JPH04124648A - Production of anti-static silver halide film photosensitive material - Google Patents
Production of anti-static silver halide film photosensitive materialInfo
- Publication number
- JPH04124648A JPH04124648A JP24565690A JP24565690A JPH04124648A JP H04124648 A JPH04124648 A JP H04124648A JP 24565690 A JP24565690 A JP 24565690A JP 24565690 A JP24565690 A JP 24565690A JP H04124648 A JPH04124648 A JP H04124648A
- Authority
- JP
- Japan
- Prior art keywords
- acrylamide
- meth
- methylol
- silver halide
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
(A)産業上の利用分野
本発明は、ハロゲン化銀写真感光材料に関し、より詳し
くは帯電防止された裏塗り層の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (A) Industrial Application Field The present invention relates to silver halide photographic materials, and more particularly to a method for producing an antistatic backing layer.
(B)従来技術およびその問題点
ハロゲン化銀写真材料は、ベースとしてフィルム、紙等
が用いられているが、これらは導電性が低く種々の問題
が引き起こされていた。(B) Prior art and its problems Silver halide photographic materials use films, paper, etc. as a base, but these have low conductivity and have caused various problems.
これらの問題点の1つは、フィルム、紙等にハロゲン化
銀を含む塗布液を塗布する場合、コーターで高速で塗布
するのであるが、ローラーで摩擦されこすられている間
に帯電し、これが放電した時にハロゲン化銀をカプラせ
る(静電気カブリ)という問題である。もし裏塗り層の
導電性を高め帯電防止を施してあれば通常ハロゲン化銀
乳剤の塗布の前に裏塗り層を塗布するので、この裏塗り
層がベースを通して反対側の乳剤を塗布する面の帯電防
止性も向上させ静電気カブリを防止出来る。One of these problems is that when applying a coating solution containing silver halide to film, paper, etc., it is coated at high speed with a coater, but while it is being rubbed by a roller, it is charged and charged. The problem is that silver halide is coupled during discharge (static fog). If the backing layer has high conductivity and antistatic properties, the backing layer is usually applied before the silver halide emulsion is applied, so that the backing layer passes through the base and covers the side to be coated with the opposite emulsion. It also improves antistatic properties and prevents static fog.
第2に、ユーザーが感光材料を使用する時に、これらが
帯電しているとゴミ、ホコリが感光材料に付着し、露光
及び写真処理の過程でピンホール等の好ましくない画像
を形成することがあるし、感光材料同志がくっついて作
業性が悪いという問題がある。更に人間の手を通してこ
れら感光材料が放電するという問題もある。Second, when users use photosensitive materials, if they are charged, dirt and dust may adhere to the photosensitive materials and form undesirable images such as pinholes during exposure and photographic processing. However, there is a problem in that the photosensitive materials stick together, resulting in poor workability. Furthermore, there is also the problem that these photosensitive materials discharge when passed through human hands.
これらの問題で重要なことは現像、定着、水洗という処
理の前でも後でも帯電特性が良好でなくてはならないと
いう点である。What is important in these problems is that charging characteristics must be good both before and after processing such as development, fixing, and washing with water.
特許公開公報昭56−92535、開閉61−1745
42によれば裏塗り層とベースの間に帯電防止層を設け
、この層を通して帯電防止性を高め、かつこの層と裏塗
り層の接着性を向上させるためにアジリジン硬膜剤を用
いることが記載されている。しかしながらアジリジン硬
膜剤は皮膚をカブラせ安全衛生上好ましくなく、さらに
ベースとの間に帯電防止層を設けているために裏塗り層
の接着が充分でなくかつ乾燥性が悪いという欠点を有し
ていた。Patent Publication No. 56-92535, opening/closing 61-1745
According to No. 42, an antistatic layer may be provided between the backing layer and the base, and an aziridine hardener may be used to increase the antistatic properties through this layer and to improve the adhesion between this layer and the backing layer. Are listed. However, aziridine hardeners cause skin fogging, which is undesirable from a safety and hygiene perspective.Furthermore, because an antistatic layer is provided between the aziridine hardener and the base, the adhesion of the backing layer is insufficient and drying properties are poor. was.
