JPH041248A - Conductive crosslinkable material - Google Patents
Conductive crosslinkable materialInfo
- Publication number
- JPH041248A JPH041248A JP10138890A JP10138890A JPH041248A JP H041248 A JPH041248 A JP H041248A JP 10138890 A JP10138890 A JP 10138890A JP 10138890 A JP10138890 A JP 10138890A JP H041248 A JPH041248 A JP H041248A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- polymer
- water
- conductive
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 40
- 229920000620 organic polymer Polymers 0.000 claims abstract description 12
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 6
- 125000005843 halogen group Chemical group 0.000 claims abstract description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 17
- 239000002904 solvent Substances 0.000 abstract description 9
- 239000003999 initiator Substances 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 5
- 239000000654 additive Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 39
- 239000000243 solution Substances 0.000 description 31
- 238000000576 coating method Methods 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 15
- 239000011521 glass Substances 0.000 description 12
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- -1 benzoin alkyl ethers Chemical class 0.000 description 9
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 8
- 229910052753 mercury Inorganic materials 0.000 description 8
- 239000012046 mixed solvent Substances 0.000 description 8
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- WHQSYGRFZMUQGQ-UHFFFAOYSA-N n,n-dimethylformamide;hydrate Chemical compound O.CN(C)C=O WHQSYGRFZMUQGQ-UHFFFAOYSA-N 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- ZRZHXNCATOYMJH-UHFFFAOYSA-N 1-(chloromethyl)-4-ethenylbenzene Chemical compound ClCC1=CC=C(C=C)C=C1 ZRZHXNCATOYMJH-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000011837 N,N-methylenebisacrylamide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- AMIULHAFCHLPIK-UHFFFAOYSA-N 3-(9-oxothioxanthen-2-yl)oxypropane-1-sulfonic acid Chemical compound C1=CC=C2C(=O)C3=CC(OCCCS(=O)(=O)O)=CC=C3SC2=C1 AMIULHAFCHLPIK-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- ZWYHFZWHUSLIDH-UHFFFAOYSA-N 5,5-diazido-2-(2-phenylethenyl)cyclohex-3-ene-1,1-disulfonic acid Chemical compound OS(=O)(=O)C1(S(O)(=O)=O)CC(N=[N+]=[N-])(N=[N+]=[N-])C=CC1C=CC1=CC=CC=C1 ZWYHFZWHUSLIDH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- UZNOMHUYXSAUPB-UNZYHPAISA-N (2e,6e)-2,6-bis[(4-azidophenyl)methylidene]cyclohexan-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1\C=C(/CCC\1)C(=O)C/1=C/C1=CC=C(N=[N+]=[N-])C=C1 UZNOMHUYXSAUPB-UNZYHPAISA-N 0.000 description 1
- UROHSXQUJQQUOO-UHFFFAOYSA-M (4-benzoylphenyl)methyl-trimethylazanium;chloride Chemical compound [Cl-].C1=CC(C[N+](C)(C)C)=CC=C1C(=O)C1=CC=CC=C1 UROHSXQUJQQUOO-UHFFFAOYSA-M 0.000 description 1
- SUDVPELGFZKOMD-UHFFFAOYSA-N 1,2-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(C(C)C)C(C(C)C)=CC=C3SC2=C1 SUDVPELGFZKOMD-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- JHGGYGMFCRSWIZ-UHFFFAOYSA-N 2,2-dichloro-1-(4-phenoxyphenyl)ethanone Chemical compound C1=CC(C(=O)C(Cl)Cl)=CC=C1OC1=CC=CC=C1 JHGGYGMFCRSWIZ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- FUKQNKXKSZJLBK-UHFFFAOYSA-N 2-[2-(9-oxothioxanthen-2-yl)oxyethoxy]ethanesulfonic acid Chemical compound C1=CC=C2C(=O)C3=CC(OCCOCCS(=O)(=O)O)=CC=C3SC2=C1 FUKQNKXKSZJLBK-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- SPLNZNSRUBGCTL-UHFFFAOYSA-N 3-(3,4-dimethyl-9-oxothioxanthen-2-yl)oxypropane-1-sulfonic acid Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C(C)=C(C)C(OCCCS(O)(=O)=O)=C2 SPLNZNSRUBGCTL-UHFFFAOYSA-N 0.000 description 1
- RUROFEVDCUGKHD-UHFFFAOYSA-N 3-bromoprop-1-enylbenzene Chemical compound BrCC=CC1=CC=CC=C1 RUROFEVDCUGKHD-UHFFFAOYSA-N 0.000 description 1
- INZLZTHXPOJSCN-UHFFFAOYSA-N 3-fluoroprop-1-enylbenzene Chemical compound FCC=CC1=CC=CC=C1 INZLZTHXPOJSCN-UHFFFAOYSA-N 0.000 description 1
- MGGVALXERJRIRO-UHFFFAOYSA-N 4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-2-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-1H-pyrazol-5-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2)O MGGVALXERJRIRO-UHFFFAOYSA-N 0.000 description 1
- WIYVVIUBKNTNKG-UHFFFAOYSA-N 6,7-dimethoxy-3,4-dihydronaphthalene-2-carboxylic acid Chemical compound C1CC(C(O)=O)=CC2=C1C=C(OC)C(OC)=C2 WIYVVIUBKNTNKG-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- DQFBYFPFKXHELB-UHFFFAOYSA-N Chalcone Natural products C=1C=CC=CC=1C(=O)C=CC1=CC=CC=C1 DQFBYFPFKXHELB-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 235000005513 chalcones Nutrition 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011243 crosslinked material Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- 238000005956 quaternization reaction Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical compound C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は導電性架橋性樹脂組成物、特に光および/また
は熱によって容易に架橋硬化して耐水性および/または
耐有機溶剤性を得ることができうる導電性材料に関する
。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a conductive crosslinkable resin composition, particularly a conductive crosslinkable resin composition that can be easily crosslinked and cured by light and/or heat to obtain water resistance and/or organic solvent resistance. It relates to conductive materials that can be made.
