JPH0411567B2 - - Google Patents
Info
- Publication number
- JPH0411567B2 JPH0411567B2 JP61237202A JP23720286A JPH0411567B2 JP H0411567 B2 JPH0411567 B2 JP H0411567B2 JP 61237202 A JP61237202 A JP 61237202A JP 23720286 A JP23720286 A JP 23720286A JP H0411567 B2 JPH0411567 B2 JP H0411567B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- molecule
- compound
- resin
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 150000001875 compounds Chemical class 0.000 claims description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- 125000005442 diisocyanate group Chemical group 0.000 claims description 5
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 230000001476 alcoholic effect Effects 0.000 claims description 2
- -1 methacryloyl group Chemical group 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 22
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 10
- 238000004458 analytical method Methods 0.000 description 9
- 239000012948 isocyanate Substances 0.000 description 9
- 150000002513 isocyanates Chemical class 0.000 description 9
- 230000000704 physical effect Effects 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 229920001567 vinyl ester resin Polymers 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Description
〔産業上の利用分野〕
本発明は、塗料、接着剤、コーテイング剤、ラ
イニング剤、成形材、FRPなど各種用途に有用
な、硬くしかも強度に優れた新規構造を有するラ
ジカル硬化可能な樹脂の製造方法に関する。
〔従来の技術〕
現在、常温で硬化可能なラジカル硬化型の樹脂
としては、不飽和ポリエステル樹脂およびビニル
エステル樹脂(エポキシアクリレート樹脂)が代
表的であり、それぞれの特長を生かしてFRP、
塗料、注型など各分野に広く用いられている。
然し、用途が拡まるにつれて、新しい要望が生
じたり、或は従来用途にあつても生産性の向上、
コストの切下げといつたことは、いつまでも続く
課題である。
故に、樹脂の物性向上についての要求も厳し
く、止まる所がない。
1例をあげるならば、FRP成形品の表面層を
形成しているゲルコートにしても、より硬くて傷
がつき難く、より耐熱性、色調安定性に優れたも
のに対する要望は常に存在している。
ビニルエステル樹脂の粘度を高め、高性能の
SMC,BMCとして用いようとする要望もあり、
この場合にはジイソシアナートとビニルエステル
樹脂中に存在するヒドロキシル基とを反応させる
ことが行われている。
然し、理由は明らかではないが、ビニルエステ
ル樹脂に少量(5%以下)のジイソシアナートを
加える場合でも反応中にゲル化することがあり、
生成したSMC,BMCの成形性も安定したもので
ないことも知られている。
〔発明が解決しようとする問題点〕
本発明は、以上の問題点、例えばジイソシアナ
ート使用による樹脂系の物性を安定に維持し、変
性樹脂の製造を可能にする他、FRPの物性を極
力高めようとするものである。例えば、硬さを例
にとつた場合、不飽和ポリエステル樹脂の最も反
応性の高い硬質タイプでもロツクウエル硬度Mス
ケールで約110程度、鉛筆硬さで2H位である。
またビニルエステル樹脂の最も硬いタイプでも
ロツクウエル硬度Mスケールで105〜106位であつ
て、とてもメラミン樹脂の硬さであるロツクウエ
ル硬度Mスケール115〜120、鉛筆硬さ4Hには及
ばないものであつた。
〔問題点を解決するための手段〕
本発明者らは、既存ラジカル硬化型樹脂の欠点
を解消し、用途拡大のために検討を重ねた結果、
(A) 1分子中に2個以上のフエノール性水酸基を
有する多価フエノール又はノボラツク(以下多
価フエノール類という)に、モノエポキシ化合
物を、エポキシ基とフエノール性水酸基とが実
質的に等モルになるように反応させて得られ
る、1分子中に2個以上のアルコール性水酸基
(以下ヒドロキシル基という)を有するポリヒ
ドロキシル化合物と、
(B) 1分子中に1個のエポキシ基を有する飽和モ
ノエポキシ化合物に、アクリル酸またはメタア
クリル酸(以下、(メタ)アクリル酸という)
を、実質的に等モルで反応して得られる、1分
子中にそれぞれ1個のアクリロイル基またはメ
タクリロイル基(以下、(メタ)アクリロイル
基という)とヒドロキシル基とを共有する不飽
和モノヒドロキシル化合物とを、
(C) ジイソシアナートと、
反応させて少なくとも4個のウレタン結合を介
して(A)成分と(B)成分とを(C)成分によつて結合させ
てなる硬化可能な樹脂が硬くしかも強度にすぐれ
ていることを見出し、本発明方法に到達した。
〔作用〕
先づ、本発明の理解を助けるために、代表例を
用いた本発明の硬化可能な樹脂の化学構造式を示
す。
[Industrial Application Field] The present invention is directed to the production of radically curable resins having a novel structure that is hard and has excellent strength and is useful for various uses such as paints, adhesives, coating agents, lining agents, molding materials, and FRP. Regarding the method. [Conventional technology] Currently, unsaturated polyester resins and vinyl ester resins (epoxy acrylate resins) are typical as radical-curing resins that can be cured at room temperature.