(C)発明の目的
本発明の目的は、良好な帯電防止性を持った裏塗り層の
製造方法を提供することであり、更に接着が良好で且つ
ブロッキング防止性に優れた裏塗り層の製造方法を提供
することである。(C) Purpose of the Invention The purpose of the present invention is to provide a method for manufacturing a backing layer with good antistatic properties, and furthermore, to provide a method for manufacturing a backing layer with good adhesion and excellent antiblocking properties. The purpose is to provide a method.
(D)発明の構成
本発明は、導電性ポリマー層をゼラチンを含む裏塗り層
をフィルムベースの間に持つハロゲン化銀フィルム感光
材料の製造方法において、該導電性ポリマーがN−メチ
ロール(メタ)アクリルアミドとスチレンスルホン酸の
共重合体からなり、N−メチロール(メタ)アクリルア
ミドの共重合比率が10重量%以上60重量%以下であ
り、かつ該ポリマー層の塗布時の乾燥湿度が40℃以上
で、かつ乾燥終了後相対湿度40〜60%の雰囲気下で
巻き取り、更に任意の条件下で該導電性ポリマー層の上
にゼラチンを含む裏塗り層を施すことにより達成される
。(D) Structure of the Invention The present invention provides a method for producing a silver halide film photosensitive material having a conductive polymer layer between a film base and a backing layer containing gelatin, wherein the conductive polymer is N-methylol (meth). Consisting of a copolymer of acrylamide and styrene sulfonic acid, the copolymerization ratio of N-methylol (meth)acrylamide is 10% by weight or more and 60% by weight or less, and the drying humidity at the time of coating the polymer layer is 40°C or higher. After drying, the film is rolled up in an atmosphere with a relative humidity of 40 to 60%, and a backing layer containing gelatin is further applied on the conductive polymer layer under arbitrary conditions.
本発明に用いられる導電性ポリマーはN−メチロール(
メタ)アクリルアミドとスチレンスルホン酸の共重合体
であり、加熱により架橋するものである。共重合体中の
N−メチロール(メタ)アクリルアミドの比率は10重
量%以上60重量%以下である。10重量%未満の比率
では加熱により充分な架橋をせず、アルカリ性や酸性の
写真処理に耐えられない。また、60重量%を越える比
率では帯電防止層に関わるスチレンスルホン酸又はその
アルカリ金属塩の割合が相対的に低下するために、充分
な帯電防止性が得られない。The conductive polymer used in the present invention is N-methylol (
It is a copolymer of meth)acrylamide and styrene sulfonic acid, and crosslinks when heated. The ratio of N-methylol (meth)acrylamide in the copolymer is 10% by weight or more and 60% by weight or less. If the ratio is less than 10% by weight, sufficient crosslinking will not occur upon heating and the resin will not be able to withstand alkaline or acidic photographic processing. Furthermore, if the ratio exceeds 60% by weight, the proportion of styrene sulfonic acid or its alkali metal salt involved in the antistatic layer is relatively reduced, and sufficient antistatic properties cannot be obtained.
該共重合体の製造は、P−スチレンスルホン酸又はその
アルカリ金属塩とN〜メチロール(メタ)アクリルアミ
ドとの混合物を、好ましくはアルコール/水混合溶剤に
溶解し、モノマーの状態では該媒体に溶解するが、重合
の進行に伴いポリマーが生成すると該媒体に不溶性とな
り析出するような系で重合を行う。少なくとも40重量
%以上の濃度でアルコールを含有する水/アルコール混
合溶媒系が特に好ましい。こうした重合を行う際に、あ
らかじめ該媒体に可溶な樹脂を存在させておくことで、
析出するポリマーが微粒子状に得られる。The copolymer is produced by dissolving a mixture of P-styrene sulfonic acid or its alkali metal salt and N~methylol(meth)acrylamide in a mixed solvent of alcohol/water, and dissolving the monomer in the medium. However, as the polymerization progresses, the polymer is formed, becomes insoluble in the medium, and precipitates. Particularly preferred are water/alcohol mixed solvent systems containing alcohol in a concentration of at least 40% by weight. When performing such polymerization, by making a soluble resin exist in the medium in advance,
The precipitated polymer is obtained in the form of fine particles.