[従来の技術]
従来、紙、各種記録用紙、有機樹脂フィルム、有機樹脂
成形体、無機成形体などの基材の帯電を防止する目的で
、イオン性または非イオン性高分子または低分子化合物
からなる帯電防止剤が使用されている。[Prior Art] Conventionally, in order to prevent the charging of base materials such as paper, various recording papers, organic resin films, organic resin molded bodies, inorganic molded bodies, etc., the use of ionic or nonionic polymers or low molecular compounds has been used. An antistatic agent is used.
[発明が解決しようとする課題]
これら帯電防止剤は通常、水可溶であるため吸湿による
ベタ付きや、塗布ないしは混合成形後に水に触れると容
易に除去され、目的とした帯電防止効果が得られないな
どの問題が発生している。[Problems to be Solved by the Invention] Since these antistatic agents are usually water-soluble, they do not become sticky due to moisture absorption, and are easily removed when they come into contact with water after being applied or mixed and molded, so that the desired antistatic effect cannot be achieved. There are problems such as not being able to
[課題を解決するための手段]
本発明者らは、塗布後に光および/または熱により容易
に架橋硬化し、耐水性および/または耐有機溶剤性を得
ることができうる導電性材料を得ることを目的に鋭意検
討した結果本発明に到達した。すなわち本発明は一般式
(1)
R4
(式中、R7は水素原子またはメチル基を示し、R2、
R3およびR4は水素原子または炭素数1〜4のアルキ
ル基を示し、m、nは1以上の整数を示し、Xはハロゲ
ン原子を示す。)で示される有機高分子を含有してなる
ことを特徴とする導電性架橋性材料である。[Means for Solving the Problems] The present inventors aim to obtain a conductive material that can be easily crosslinked and cured by light and/or heat after application, and can have water resistance and/or organic solvent resistance. As a result of intensive studies aimed at this purpose, the present invention was arrived at. That is, the present invention provides general formula (1) R4 (wherein R7 represents a hydrogen atom or a methyl group, R2,
R3 and R4 represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m and n represent an integer of 1 or more, and X represents a halogen atom. ) is a conductive crosslinkable material characterized by containing an organic polymer represented by:
一般式(1)で示される有機高分子において、R2、R
3、R4の炭素数1〜4のアルキル基としてはメチル基
、エチル基、n−プロピル基、イソプロピル基、n−ブ
チル基などの直鎖および分岐アルキル基が挙げられる。In the organic polymer represented by general formula (1), R2, R
3. Examples of the alkyl group having 1 to 4 carbon atoms for R4 include straight chain and branched alkyl groups such as methyl group, ethyl group, n-propyl group, isopropyl group, and n-butyl group.
R2−R4が全てメチル基の場合耐熱性に優れ、またR
2−R4が同一でない場合には溶剤および他の成分との
相溶性に優れる。When R2-R4 are all methyl groups, the heat resistance is excellent, and R
When 2-R4 are not the same, the compatibility with the solvent and other components is excellent.
Xのハロゲン原子としてはフッ素原子、塩素原子、臭素
原子、ヨウ素原子があげられる。原料入手の点から好ま
しくは塩素原子である。Examples of the halogen atom for X include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. From the viewpoint of raw material availability, chlorine atoms are preferred.
mとnの比は通常10:90〜95:5であり、好まし
くは20:80〜85:15である。mの比率が10未
満であれば、耐水性の低下が見られ、光および/または
熱架橋時の耐液性が不充分となる。The ratio of m and n is usually 10:90 to 95:5, preferably 20:80 to 85:15. If the ratio of m is less than 10, a decrease in water resistance is observed, and liquid resistance during photo and/or thermal crosslinking becomes insufficient.
重量平均分子量は通常500〜500000であり、好
ましくは3000〜150000である。重量平均分子
量が500未満であれば硬化物の耐液性が不充分となり
、500000を越えると、例えば本発明の材料を溶液
として用いる場合の粘度が高くなり、塗布性が低下する
。The weight average molecular weight is usually 500 to 500,000, preferably 3,000 to 150,000. If the weight average molecular weight is less than 500, the liquid resistance of the cured product will be insufficient, and if it exceeds 500,000, for example, when the material of the present invention is used as a solution, the viscosity will increase and the coating properties will decrease.
一般式(1)で示される有機高分子の具体例としては例
えば、表−1に示される基およびm:nの比を一’Rフ
ンクペlコ栄ち4すL−’ZCI’Zテしあ(1゜(本
頁以下余白)
表−1(1)
(R,が水素原子の場合)
塩素原子を示し以下同様の記載を用いる。As a specific example of the organic polymer represented by the general formula (1), for example, the groups shown in Table 1 and the m:n ratio are A (1° (margins below this page) Table 1 (1) (When R is a hydrogen atom) Indicates a chlorine atom, and the same description will be used below.