It is widely used in various fields such as paint and casting. However, as the range of applications expands, new demands arise, or improvements in productivity and
Cutting costs is a continuing challenge. Therefore, the demands for improving the physical properties of resins are severe and there is no end in sight. To give one example, there is always a demand for gel coats that form the surface layer of FRP molded products, which are harder, more scratch resistant, more heat resistant, and have better color stability. . By increasing the viscosity of vinyl ester resin, high performance
There are also requests to use it as SMC and BMC,
In this case, diisocyanate and hydroxyl groups present in the vinyl ester resin are reacted. However, although the reason is not clear, even when a small amount (5% or less) of diisocyanate is added to vinyl ester resin, gelation may occur during the reaction.
It is also known that the moldability of the SMC and BMC produced is not stable. [Problems to be Solved by the Invention] The present invention addresses the above-mentioned problems, for example, by using diisocyanate to stably maintain the physical properties of a resin system, making it possible to produce a modified resin, and also by improving the physical properties of FRP as much as possible. It is intended to increase. For example, in terms of hardness, even the most reactive hard type of unsaturated polyester resin is about 110 on the Rockwell hardness M scale and about 2H on the pencil hardness scale. Furthermore, even the hardest type of vinyl ester resin has a hardness of 105 to 106 on the Rockwell M scale, which is far below the hardness of melamine resin, which is 115 to 120 on the Rockwell M scale and 4H in pencil hardness. . [Means for Solving the Problems] As a result of repeated studies to eliminate the drawbacks of existing radical-curing resins and expand their use, the present inventors found that (A) two or more phenols in one molecule; A monoepoxy compound is reacted with a polyhydric phenol or novolak having a phenolic hydroxyl group (hereinafter referred to as polyhydric phenols) so that the epoxy group and the phenolic hydroxyl group are substantially equimolar in one molecule. (B) A polyhydroxyl compound having two or more alcoholic hydroxyl groups (hereinafter referred to as hydroxyl group), and (B) a saturated monoepoxy compound having one epoxy group in one molecule, acrylic acid or methacrylic acid (hereinafter referred to as hydroxyl group). (meth)acrylic acid)
An unsaturated monohydroxyl compound having one acryloyl group or methacryloyl group (hereinafter referred to as (meth)acryloyl group) and a hydroxyl group in each molecule, which is obtained by reacting substantially equimolar amounts of is reacted with (C) diisocyanate to bond components (A) and (B) with component (C) through at least four urethane bonds, resulting in a hard curable resin. Moreover, it was discovered that it has excellent strength, and the method of the present invention was developed. [Function] First, in order to aid understanding of the present invention, the chemical structural formula of the curable resin of the present invention will be shown using representative examples.