即ち、分散安定剤として作用するポリマーの存在下でモ
ノマーの状態では媒体に可溶であるが、ポリマーになる
と不溶性となるような条件で重合をおこなう。That is, in the presence of a polymer that acts as a dispersion stabilizer, polymerization is carried out under conditions such that the monomer state is soluble in the medium, but the polymer becomes insoluble.
さらに本発明において、スチレンスルホン酸又はそのア
ルカリ金属塩およびN−メチロール(メタ)アクリルア
ミド以外にも第3成分として種々のモノマーが共重合可
能であるが、その中でも特に酸性基を有するモノマーを
共重合することで、皮膜の熱硬化性をさらに促進するこ
とができる。Furthermore, in the present invention, various monomers other than styrene sulfonic acid or its alkali metal salt and N-methylol (meth)acrylamide can be copolymerized as the third component, but among them, monomers having acidic groups are particularly copolymerized. By doing so, the thermosetting properties of the film can be further promoted.
このようなモノマーとしてとくに(メタ)アクリル酸、
2−アクリルアミド−2−メチルプロパンスルホン酸ま
たはマレイン酸のような酸性モノマーの共重合が好まし
い。このような酸性モノマーの共重合比率は0.5重量
%から10重量%程度の範囲が好ましい。Such monomers include (meth)acrylic acid,
Preference is given to copolymerization of acidic monomers such as 2-acrylamido-2-methylpropanesulfonic acid or maleic acid. The copolymerization ratio of such acidic monomers is preferably in the range of about 0.5% by weight to 10% by weight.
本発明の熱硬化性を有する帯電防止用ポリマーは上記の
ような組成により合成され、基本的には充分な性能を有
する耐水性帯電防止皮膜が形成されるのであるが、さら
に必要に応じては上記以外のモノマーとしてスチレンお
よびその誘導体や(メタ)アクリル酸エステル等のモノ
マーを共重合させてもよい。The thermosetting antistatic polymer of the present invention is synthesized with the above composition, and basically forms a water-resistant antistatic film with sufficient performance. As monomers other than those mentioned above, monomers such as styrene, derivatives thereof, and (meth)acrylic acid esters may be copolymerized.
スチレンスルホン酸のカウンターイオンとじてはナトリ
ウムイオン、カリウムイオン等のアルカリ金属イオンが
好ましい。以下に合成例を示す。As counter ions for styrene sulfonic acid, alkali metal ions such as sodium ions and potassium ions are preferred. A synthesis example is shown below.
合成例1
撹拌機、温度計、窒素導入管および還流冷却管を備えた
500m14ツロフラスコにポリビニルピロリドン’7
g、p−スチレンスルホン酸ナトリウム70g、N−メ
チロールアクリルアミド30gを仕込み、エタノール2
00gおよび蒸留水100gを加え、70℃で溶解した
。窒素雰囲気下75℃でAIBNl、gを添加し重合を
開始したところ安定な白色エマルジョンを生成した。Synthesis Example 1 Polyvinylpyrrolidone '7 was placed in a 500 m 14 flask equipped with a stirrer, thermometer, nitrogen inlet tube, and reflux condenser.
g, 70 g of sodium p-styrenesulfonate, and 30 g of N-methylolacrylamide, and ethanol 2
00g and 100g of distilled water were added and dissolved at 70°C. When polymerization was initiated by adding 1,0 g of AIBN at 75° C. under a nitrogen atmosphere, a stable white emulsion was produced.