−舶載(1)で示される有機高分子は一般式(2)I
メチル基を示し、Etはエチル基を示し、CIは(式中
、R2、m% nおよびXは、−舶載(1)の場合と同
一。)で示される有機高分子を水、有機溶剤(ベンセン
、トルエン、1,2−ジクロロエタン、クロロベンゼン
、アセトンなど)およびこれらの溶剤の混合溶媒中、そ
れぞれ対応するアミンと通常0〜100℃で0.1〜3
0時間攪はん反応させ、4級化することにより得られる
。反応終点は1/ION塩酸水溶液を用いての滴定によ
り容易に確認される。このときの反応溶液濃度は通常1
0〜50重量%、好ましくは15〜45重量%である。The organic polymer represented by the general formula (2) I represents a methyl group, Et represents an ethyl group, and CI represents (where R2, m% n and X are The same as in case 1)) is mixed with the corresponding amine in water, an organic solvent (benzene, toluene, 1,2-dichloroethane, chlorobenzene, acetone, etc.), and a mixed solvent of these solvents. 0.1-3 at 0-100℃
It is obtained by reacting with stirring for 0 hours and quaternizing it. The end point of the reaction is easily confirmed by titration using a 1/ION aqueous hydrochloric acid solution. The concentration of the reaction solution at this time is usually 1
0 to 50% by weight, preferably 15 to 45% by weight.
一般式(2)の有機高分子は例えば、対応するモノマー
(クロロメチルスチレン、フルオロメチルスチレン、ブ
ロモメチルスチレンなど)の重合などにより得ることが
できる。重合にはアゾビスイソブチロニトリル、ベンゾ
イルパーオキサイド、ジクミルパーオキサイドなどによ
るラジカル重合法、ルイス酸(BF3−Et20.AI
C13など)やプロトン酸(H2SO4、HClO4、
p−)ルエンスルホン酸など)によるカチオン重合法、
ブチルリチウムなどによるアニオン重合法を用いること
ができる。The organic polymer of general formula (2) can be obtained, for example, by polymerization of corresponding monomers (chloromethylstyrene, fluoromethylstyrene, bromomethylstyrene, etc.). For polymerization, a radical polymerization method using azobisisobutyronitrile, benzoyl peroxide, dicumyl peroxide, etc., a Lewis acid (BF3-Et20.AI
C13, etc.) and protonic acids (H2SO4, HClO4,
cationic polymerization method using (p-) luenesulfonic acid, etc.),
An anionic polymerization method using butyllithium or the like can be used.
本発明の導電性架橋性材料には光重合性不飽和化合物(
A)および/または光重合開始剤(B)および/または
ビスアジド化合物(C)および/またはその他の添加剤
、充填剤を加えることができる。(A)成分である光重
合性不飽和化合物としては例えば、2−ヒドロキシエチ
ルメタクリレート、1,1,2.2−テトラアリルオキ
シエタン、アミド類(N、N−−メチレンビスアクリル
アミド、N。The conductive crosslinkable material of the present invention contains a photopolymerizable unsaturated compound (
A) and/or a photopolymerization initiator (B) and/or a bisazide compound (C) and/or other additives and fillers can be added. Examples of the photopolymerizable unsaturated compound as component (A) include 2-hydroxyethyl methacrylate, 1,1,2.2-tetraallyloxyethane, amides (N, N--methylenebisacrylamide, N.
N−−メチレンビスメタクリルアミド、N−メチロール
アクリルアミド、N−メチロールメタクリルアミド、ア
クリルアミド、メタクリルアミド、N、N −一トリメ
チレンビスアクリルアミド、N。N--methylenebismethacrylamide, N-methylolacrylamide, N-methylolmethacrylamide, acrylamide, methacrylamide, N,N-monotrimethylenebisacrylamide, N.
N−一へキサメチレンビスアクリルアミドなど)、多価
アルコール(トリエチレングリコール、テトラエチレン
グリコール、エチレングリコール、プロピレングリコー
ル、トリメチロールプロパン、ペンタエリスリトール、
ネオペンチルグリコール、ジペンタエリスリトールなど
)のアクリル酸エルテル類、多価アルコール(トリエチ
レングリコール、テトラエチレングリコール、エチレン
グリコール、プロピレングリコール、トリメチロールプ
ロパン、ペンタエリスリトール、ネオペンチルグリコー
ル、ジペンタエリスリトールなど)のメタクリル酸エス
テル類などが挙げられる。これらの光重合性不飽和化合
物は単独または2種以上混合して用いることができる。N-hexamethylene bisacrylamide, etc.), polyhydric alcohols (triethylene glycol, tetraethylene glycol, ethylene glycol, propylene glycol, trimethylolpropane, pentaerythritol,
esters of acrylates (neopentyl glycol, dipentaerythritol, etc.), polyhydric alcohols (triethylene glycol, tetraethylene glycol, ethylene glycol, propylene glycol, trimethylolpropane, pentaerythritol, neopentyl glycol, dipentaerythritol, etc.) Examples include methacrylic acid esters. These photopolymerizable unsaturated compounds can be used alone or in combination of two or more.