次に、本発明の理解を助けるために、以下に実
施例を示す。
実施例 1
ポリヒドロキシル化合物〔1〕の製造
攪拌機、還流コンデンサー、温度計を付した1
三ツ口フラスコに、ビスフエノールAを228g、
フエニルグリシジルエーテル300g、トリメチル
ベンジルアムモニウムクロライド1.5gを仕込み、
昇温すると、120℃を越えた段階で急速に発熱す
る。
冷却して150〜160℃に保ち、以後再加熱して
150〜160℃に5時間反応すると、赤外分析の結果
遊離のエポキシ基は完全に消失したことが認めら
れた。
室温に迄冷却したポリヒドロキシル化合物
〔1〕は淡黄褐色半固形状であつた。
イソシアナート付加体〔〕の製造
同様な装置に、ポリヒドロキシル化合物〔1〕
を520g、スチレン250g、パラベンゾキノン0.01
gを秤取し、60〜70℃に加温溶解した後、2,4
−トリレンジイソシアナート350gを加え、60℃
で5時間反応すると、赤外分析の結果遊離のイソ
シアナート基は約55%減少したことが認められ
た。
スチレン250gを追加し、イソシアナート付加
体〔〕が淡黄褐色液状で得られた。
不飽和モノヒドロキシル化合物〔〕の製造
攪拌機、還流コンデンサー、温度計を付した1
三ツ口フラスコに、フエニルグリシジルエーテ
ル300g、メタクリル酸172g、トリフエニルホス
フイン2g、ハイドロキノン0.2gを仕込み、120
〜130℃に3時間加熱反応すると、酸価は4.1とな
つたので、スチレン260gを加え、不飽和モノヒ
ドロキシル化合物〔〕(スチレン溶液)を製造
した。
硬化可能な樹脂〔A〕の製造
イソシアナート付加体〔〕全量に、不飽和モ
ノヒドロキシル化合物〔〕(スチレン溶液)730
gを攪拌機、還流コンデンサー、温度計を付した
3三ツ口フラスコに移す。
60℃に迄昇温させた後、ジブチル錫ジラウレー
ト4gを加え、60℃で3時間反応すると、赤外分
析の結果のイソシアナート基の消失したことが認
められた。
更にスチレン585gを追加し、硬化可能な樹脂
〔A〕が赤褐色、粘度8.7ポイズで得られた。
樹脂〔A〕100部に、硬化剤として化薬ヌーリ
ー社の#328Eを1.5部、ナフテン酸コバルト0.3部
を混合した系は31分でゲル化し、急速に発熱して
最高温度は170℃に達した。
硬化樹脂の物性は次の通りであつた。
曲げ強さ 15.7Kg/mm2
熱変形温度 116℃
ロツクウエル硬度 M−116
シヤルピー衝撃値 2.6Kgcm/cm2
実施例 2
イソシアナート付加体〔〕の製造
攪拌機、温度計、還流コンデンサー、ガス導入
管を付した2四ツ口フラスコに、ビスフエノー
ルAに各1モルのプロピレンオキシドを付加し
た、旭電化社商品名BPX−11を350g、スチレン
250g、パラベンゾキノン0.01g、を均一に溶解
した後、ジフエニルメタンジイソシアナート500
gを加え、乾燥空気下60℃で5時間反応すると、
赤外分析の結果、イソシアナート基は約59(%)
減少したものと判断された。
生成したイソシアナート付加体〔〕はやや白
濁を帯びた黄褐色粘稠な液体であつた。
硬化可能な樹脂〔B〕の製造
前述した装置を付したイソシアナート付加体
〔〕中に、プロピレンオキシドとメタクリル酸
の反応生成物である2−ヒドロキシプロピルメタ
クリレートを288g、スチレン615g、パラベンゾ
キノン0.1g、ジブチル錫ジラウレート3gを加
え、60℃に5時間反応すると、赤外分析の結果遊
離のイソシアナート基は完全に消失したことが認
められた。
得られた硬化可能な樹脂〔B〕は黄褐色、粘度
3.9ポイズであつた。
樹脂〔B〕100部に、328Eを2部、ナフテン酸
コバルト0.5部加えた系は室温27分でゲル化し、
急速に発熱して最高温度は164℃に達した。
硬化樹脂の物性はつぎの通りであつた。
曲げ強さ 16.8Kg/mm2
曲げ弾性係数 420Kg/mm2
熱変形温度 118℃
ロツクウエル硬さ M−115
シヤルピー衝撃値 3.2Kgcm/cm2
実施例 3
イソシアナート付加体〔〕の製造
攪拌機、還流コンデンサー、温度計、ガス導入
管を付した3セパラブルフラスコに、スチレン
300g、2−ヒドロキシエチルメタクリレート260
g、イソホロンジイソシアナート444g、を加え
乾燥空気中で70〜75℃、8時間加熱すると、赤外
分析の結果、遊離のイソシアナート基は48(%)
減少したものと推定され、イソシアナート付加体
〔〕が淡黄色、液状で得られた。
ノボラツク−エポキシ化合物付加体〔〕の製
造
攪拌機、還流コンデンサー、温度計、滴下ロー
ト、を付した2セパラブルフラスコに、ノボラ
ツク(フエノール940g、40%ホルマリン750g、
蓚酸20g、を反応させて得られる生成物を、水蒸
気蒸溜して遊離フエノールを0.4%とした融点約