重合開始後3時間を経た後、減圧蒸留によりエタノール
を留去し、均質な低粘度のポリマー水溶液を得た。Three hours after the start of polymerization, ethanol was distilled off under reduced pressure to obtain a homogeneous low-viscosity polymer aqueous solution.
合成例2
合成例1と同様に、゛ポリビニルピロリドン7g、p−
スチレンスルホン酸ナトリウム70g5Nメチロールア
クリルアミド30gおよび2−アクリルアミド−2−メ
チルプロパンスルホン酸5gをエタノール150gおよ
び蒸留水150gを含む混合溶媒に70℃で溶解し、窒
素雰囲気下75℃でABIN’1.Ogを添加すること
で重合を開始した。重合開始後、直ちに白色のポリマー
微粒しか析出し系は乳白色のエマルジョンとなった。Synthesis Example 2 Similarly to Synthesis Example 1, 7 g of polyvinylpyrrolidone, p-
70 g of sodium styrene sulfonate, 30 g of 5N methylolacrylamide and 5 g of 2-acrylamido-2-methylpropanesulfonic acid were dissolved in a mixed solvent containing 150 g of ethanol and 150 g of distilled water at 70°C, and ABIN'1. Polymerization was initiated by adding Og. Immediately after the start of polymerization, only fine white polymer particles were precipitated and the system became a milky white emulsion.
重合開始後約1時間後にエタノール50gを添加し、さ
らに約2時間加熱撹拌を行なった。About 1 hour after the start of polymerization, 50 g of ethanol was added, and the mixture was further heated and stirred for about 2 hours.
その後、エタノールを減圧上留去し、均一な水溶液を得
た。Thereafter, ethanol was distilled off under reduced pressure to obtain a homogeneous aqueous solution.
合成例3 合成例1と同様にポリビニルピロリドン7g。Synthesis example 3 7 g of polyvinylpyrrolidone as in Synthesis Example 1.
p−スチレンスルホン酸ナトリウム70g、N−メチロ
ールアクリルアミド25gおよびメタアクリル酸5gを
エタノール200 g sおよび蒸留水100gに溶解
し、75℃でAIBNl、Ogを添加することで重合を
開始した。70 g of sodium p-styrene sulfonate, 25 g of N-methylolacrylamide, and 5 g of methacrylic acid were dissolved in 200 g s of ethanol and 100 g of distilled water, and polymerization was initiated by adding AIBNl and Og at 75°C.
生成物は粒子径1ミクロン以下の安定なエマルジョンで
あった。The product was a stable emulsion with a particle size of less than 1 micron.
合成例4
合成例1と同様にポリビニルアルコール(クラレ製PV
A203、ポリ酢酸ビニル部分ケン化物)Log、p−
スチレンスルホン酸ナトリウム70g5N−メチロール
アクリルアミド30gおよび2−アクリルアミド−2−
メチルプロパンスルホン酸5gをエタノール150gお
よび蒸留水150gの混合溶媒に溶解した。Synthesis Example 4 Same as Synthesis Example 1, polyvinyl alcohol (Kuraray PV
A203, partially saponified polyvinyl acetate) Log, p-
Sodium styrene sulfonate 70g 5N-methylolacrylamide 30g and 2-acrylamide-2-
5 g of methylpropanesulfonic acid was dissolved in a mixed solvent of 150 g of ethanol and 150 g of distilled water.
窒素雰囲気下75℃でAIBNl、Ogを添加すること
で重合を開始し1、生成したエマルジョンを安定化する
ため、さらにエタノール50gを3時間にわたって滴下
した。Polymerization was started by adding AIBNl and Og at 75° C. under a nitrogen atmosphere. In order to stabilize the resulting emulsion, 50 g of ethanol was further added dropwise over 3 hours.
その後、エタノールを減圧により留去し、均一な水溶液
を得た。Thereafter, ethanol was distilled off under reduced pressure to obtain a homogeneous aqueous solution.