(B)成分である光開始剤としては紫外線、遠紫外線な
どの活性エネルギー線により不飽和化合物の重合を開始
するいかなる開始剤も使用でき例えば、ベンゾインアル
キルエーテル類(ベンゾイン、ベンゾインイソブチルエ
ーテル、ベンゾインイソプロピルエーテルなど)、ベン
ゾフェノン類(ベンゾフェノン、ミヒラーケトン、4−
ベンゾイルベンジルトリメチルアンモニウムクロライド
など)、アセトフェノン類(2゜2−ジメトキシ−2−
フェニルアセトフェノン、2゜2−ジェトキシアセトフ
ェノン、2,2−ジクロル−4′−フェノキシアセトフ
ェノン、p−t−ブチルトリクロロアセトフェノンなど
)、アントラキノン類(2−エチルアントラキノンなど
)、チオキサントン類[2−(カルボキシメトキシ)チ
オキサントン、2−(3−スルホプロポキシ)チオキサ
ントン、2−(2−スルホエトキシエトキシ)チオキサ
ントン、3,4−ジメチル−2−(3−スルホプロポキ
シ)チオキサントン、2−(3−ジメチルアミノ−2−
ヒドロキシプロポキシ) −3,4−ジメチル−9H−
チオキサンチン−9−オンメトクロライド、2−(カル
ボキシメトキシ)チオキサントンのナトリウム塩、2−
(3−スルホプロポキシ)チオキサントンのアンモニウ
ム塩、ジエチルチオキサントン、ジイソプロピルチオキ
サントン、2−クロロチオキサントンなど]などが挙げ
られる。また、増感剤としてトリエタノールアミン、メ
チルジェタノールアミン、エチルジェタノールアミン、
2−(ジメチルアミノ)エチルメタクリレートなどを共
存させることができる。(C)成分であるビスアジド化
合物としては、水可溶性ビスアジド化合物[4゜4−−
ジアジドスチルベン−2,2−−ジソジウムサルフェー
ト、4,4−−ジアジドスチルベン−2,2−−ジスル
ホン酸ジアンモニウム塩、4,4−−ジアジドスチルベ
ン−2,2−−ジスルホン酸ジ(テトラメチルアンモニ
ウム塩)、4,4−−ジアジドスチルベン−2,2−−
ジスルホン酸ジ(テトラエチルアンモニウム塩)、4゜
4−−ジアジドスチルベン−2,2−−ジスルホン酸ジ
(トリメチルアンモニウム塩)、4,4−−ジアジドス
チルベン−2,2−−ジスルホン酸ジ(ジメチルアンモ
ニウム塩)、など]、有機溶剤可溶性ビスアジド化合物
[2,6−ジ(p−アジドベンザル)シクロヘキサノン
、クロヘキサノン、4,4−−ジアジドカルコンなど]
などが挙げられる。これらの光重合性不飽和化合物(A
)および/または光重合開始剤(B)を含有する場合の
構成成分の配合比率は通常、一般式(1)の有機高分子
30〜99重量%、光重合性不飽和化合物0〜70重量
%、光重合開始剤0〜25重量%であり好ましくは一般
式(1)の有機高分子40〜99重量%、光重合性不飽
和化合物5〜60重量%、光重合開始剤0.1〜10重
量%である。またビスアジド化合物(C)を含有する場
合の構成成分の配合比率は通常、−舶載(1)の有機高
分子70〜99重量%、ビスアジド化合物1〜30重量
%であり好ましくは一般式(1)の有機高分子85〜9
9重量%、ビスアジド化合物1〜20重量%である。こ
の架橋性導電性材料を、水、有機溶剤(ジメチルホルム
アミド、ジメチルスルホキシド、N−メチルピロリドン
、γ−ブチロラクトン、ブチルアルコール、エチルアル
コール、イソプロピルアルコール、メチルアルコール、
エチルセロソルブアセテート、メチルエチルケトン、メ
チルイソブチルケトンなど)およびこれら溶剤の混合溶
剤などに溶解することにより、塗布可能な溶液となり目
的とする各種帯電防止に利用することができる。溶液の
濃度は通常5〜60重量%溶液であり、好ましくは10
〜50重量%溶液である。As the photoinitiator component (B), any initiator that initiates the polymerization of unsaturated compounds by active energy rays such as ultraviolet rays and deep ultraviolet rays can be used. For example, benzoin alkyl ethers (benzoin, benzoin isobutyl ether, benzoin isopropyl ether, etc.), benzophenones (benzophenone, Michler's ketone, 4-
benzoylbenzyltrimethylammonium chloride, etc.), acetophenones (2゜2-dimethoxy-2-
phenylacetophenone, 2゜2-jethoxyacetophenone, 2,2-dichloro-4'-phenoxyacetophenone, pt-butyltrichloroacetophenone, etc.), anthraquinones (such as 2-ethylanthraquinone), thioxanthone [2-(carboxylated) methoxy)thioxanthone, 2-(3-sulfopropoxy)thioxanthone, 2-(2-sulfoethoxyethoxy)thioxanthone, 3,4-dimethyl-2-(3-sulfopropoxy)thioxanthone, 2-(3-dimethylamino-2 −
hydroxypropoxy) -3,4-dimethyl-9H-
Thioxanthin-9-one methochloride, 2-(carboxymethoxy)thioxanthone sodium salt, 2-
(3-sulfopropoxy)thioxanthone ammonium salt, diethylthioxanthone, diisopropylthioxanthone, 2-chlorothioxanthone, etc.). In addition, triethanolamine, methyljetanolamine, ethyljetanolamine,
2-(dimethylamino)ethyl methacrylate and the like can be present together. As the bisazide compound which is component (C), water-soluble bisazide compound [4゜4--
Diazidostilbene-2,2-disodium sulfate, 4,4-diazidostilbene-2,2-disulfonic acid diammonium salt, 4,4-diazidostilbene-2,2-disulfonic acid diammonium salt (tetramethylammonium salt), 4,4--diazidostilbene-2,2--
Disulfonic acid di(tetraethylammonium salt), 4゜4-diazidostilbene-2,2-disulfonic acid di(trimethylammonium salt), 4,4-diazidostilbene-2,2-disulfonic acid di( dimethylammonium salt), etc.], organic solvent-soluble bisazide compounds [2,6-di(p-azidobenzal)cyclohexanone, clohexanone, 4,4-diazide chalcone, etc.]