80℃の、GPC分析の結果ほぼ2.1〜2.5核体と思わ
れる)を250g、フエニルグリシジルエーテル300
g、トリメチルベンジルアンモニウムクロライド
2.5g、を仕込み120〜130℃に加熱すると、急速
に発熱して160℃付近に達するので、これ以上昇
温させないように冷却し、5時間150〜160℃で反
応すると、赤外分析の結果遊離のエポキシ基は消
失したことが認められた。
スチレン450gを加え、ノボラツク−モノエポ
キシ付加体が淡黄褐色液状で得られた。
硬化可能な樹脂〔C〕の製造
前述した装置を付したイソシアナート付加体
〔〕中に、ノボラツク−エポキシ化合物付加体
〔〕を1000g加え、更にパラベンゾキノン0.1
g、ジブチル錫ジラウレート5g、加え70℃で5
時間反応すると、赤外分析の結果遊離のイソシア
ナート基は消失したものと判断された。
スチレン400gを加え、得られた硬化可能な樹
脂〔C〕は黄褐色粘度4.4ポイズであつた。
樹脂〔C〕100部に、328E1.5部、ナフテン酸コ
バルト0.5部加えた系は、室温で27分でゲル化後
急速に発熱し最高発熱温度は167℃に達した。
硬化樹脂の物性は次表にみられるようであつ
た。
曲げ強さ 15.9Kg/mm2
曲げ弾性係数 470Kg/mm2
熱変形温度 124℃
ロツクウエル硬さ M−114
シヤルピー衝撃値 2.3Kgcm/cm2
〔発明の効果〕
本発明方法によつて得られる新規構造を有する
硬化可能な樹脂は、その合成が容易であり、また
ラジカル硬化させることによつて、ビニルエステ
ル樹脂より優れた物性、特に耐熱性及び機械的強
度に優れた性質を有する硬化物が得られるので、
塗料、接着剤、コーテイング剤、ライニング剤、
成形材、FRPなど各種用途に極めて有用である。
Next, examples will be shown below to help understand the present invention. Example 1 Production of polyhydroxyl compound [1] 1 equipped with a stirrer, reflux condenser, and thermometer
228g of bisphenol A in a three-necked flask,
Prepare 300g of phenyl glycidyl ether and 1.5g of trimethylbenzyl ammonium chloride.
When the temperature rises, it rapidly generates heat once it exceeds 120℃. Cool and keep at 150-160℃, then reheat.
After reacting at 150-160°C for 5 hours, infrared analysis showed that free epoxy groups had completely disappeared. The polyhydroxyl compound [1] cooled to room temperature was a light yellowish brown semi-solid. Production of isocyanate adduct [] In a similar apparatus, polyhydroxyl compound [1]
520g, styrene 250g, parabenzoquinone 0.01
Weigh out 2,4g of
-Add 350g of tolylene diisocyanate and 60℃
After reacting for 5 hours, infrared analysis showed that the free isocyanate groups had decreased by about 55%. 250 g of styrene was added to obtain an isocyanate adduct [] in the form of a pale yellowish brown liquid. Production of unsaturated monohydroxyl compound [] 1 equipped with a stirrer, reflux condenser, and thermometer
Into a three-necked flask, charge 300 g of phenyl glycidyl ether, 172 g of methacrylic acid, 2 g of triphenylphosphine, and 0.2 g of hydroquinone.