本発明のN−メチロール(メタ)アクリルアミドとスチ
レンスルホン酸の共重合体の塗布時の乾燥温度は40℃
以上であり、好ましくは50℃以上である。乾燥温度が
低いと写真処理に耐えられる皮膜を形成出来ないだけで
なく、特に処理後の抵抗値が高くなり好ましくない。充
分な乾燥をさせずにミルロール状に巻き取り高温(40
℃以上)で何週間も加温する方法も考えられるが、この
場合にはブロッキングを起こし易いし、何週間もミルロ
ール加温の時間を必要とし経済的ではない。The drying temperature during coating of the copolymer of N-methylol (meth)acrylamide and styrene sulfonic acid of the present invention is 40°C.
or higher, preferably 50°C or higher. If the drying temperature is low, not only will it be impossible to form a film that can withstand photographic processing, but the resistance value will become particularly high after processing, which is undesirable. Roll it up into a mill roll without drying it thoroughly and heat it at a high temperature (40℃).
℃ or higher) for several weeks, but this method tends to cause blocking and requires several weeks of mill roll heating, which is not economical.
本発明のN−メチロール(メタ)アクリルアミドとスチ
レンスルホン酸の共重合体の塗布時において、乾燥終了
後ミルロール状態に巻き取るのであるが、この時の相対
湿度は非常に重要である。When the copolymer of N-methylol (meth)acrylamide and styrene sulfonic acid of the present invention is applied, it is wound up into a mill roll after drying, and the relative humidity at this time is very important.
相対湿度は40〜60%が好ましいが、特に45〜55
%が好ましい。40%以下では皮膜の密度が高すぎるた
めと思われるが抵抗値が高く、かつ裏塗り層との接着が
悪く好ましくない。相対湿度が60%以上の場合には、
ブロッキングが生じ易く、かつ裏塗り層との接着が悪く
なる。Relative humidity is preferably 40-60%, especially 45-55%.
% is preferred. If it is less than 40%, the resistance value is high and the adhesion with the backing layer is poor, probably because the density of the film is too high, which is not preferable. If the relative humidity is over 60%,
Blocking tends to occur and adhesion with the backing layer deteriorates.
本発明の導電性ポリマーの塗布量は1耐当り固形分とし
て0.1g〜5.0gが良い。好ましくは0.5g〜2
.0gである。塗布量が0.1g以下の場合には帯電防
止性が劣り実用的でない。The coating amount of the conductive polymer of the present invention is preferably 0.1 g to 5.0 g as solid content per coat. Preferably 0.5g to 2
.. It is 0g. If the coating amount is less than 0.1 g, the antistatic properties will be poor and it will not be practical.
塗布量が5.0g以上だと裏塗り層との接着が悪くなり
好ましくない。If the coating amount is 5.0 g or more, the adhesion with the backing layer will deteriorate, which is not preferable.
本発明に用いられる導電性ポリマー層はゼラチンを含む
裏塗り層とフィルムベースの間に位置するものであり、
その他の位置では好ましくない。The conductive polymer layer used in the present invention is located between the gelatin-containing backing layer and the film base,
Other positions are not preferred.
例えば、裏塗り層を介してベースと反対側に帯電防止層
を設けた場合は、−船釣に裏塗り層にフィルター染料が
入っているので色素抜けが悪(なり好ましくない。更に
乳剤層とフィルムベースの間に帯電防止層を設けた場合
、一般に乳剤層はストリッピングフィルムの貼り込み等
で乳剤面は裏側よりも強い接着が必要とされ不利である
。For example, if an antistatic layer is provided on the opposite side of the base via a backing layer, - since the backing layer contains a filter dye, dye loss will be a problem (which is undesirable). When an antistatic layer is provided between the film bases, it is generally disadvantageous that the emulsion layer requires stronger adhesion than the back side when a stripping film is attached or the like.
さらに乳剤層と保護層の間、又はフィルムベースより保
護層の外側に帯電防止ポリマー層を設けることは現像進
行性、定着速度から見て不利である。Furthermore, providing an antistatic polymer layer between the emulsion layer and the protective layer or outside the protective layer from the film base is disadvantageous in terms of development progress and fixing speed.