Examples include. These photopolymerizable unsaturated compounds (A
) and/or a photopolymerization initiator (B), the blending ratio of the components is usually 30 to 99% by weight of the organic polymer of general formula (1) and 0 to 70% by weight of the photopolymerizable unsaturated compound. , 0 to 25% by weight of a photopolymerization initiator, preferably 40 to 99% by weight of an organic polymer of general formula (1), 5 to 60% by weight of a photopolymerizable unsaturated compound, and 0.1 to 10% by weight of a photopolymerization initiator. Weight%. In addition, when the bisazide compound (C) is contained, the blending ratio of the constituent components is usually 70 to 99% by weight of the organic polymer (1) and 1 to 30% by weight of the bisazide compound, preferably the general formula (1). ) organic polymers 85-9
9% by weight, and 1 to 20% by weight of the bisazide compound. This crosslinkable conductive material is mixed with water, organic solvents (dimethylformamide, dimethyl sulfoxide, N-methylpyrrolidone, γ-butyrolactone, butyl alcohol, ethyl alcohol, isopropyl alcohol, methyl alcohol,
By dissolving it in a solvent such as ethyl cellosolve acetate, methyl ethyl ketone, methyl isobutyl ketone, etc.) or a mixed solvent of these solvents, it becomes a coatable solution and can be used for various antistatic purposes. The concentration of the solution is usually 5 to 60% by weight, preferably 10% by weight.
~50% by weight solution.
本発明の導電性架橋性材料の使用方法は、その溶液を紙
、各種記録用紙、有機樹脂フィルム、有機樹脂成形体、
無機成形体などの基材上に、スピンコード塗布、スクリ
ーン印刷塗布、スプレー塗布、ロールコート塗布、ディ
ッピング塗布、バーコーター塗布などにより塗布膜厚1
mm以下となるように塗布し、続いて、紫外線、遠紫外
線などの照射より架橋が進行し、耐水性および/または
耐溶剤性が得られる。この時光源として、高圧水銀灯、
超高圧水銀灯、メタルハライドランプ、低圧水銀灯、遠
紫外線ランプ、エキシマレーザ−などを用いることがで
きる。また50〜150℃での加熱を行うことによって
も架橋が進行し、加熱には、循風炉、ホットプレート、
赤外線炉、遠赤外線炉などを用いることができる。The method of using the conductive crosslinkable material of the present invention is to apply the solution to paper, various recording papers, organic resin films, organic resin molded bodies, etc.
A coating film thickness of 1 is applied onto a base material such as an inorganic molded body by spin cord coating, screen printing coating, spray coating, roll coating coating, dipping coating, bar coater coating, etc.
It is coated to a thickness of 0.3 mm or less, and then crosslinked by irradiation with ultraviolet rays, deep ultraviolet rays, etc., resulting in water resistance and/or solvent resistance. At this time, as a light source, a high pressure mercury lamp,
An ultra-high pressure mercury lamp, a metal halide lamp, a low pressure mercury lamp, a far ultraviolet lamp, an excimer laser, etc. can be used. Crosslinking also proceeds by heating at 50 to 150°C, and heating can be done using a circulating oven, hot plate,
An infrared furnace, a far-infrared furnace, etc. can be used.
[実施例]
以下、本発明を実施例により更に説明するが、本発明は
これに限定されない。[Examples] Hereinafter, the present invention will be further explained with reference to Examples, but the present invention is not limited thereto.
実施例1
p−クロロメチルスチレン重合体(Mw=10000)
Logを1,2−ジクロロエタン30gに溶解し、ト
リメチルアミン30重量%水溶液5.16 g、水20
gを加え、室温で3時間攪はん反応した後、アセトン1
リツトルに加えた。析出したポリマーを減圧乾燥し本発
明の導電性架橋性材料であるクロロメチルスチレンの部
分4級化物10gを得た。Example 1 p-chloromethylstyrene polymer (Mw=10000)
Dissolve Log in 30 g of 1,2-dichloroethane, 5.16 g of a 30% by weight aqueous solution of trimethylamine, and 20 g of water.