When the reaction was heated to ~130°C for 3 hours, the acid value became 4.1, so 260 g of styrene was added to produce an unsaturated monohydroxyl compound (styrene solution). Production of curable resin [A] Add unsaturated monohydroxyl compound [] (styrene solution) 730 to the total amount of isocyanate adduct []
Transfer g to a three-necked flask equipped with a stirrer, reflux condenser, and thermometer. After raising the temperature to 60°C, 4 g of dibutyltin dilaurate was added and the mixture was reacted at 60°C for 3 hours. As a result of infrared analysis, it was confirmed that the isocyanate group had disappeared. Furthermore, 585 g of styrene was added to obtain a curable resin [A] having a reddish brown color and a viscosity of 8.7 poise. A system in which 100 parts of resin [A], 1.5 parts of #328E from Kayaku Nouri Co., Ltd. as a curing agent, and 0.3 parts of cobalt naphthenate were mixed together gelled in 31 minutes and rapidly generated heat, reaching a maximum temperature of 170°C. did. The physical properties of the cured resin were as follows. Bending strength 15.7Kg/mm 2Heat distortion temperature 116℃ Rockwell hardness M-116 Shalpy impact value 2.6Kgcm/cm 2Example 2 Production of isocyanate adduct [] Equipped with a stirrer, thermometer, reflux condenser, and gas introduction tube Into a two-four-necked flask, 350 g of Asahi Denka's brand name BPX-11, which has 1 mole of propylene oxide added to bisphenol A, and styrene were added.
After uniformly dissolving 250 g of parabenzoquinone and 0.01 g of parabenzoquinone, 500 g of diphenylmethane diisocyanate was added.
g and reacted for 5 hours at 60℃ under dry air,
As a result of infrared analysis, the isocyanate group is approximately 59 (%)
It was determined that the amount had decreased. The produced isocyanate adduct [ ] was a slightly cloudy yellowish brown viscous liquid. Production of curable resin [B] In the isocyanate adduct [] equipped with the above-mentioned equipment, 288 g of 2-hydroxypropyl methacrylate, which is a reaction product of propylene oxide and methacrylic acid, 615 g of styrene, and 0.1 g of parabenzoquinone are added. , dibutyltin dilaurate (3 g) was added, and the mixture was reacted at 60° C. for 5 hours. As a result of infrared analysis, it was confirmed that the free isocyanate groups had completely disappeared. The obtained curable resin [B] has a yellowish brown color and a viscosity of
It was 3.9 poise. A system in which 100 parts of resin [B], 2 parts of 328E, and 0.5 parts of cobalt naphthenate were added gelled at room temperature for 27 minutes.
The patient rapidly developed a fever, reaching a maximum temperature of 164°C. The physical properties of the cured resin were as follows. Bending strength 16.8Kg/mm 2Bending modulus of elasticity 420Kg/mm 2Heat distortion temperature 118℃ Rockwell hardness M-115 Sharpie impact value 3.2Kgcm/cm 2Example 3 Production of isocyanate adduct [] Stirrer, reflux condenser, Add styrene to a 3-separable flask equipped with a thermometer and gas inlet tube.
300g, 2-hydroxyethyl methacrylate 260
g and 444 g of isophorone diisocyanate were added and heated in dry air at 70-75°C for 8 hours. As a result of infrared analysis, the free isocyanate group was 48 (%).
The isocyanate adduct [] was obtained in a pale yellow liquid state. Production of novolac-epoxy compound adduct [] Into two separable flasks equipped with a stirrer, reflux condenser, thermometer, and dropping funnel, add novolac (940 g of phenol, 750 g of 40% formalin,
The product obtained by reacting 20 g of oxalic acid was steam distilled to contain 0.4% free phenol, with a melting point of approx.