従って、帯電防止ポリマー層はフィルムベースとゼラチ
ンを含む裏塗り層の間に位置させるのが最も合理的であ
る。Therefore, it is most logical to place the antistatic polymer layer between the film base and the gelatin-containing backing layer.
裏塗り層にゼラチンを含まず、水溶性か非水溶性ポリマ
ー層単独又は導電性ポリマー層単独という構成も考えら
れるが、この場合は乳剤層及び保護層は主にゼラチン構
成されているのでカールが強くなり実用的でない。It is also conceivable that the backing layer does not contain gelatin and consists of only a water-soluble or water-insoluble polymer layer or only a conductive polymer layer, but in this case, the emulsion layer and protective layer are mainly composed of gelatin, so curling may occur. Strong and impractical.
裏塗り層のゼラチン量は、lrT!当り0. 5〜8g
1好ましくは1〜5gである。裏塗り層には更に前記し
た導電性ポリマー、その他の導電性ポリマー、水溶性ポ
リマー、硬膜剤、マット剤、ハレーション防止用染料、
界面活性剤などを必要に応じて含むことができる。The amount of gelatin in the backing layer is lrT! Hit 0. 5-8g
1, preferably 1 to 5 g. The backing layer further contains the conductive polymers described above, other conductive polymers, water-soluble polymers, hardeners, matting agents, antihalation dyes,
A surfactant or the like may be included if necessary.
本発明に用いられるフィルムベースはポリエチレンテレ
フタレートフィルムが主であるが、その他のポリエステ
ルベースも含まれる。The film base used in the present invention is mainly a polyethylene terephthalate film, but other polyester bases are also included.
本発明のポリマーを塗布する時には、界面活性剤を用い
た方が塗布性が良くなる。基本的には表面張力を低下さ
せるものならば何でも良いが、下記一般式〔I〕、(I
I)の界面活性剤が特に優れている。When coating the polymer of the present invention, coating properties are improved by using a surfactant. Basically, anything that lowers the surface tension may be used, but the following general formula [I], (I
The surfactant I) is particularly excellent.
一般式CI)
R−0−(−CH2CH20+−T−8O3M一般式
]
式中nは1〜20の自然数
R1はC6〜CI5の置換されてもよいアルキル基又は
アリール基、
R2はC3〜C5の置換されてもよいアルキル基。General formula CI) R-0-(-CH2CH20+-T-8O3M general formula) In the formula, n is a natural number from 1 to 20 R1 is a C6 to CI5 optionally substituted alkyl group or aryl group, R2 is a C3 to C5 Alkyl group that may be substituted.
以下に例示化合物を示すがもちろんこれらに限定される
ものではない。Exemplary compounds are shown below, but of course the invention is not limited to these.
−a
HIs e t
−0−eCf(2
CH2
O+−r−803
a
−b
27CI3
0(CH2
CH2
0)TS03
a
−S(J3 Na
■
f
例示化合物
I−c
10CH3
P\
1−d
C++
H,、−0沃CH2
H2
0÷コ]−
−e
CI5H31−0+CH2
H2
0+−TV−
I−f
C5
18CI
−o−+CH2
H2
0升1−
(E)
実施例
実施例1
蒸留水500 mlに30重量%のN
メチロール
アクリルアミ
ドを持つポリスチレンスルホン酸ナ
トリウムの10%溶液を500 ml加え、例示化合物
I −aの界面活性剤の10%溶液をi□n+1加えた
。-a HIs e t -0-eCf(2 CH2 O+-r-803 a -b 27CI3 0(CH2 CH2 0)TS03 a -S(J3 Na ■ f Exemplary compound I-c 10CH3 P\ 1-d C++ H, , -0 io CH2 H2 0÷ko] - -e CI5H31-0+CH2 H2 0+-TV- If C5 18CI -o-+CH2 H2 0 sho 1- (E) Examples Example 1 30 weight in 500 ml of distilled water 500 ml of a 10% solution of sodium polystyrene sulfonate with % N methylol acrylamide was added and i□n+1 of a 10% solution of surfactant of exemplified compound I-a was added.