After stirring and reacting at room temperature for 3 hours, acetone 1
Added to Little. The precipitated polymer was dried under reduced pressure to obtain 10 g of partially quaternized chloromethylstyrene, which is the conductive crosslinkable material of the present invention.
実施例2
p−クロロメチルスチレン重合体(Mw=50000)
10gを1,2−ジクロロエタン30gに溶解し、ト
リメチルアミン30重量%水溶液3.87g、水20g
を加え、室温で3時間攪はん反応した後、アセトン1リ
ツトルに加えた。析出したポリマーを減圧乾燥し本発明
の導電性架橋性材料であるクロロメチルスチレンの部分
4級化物9.5gを得た。Example 2 p-chloromethylstyrene polymer (Mw=50000)
Dissolve 10g in 30g of 1,2-dichloroethane, 3.87g of 30% by weight aqueous solution of trimethylamine, and 20g of water.
After stirring and reacting at room temperature for 3 hours, the mixture was added to 1 liter of acetone. The precipitated polymer was dried under reduced pressure to obtain 9.5 g of partially quaternized chloromethylstyrene, which is the conductive crosslinkable material of the present invention.
実施例3
p−クロロメチルスチレン重合体(Mw=50000)
10gを1,2−ジクロロエタン30gに溶解し、ト
リメチルアミン30重量%水溶液7.75g、水20g
を加え、室温で3時間攪はん反応した後、アセトン1リ
ツトルに加えた。析出したポリマーを減圧乾燥し本発明
の導電性架橋性材料であるクロロメチルスチレンの部分
4級化物10.5gを得た。Example 3 p-chloromethylstyrene polymer (Mw=50000)
Dissolve 10g in 30g of 1,2-dichloroethane, 7.75g of 30% by weight aqueous solution of trimethylamine, and 20g of water.
After stirring and reacting at room temperature for 3 hours, the mixture was added to 1 liter of acetone. The precipitated polymer was dried under reduced pressure to obtain 10.5 g of partially quaternized chloromethylstyrene, which is the conductive crosslinkable material of the present invention.
実施例4
p−クロロメチルスチレン重合体(Mw=50000)
10gを1,2−ジクロロエタン30gに溶解し、ト
リメチルアミン30重量%水溶液10.33g、水20
gを加え、室温で3時間攪はん反応した後、アセトン1
リツトルに加えた。析出したポリマーを減圧乾燥し本発
明の導電性架橋性材料であるクロロメチルスチレンの部
分4級化物11.5gを得た。Example 4 p-chloromethylstyrene polymer (Mw=50000)
Dissolve 10g in 30g of 1,2-dichloroethane, 10.33g of a 30% by weight aqueous solution of trimethylamine, and 20g of water.
After stirring and reacting at room temperature for 3 hours, acetone 1
Added to Little. The precipitated polymer was dried under reduced pressure to obtain 11.5 g of partially quaternized chloromethylstyrene, which is the conductive crosslinkable material of the present invention.
使用例1
実施例1で得たポリマー5gをDMF−水の混合溶剤2
0gに溶解し、本発明の材料の溶液である導電性架橋性
材料溶液を作成した。この溶液をガラス基板上にスピン
コード塗布し、1.5μmの均一な塗布膜を得た。この
塗布膜に高圧水銀灯により500m j / c m2
の紫外線照射を行った。メタノールに60秒間浸漬後の
表面抵抗値を表−2に示す。Usage Example 1 5 g of the polymer obtained in Example 1 was mixed with DMF-water mixed solvent 2
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared by dissolving 0g of the material. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. This coating film was heated to 500mj/cm2 using a high-pressure mercury lamp.
UV irradiation was performed. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例2
使用例1で作成した溶液をガラス基板上にスビンコート
塗布し、1.5μmの均一な塗布膜を得た。Usage Example 2 The solution prepared in Usage Example 1 was coated on a glass substrate to obtain a uniform coating film of 1.5 μm.
この基板を循風炉を用いて窒素下150℃で2時間のベ
ークを行った。メタノールに60秒間浸漬後の表面抵抗
値を表−2に示す。This substrate was baked at 150° C. for 2 hours under nitrogen using a circulating oven. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例3
実施例2で得たポリマー5gをDMF−水の混合溶剤2
0gに溶解し、本発明の材料の溶液である導電性架橋性
材料溶液を作成した。この溶液をガラス基板上にスピン
コード塗布し、1.5μmの均一な塗布膜を得た。この
塗布膜にメタルハライドランプにより500m j /
c m2の紫外線照射を行った。Use example 3 5 g of the polymer obtained in Example 2 was mixed with DMF-water mixed solvent 2
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared by dissolving 0g of the material. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. A metal halide lamp was applied to this coated film for 500 m j /
Ultraviolet irradiation was performed at cm2.
メタノールに60秒間浸漬後の表面抵抗値を表−2に示
す。Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例4
使用例2で作成した溶液をガラス基板上にスピンコード
塗布し、1.5μmの均一な塗布膜を得た。Usage Example 4 The solution prepared in Usage Example 2 was spin coated onto a glass substrate to obtain a uniform coating film of 1.5 μm.