At 80°C, 250 g of 2.1-2.5 nuclear bodies (according to GPC analysis), 300 g of phenyl glycidyl ether
g, trimethylbenzylammonium chloride
When 2.5g of 2.5g was prepared and heated to 120-130℃, it rapidly generated heat and reached around 160℃, so it was cooled to prevent the temperature from rising any further and reacted at 150-160℃ for 5 hours.The result of infrared analysis was It was observed that free epoxy groups disappeared. 450 g of styrene was added to obtain a novolac-monoepoxy adduct in the form of a pale yellowish brown liquid. Production of curable resin [C] Add 1000 g of novolak-epoxy compound adduct [] to the isocyanate adduct [] equipped with the above-mentioned equipment, and add 0.1 g of parabenzoquinone.
g, 5 g of dibutyltin dilaurate, and 5 g at 70℃.
After the time reaction, it was determined that free isocyanate groups disappeared as a result of infrared analysis. 400 g of styrene was added, and the resulting curable resin [C] had a yellowish brown viscosity of 4.4 poise. A system containing 100 parts of resin [C], 1.5 parts of 328E, and 0.5 parts of cobalt naphthenate rapidly generated heat after gelling at room temperature for 27 minutes, reaching a maximum exothermic temperature of 167°C. The physical properties of the cured resin were as shown in the table below. Bending strength 15.9Kg/mm 2 Bending modulus of elasticity 470Kg/mm 2 Heat distortion temperature 124℃ Rockwell hardness M-114 Sharpie impact value 2.3Kgcm/cm 2 [Effects of the invention] The novel structure obtained by the method of the present invention This curable resin is easy to synthesize, and by radical curing, a cured product with better physical properties than vinyl ester resins, especially in heat resistance and mechanical strength, can be obtained. ,
Paints, adhesives, coating agents, lining agents,
Extremely useful for various applications such as molding materials and FRP.
Claims (1)
基を有する多価フエノール又はノボラツクに、
モノエポキシ化合物を、エポキシ基とフエノー
ル性水酸基とが実質的に等モルになるように反
応させて得られる、1分子中に2個以上のアル
コール性水酸基を有するポリヒドロキシル化合
物と、 (B) 1分子中に1個のエポキシ基を有する飽和モ
ノエポキシ化合物に、アクリル酸またはメタア
クリル酸を、実質的に等モルで反応して得られ
る、1分子中にそれぞれ1個のアクリロイル基
またはメタクリロイル基とヒドロキシル基とを
共有する不飽和モノヒドロキシル化合物を、 (C) ジイソシアナートと、 反応させて少なくとも4個のウレタン結合を介
して(A)成分と(B)成分とを(C)成分によつて結合させ
ることを特徴とする硬化可能な樹脂な製造方法。[Scope of Claims] 1 (A) A polyhydric phenol or novolak having two or more phenolic hydroxyl groups in one molecule,
A polyhydroxyl compound having two or more alcoholic hydroxyl groups in one molecule, which is obtained by reacting a monoepoxy compound so that the epoxy group and the phenolic hydroxyl group are substantially equimolar; (B) 1 One acryloyl group or methacryloyl group in each molecule obtained by reacting acrylic acid or methacrylic acid in substantially equimolar amounts with a saturated monoepoxy compound having one epoxy group in the molecule. An unsaturated monohydroxyl compound that shares a hydroxyl group is reacted with (C) a diisocyanate to form components (A) and (B) with component (C) through at least four urethane bonds. A method for producing a curable resin characterized by bonding with a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61237202A JPS6392633A (en) | 1986-10-07 | 1986-10-07 | Curable resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61237202A JPS6392633A (en) | 1986-10-07 | 1986-10-07 | Curable resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6392633A JPS6392633A (en) | 1988-04-23 |
| JPH0411567B2 true JPH0411567B2 (en) | 1992-02-28 |
Family
ID=17011889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61237202A Granted JPS6392633A (en) | 1986-10-07 | 1986-10-07 | Curable resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6392633A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5352511A (en) * | 1993-11-15 | 1994-10-04 | W. L. Gore & Associates, Onc. | Hydrophilic compositions with increased thermal resistance |
-
1986
- 1986-10-07 JP JP61237202A patent/JPS6392633A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6392633A (en) | 1988-04-23 |
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