コーターの乾燥ゾーンの最高温度を20〜70℃まで1
0℃きざみに変えて100μの下引済みポリエチレンテ
レフタレートフィルム上に塗布した。塗布量は20m1
/mで塗布速度は20m/mnである。乾燥終了部から
ワイング一部までの部分の雰囲気を25℃相対湿度50
%とした。Maximum temperature of coater drying zone from 20 to 70℃1
It was coated on a 100μ underlined polyethylene terephthalate film at 0°C increments. Coating amount is 20ml
/m and the coating speed was 20 m/mn. The atmosphere from the end of drying to the part of the wine ring is 25℃ and relative humidity is 50℃.
%.
ワイングーで巻き取った状態で防湿袋に入れ室温で3日
放置した。It was rolled up with wine goo and placed in a moisture-proof bag and left at room temperature for 3 days.
次に、その導電性ポリマー層の上に裏塗りとしてゼラチ
ン溶液を塗布した。ゼラチン溶液は不活性ゼラチン50
gを蒸留水950 mlに溶かしたもので界面活性剤と
して例示化合物I−aの10%溶液を20m1加えた。A gelatin solution was then applied as a backcoat over the conductive polymer layer. Gelatin solution is inert gelatin 50
g was dissolved in 950 ml of distilled water, and 20 ml of a 10% solution of Exemplified Compound Ia as a surfactant was added thereto.
硬膜剤として10%2,4ジクロロ−6−ヒドロキシ−
34リアジンを25m1加え、塗布量が50m1/−な
る様に塗布した。この時の乾燥温度は45℃である。10% 2,4 dichloro-6-hydroxy- as hardener
25 ml of No. 34 riazine was added, and the coating amount was 50 ml/-. The drying temperature at this time is 45°C.
これらの試料を50℃で1日加温し、加温後の試料を小
西六社製GR−14自動現像機を用いて処理した。現像
は三菱製紙株式会社製MRACD−101,35℃20
秒、定着は同CF−901,35℃20秒である。These samples were heated at 50° C. for one day, and the heated samples were processed using a GR-14 automatic processor manufactured by Konishirokusha. Developed using MRACD-101 manufactured by Mitsubishi Paper Mills Co., Ltd. at 35℃20
The fixing time was CF-901 at 35°C for 20 seconds.
帯電防止能力は処理前、処理後の試料を25℃50%R
H(相対湿度)の雰囲気下に2時間放置しその表面抵抗
を三菱油化株式会社製ヒレスタ表面抵抗計モデルHT−
210で測定した。表面抵抗の目安としては1012Ω
以上が不可であり1011Ω以下が良好なレベルである
。Antistatic ability is measured at 25℃50%R for samples before and after treatment.
The surface resistance was measured after being left in an atmosphere of H (relative humidity) for 2 hours using a Hiresta surface resistance meter model HT- manufactured by Mitsubishi Yuka Co., Ltd.
Measured at 210. A rough guide for surface resistance is 1012Ω.
A value of 10 11 Ω or less is considered a good level.
接着は試料表面に5mm間隔で正方形状にナイフで傷を
つけ、30℃の水中に30秒間浸した後に、ティッシュ
−でその表面をこすり、○△×の三段階で評価した。○
印は全くはがれないもの、△はややはがれるもの、×印
はかなりはがれるものである。Adhesion was evaluated by making square scratches on the surface of the sample with a knife at 5 mm intervals, immersing the sample in water at 30° C. for 30 seconds, and then rubbing the surface with a tissue. ○
The mark indicates that the film will not come off at all, the mark △ means that it will come off slightly, and the mark X means that it will come off considerably.
これらの結果を表1に示す。These results are shown in Table 1.