この基板を循風炉を用いて窒素下150℃で2時間のベ
ークを行った。メタノールに60秒間浸漬後の表面抵抗
値を表−2に示す。This substrate was baked at 150° C. for 2 hours under nitrogen using a circulating oven. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例5
実施例3で得たポリマー5gをDMF−水の混合溶剤2
0gに溶解し、本発明の材料の溶液である導電性架橋性
材料溶液を作成した。この溶液をガラス基板上にスピン
コード塗布し、1.5μmの均一な塗布膜を得た。この
塗布膜にメタルハライドランプにより500m j /
c m2の紫外線照射を行った。Use example 5 5 g of the polymer obtained in Example 3 was mixed with DMF-water mixed solvent 2
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared by dissolving 0g of the material. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. A metal halide lamp was applied to this coated film for 500 m j /
Ultraviolet irradiation was performed at cm2.
メタノールに60秒間浸漬後の表面抵抗値を表−2に示
す。Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例6
使用例5で作成した溶液をガラス基板上にスピンコード
塗布し、1.5μmの均一な塗布膜を得た。Usage Example 6 The solution prepared in Usage Example 5 was spin coated onto a glass substrate to obtain a uniform coating film of 1.5 μm.
この基板を循風炉を用いて窒素下150℃で2時間のベ
ークを行った。メタノールに60秒間浸漬後の表面抵抗
値を表−2に示す。This substrate was baked at 150° C. for 2 hours under nitrogen using a circulating oven. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例7
実施例4で得たポリマー5gをDMF−水の混合溶剤2
0gに溶解し、本発明の材料の溶液である導電性架橋性
材料溶液を作成した。この溶液をガラス基板上にスピン
コード塗布し、1.5μmの均一な塗布膜を得た。この
塗布膜に高圧水銀灯により500m j / c m2
の紫外線照射を行った。メタノールに60秒間浸漬後の
表面抵抗値を表−2に示す。Use example 7 5 g of the polymer obtained in Example 4 was mixed with DMF-water mixed solvent 2
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared by dissolving 0g of the material. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. This coating film was heated to 500mj/cm2 using a high-pressure mercury lamp.
UV irradiation was performed. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例8
使用例7で作成した溶液をガラス基板上にスピンコード
塗布し、1.5μmの均一な塗布膜を得た。Use Example 8 The solution prepared in Use Example 7 was spin coated onto a glass substrate to obtain a uniform coating film of 1.5 μm.
この基板を循風炉を用いて窒素下150℃で2時間のベ
ークを行った。メタノールに60秒間浸漬後の表面抵抗
値を表−2に示す。This substrate was baked at 150° C. for 2 hours under nitrogen using a circulating oven. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例9
実施例3で得たポリマー5g、N、N−−メチレンビス
アクリルアミド0.5g、ベンゾインイソプロピルエー
テル0.2gをDMF−水の混合溶剤20gに溶解し、
本発明の材料の溶液である導電性架橋性材料溶液を作成
した。この溶液をガラス基板上にスピンコード塗布し、
1゜5μmの均一な塗布膜を得た。この塗布膜に高圧水
銀灯により200m j /Cm2の紫外線照射を行っ
た。メタノールに60秒間浸漬後の表面抵抗値を表−2
に示す。Use Example 9 5 g of the polymer obtained in Example 3, 0.5 g of N,N-methylenebisacrylamide, and 0.2 g of benzoin isopropyl ether were dissolved in 20 g of a DMF-water mixed solvent,
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared. Apply this solution on a glass substrate with a spin cord,
A uniform coating film of 1.5 μm was obtained. This coated film was irradiated with ultraviolet rays at 200 m j /Cm 2 using a high-pressure mercury lamp. Table 2 shows the surface resistance values after immersion in methanol for 60 seconds.
Shown below.
使用例10
実施例4で得たポリマー5g、N、N−−メチレンビス
アクリルアミド0.5g、2−(3−スルホプロポキシ
)チオキサントン0.2gをDMF−水の混合溶剤20
gに溶解し、本発明の材料の溶液である導電性架橋性材
料溶液を作成した。この溶液をガラス基板上にスピンコ
ード塗布し、1.5μmの均一な塗布膜を得た。この塗
布膜に高圧水銀灯により200m j / c m2の
紫外線照射を行った。メタノールに60秒間浸漬後の表
面抵抗値を表−2に示す。Usage Example 10 5 g of the polymer obtained in Example 4, 0.5 g of N,N--methylenebisacrylamide, and 0.2 g of 2-(3-sulfopropoxy)thioxanthone were mixed in a DMF-water mixed solvent of 20 g.
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared by dissolving the material in g. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. This coated film was irradiated with ultraviolet light at 200 m j /cm 2 using a high-pressure mercury lamp. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
比較例1
スチレン−クロロメチルスチレン共重合体(クロロメチ
ルスチレン含有率50%、Mw = 10000)のト
リメチルアミン完全4級化物10gを水40gに溶解し
、この溶液をガラス基板上にスピンコード塗布し、1.
5μmの塗布膜を得た。この塗布膜に高圧水銀灯により
500m j / c m2の紫外線照射を行った。メ
タノールに60秒間浸漬後の表面抵抗値を表−2に示す
。Comparative Example 1 10 g of completely quaternized trimethylamine of styrene-chloromethylstyrene copolymer (chloromethylstyrene content 50%, Mw = 10000) was dissolved in 40 g of water, and this solution was spin-coated on a glass substrate, 1.
