub-board, the supporting part for separating and fixing can be integrally molded.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a sectional view taken along line I-1 in FIG. 1, FIG. 3 is a plan view of a sub-board used in the present invention, and FIG. 4 is a conventional FIG. 2 is a plan view of a hybrid integrated circuit device. 10...Mother board, 12.36...Conducting path, 14
．． 38.40.44...Pad, 16--Band for external lead, 18.42--Pad for internal connection,
20... Pad for support member, 22.24.46
... integrated circuit element, 30 ... sub-board, 32
...hole, 34...support member.

Claims (9)

[Claims] (1) A motherboard in which a conductive path is formed in a predetermined shape on a first insulated metal substrate, and at least an integrated circuit element is fixedly mounted on a predetermined position of the conductive path; It is composed of a sub-board on which a conductive path is formed and an integrated circuit element and/or a chip element such as a chip resistor or a chip capacitor is fixedly mounted on a predetermined position of the conductive path, and the sub-board is fixedly mounted on a mother board. A hybrid integrated circuit device characterized in that it is arranged adjacent to a predetermined integrated circuit element. (2) The hybrid integrated circuit device according to claim 1, wherein the predetermined integrated circuit element electrode and the pad of the sub-substrate are wire-bonded. (3) The hybrid integrated circuit device according to claim 1, wherein the sub-board height and the mounting height of the predetermined integrated circuit element fixed on the motherboard are approximately equal. (4) The hybrid integrated circuit device according to claim 1, wherein the required conductive paths on the mother board are connected via conductive paths on a sub-board. (5) The hybrid integrated circuit device according to claim 1, wherein the second insulated metal substrate is made of copper or a copper alloy. (6) The hybrid integrated circuit device according to claim 1, wherein an end of the sub-board is bent, or a tab formed at the end of the board is bent to serve as a support for the sub-board. (7) The hybrid integrated circuit device according to claim 1, wherein the area of the sub-board is smaller than that of the mother board. (8) The hybrid integrated circuit device according to claim 1, wherein a predetermined conductive path on the sub-board and a conductive path on the mother board are wire-bonded. (9) The hybrid integrated circuit device according to claim 1, wherein a chip element is used as the integrated circuit element.