(以下余白)
表
表1かられかる様に乾燥温度が30℃以下では接着と処
理後の抵抗値が不充分である。(The following is a blank space) As shown in Table 1, when the drying temperature is 30° C. or lower, the adhesion and the resistance value after treatment are insufficient.
20〜30℃でも長時間乾燥させれば良いと思われるが
、塗布速度を10m/minにしてもこのデータはほと
んど変らずポリマーの保水性が関与していると思われる
。It seems that drying for a long time at 20 to 30°C would be sufficient, but even if the coating speed was set to 10 m/min, this data hardly changed, and it seems that the water retention of the polymer is involved.
実施例2
次にコーターの乾燥ゾーンの最高温度を50℃にし、乾
燥終了部からワイング一部までの雰囲気を25℃とし、
相対湿度を30〜70%まで10%きざみで変化させた
。その他の条件は実施例1と全く同一である。Example 2 Next, the maximum temperature of the drying zone of the coater was set to 50°C, and the atmosphere from the drying end part to the wine section was set to 25°C.
The relative humidity was varied from 30 to 70% in 10% steps. Other conditions are exactly the same as in Example 1.
これらの結果を表2に示す。These results are shown in Table 2.
(以下余白)
表
表2かられかる様に相対湿度30%のものは接着も悪く
抵抗値も高い。70%のものはブロッキングを一部に起
こしているし接着も悪い。よってN−メチロール(メタ
)アクリルアミドとスチレンスルホン酸のポリマーを帯
電防止層として用いる場合には乾燥温度を40℃以上に
し、かつ巻き取りの湿度を40〜60%にすることが重
要であることがわかる。(Left space below) As shown in Table 2, those with a relative humidity of 30% have poor adhesion and high resistance. 70% of them have some blocking and poor adhesion. Therefore, when using a polymer of N-methylol (meth)acrylamide and styrene sulfonic acid as an antistatic layer, it is important to keep the drying temperature at 40°C or higher and the winding humidity at 40 to 60%. Recognize.
Claims (1)
ベースの間に持つハロゲン化銀フィルム感光材料の製造
方法において、該導電性ポリマーがN−メチロール(メ
タ)アクリルアミドとスチレンスルホン酸の共重合体か
らなり、N−メチロール(メタ)アクリルアミドの共重
合比率が10重量%以上60重量%以下であり、かつ該
ポリマー層の塗布時の乾燥湿度が40℃以上で、かつ乾
燥終了後相対湿度40〜60%の雰囲気下で巻き取り、
更に該導電性ポリマー層の上にゼラチンを含む裏塗りを
施すことを特徴とするハロゲン化銀フィルム感光材料の
製造方法。A method for producing a silver halide film photosensitive material having a conductive polymer layer between a gelatin-containing backing layer and a film base, wherein the conductive polymer is made of a copolymer of N-methylol (meth)acrylamide and styrene sulfonic acid. The copolymerization ratio of N-methylol (meth)acrylamide is 10% by weight or more and 60% by weight or less, and the drying humidity at the time of coating the polymer layer is 40°C or more, and the relative humidity after drying is 40 to 60%. Winding in an atmosphere of %,
A method for producing a silver halide film photosensitive material, further comprising applying a back coating containing gelatin on the conductive polymer layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24565690A JPH04124648A (en) | 1990-09-14 | 1990-09-14 | Production of anti-static silver halide film photosensitive material |
| US07/758,602 US5202223A (en) | 1990-09-14 | 1991-09-12 | Silver halide light-sensitive film material subjected to antistatic treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24565690A JPH04124648A (en) | 1990-09-14 | 1990-09-14 | Production of anti-static silver halide film photosensitive material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04124648A true JPH04124648A (en) | 1992-04-24 |
Family
ID=17136872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24565690A Pending JPH04124648A (en) | 1990-09-14 | 1990-09-14 | Production of anti-static silver halide film photosensitive material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04124648A (en) |
-
1990
- 1990-09-14 JP JP24565690A patent/JPH04124648A/en active Pending
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