A coating film of 5 μm was obtained. This coated film was irradiated with ultraviolet rays of 500 m j /cm 2 using a high-pressure mercury lamp. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
比較例2
スチレン−クロロメチルスチレン共重合体(クロロメチ
ルスチレン含有率70%、Mw=30000)のトリメ
チルアミン完全4級化物10gを水40gに溶解し、こ
の溶液をガラス基板上にバーコーター塗布し、1.5μ
mの塗布膜を得た。この基板を循風炉を用いて窒素下1
50℃で2時間のベークを行った。Comparative Example 2 10 g of completely quaternized trimethylamine of styrene-chloromethylstyrene copolymer (chloromethylstyrene content 70%, Mw = 30000) was dissolved in 40 g of water, and this solution was coated on a glass substrate with a bar coater. 1.5μ
A coating film of m was obtained. This substrate was heated under nitrogen using a circulating oven.
Baking was performed at 50°C for 2 hours.
メタノールに60秒間浸漬後の表面抵抗値を表−2に示
す。Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
表−2
表−2中、3.4E7は3.4X107を示し、以下同
様の記載を用いる。Table 2 In Table 2, 3.4E7 indicates 3.4X107, and the same description will be used hereinafter.
溶剤への浸漬による表面抵抗値の測定により塗布膜の変
化を評価した。架橋が進行しない比較例との比較から、
溶剤浸漬後も良好な導電性が確認され、本発明の導電性
架橋性材料の耐水性および/または耐有機溶剤性の付与
効果が示される。また、使用例1〜10で作成したいず
れの硬化膜も、空気中放置1週間でのベタ付きは見られ
なかった。Changes in the coating film were evaluated by measuring the surface resistance value by immersion in a solvent. From a comparison with a comparative example in which crosslinking does not proceed,
Good conductivity was confirmed even after immersion in the solvent, demonstrating the effect of imparting water resistance and/or organic solvent resistance to the conductive crosslinkable material of the present invention. Moreover, no stickiness was observed in any of the cured films prepared in Usage Examples 1 to 10 after being left in the air for one week.
[発明の効果]
本発明は導電性架橋性材料を提供し、またこれらの導電
性架橋性材料は次のような顕著な特徴を有する。[Effects of the Invention] The present invention provides conductive crosslinkable materials, and these conductive crosslinkable materials have the following remarkable characteristics.
(1)光および/または熱により架橋硬化が可能な導電
性材料である。この導電性架橋性材料の使用により例え
ば塗布後の吸湿による′ベタ付きや、塗布後に水や有機
溶剤に触れることにより容易に除去され、目的とした帯
電防止効果が得られないなどの問題発生を抑制すること
ができる。(1) It is a conductive material that can be crosslinked and cured by light and/or heat. The use of this conductive cross-linked material can cause problems such as stickiness due to moisture absorption after application, and the fact that it is easily removed by contact with water or organic solvents after application, making it impossible to obtain the desired antistatic effect. Can be suppressed.
(2)イオン成分の含有比率および/または4級化に使
用するアミンのアルキル基を変化させることにより、架
橋前の溶剤溶解性を自由に変えることができ使用条件の
許容性が高い。(2) By changing the content ratio of ionic components and/or the alkyl group of the amine used for quaternization, the solvent solubility before crosslinking can be freely changed and the use conditions are highly acceptable.
(3)架橋硬化により耐水性および/または耐液性が付
与され、本材料への他の材料の積層が可能である。(3) Water resistance and/or liquid resistance is imparted by crosslinking and curing, and other materials can be laminated onto this material.
(4)光硬化が可能であるため、耐熱性の劣る材料への
塗布、利用が可能である。(4) Since it can be photocured, it can be applied and used on materials with poor heat resistance.
(5)光硬化が可能であるため、導電性の耐熱性が劣る
組成物も利用することができる。(5) Since photocuring is possible, compositions with poor conductivity and heat resistance can also be used.
(6)各種塗布法での塗布が可能であり、あらゆる形状
、材質の基材への利用が可能である。(6) It can be applied using various coating methods, and can be applied to base materials of all shapes and materials.
(7)露光、未露光部分の溶解性の差を利用してパター
ンを形成することができる。(7) A pattern can be formed by utilizing the difference in solubility between exposed and unexposed areas.
Claims (1)
2、R_3およびR_4は水素原子または炭素数1〜4
のアルキル基を示し、m、nは1以上の整数を示し、X
はハロゲン原子を示す。)で示される有機高分子を含有
してなることを特徴とする導電性架橋性材料。[Claims] 1. General formula (1) ▲ Numerical formulas, chemical formulas, tables, etc. ▼ (1) (In the formula, R_1 represents a hydrogen atom or a methyl group, and R_
2, R_3 and R_4 are hydrogen atoms or have 1 to 4 carbon atoms
represents an alkyl group, m and n represent integers of 1 or more, and
indicates a halogen atom. ) A conductive crosslinkable material characterized by containing an organic polymer represented by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10138890A JPH041248A (en) | 1990-04-17 | 1990-04-17 | Conductive crosslinkable material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10138890A JPH041248A (en) | 1990-04-17 | 1990-04-17 | Conductive crosslinkable material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH041248A true JPH041248A (en) | 1992-01-06 |
Family
ID=14299377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10138890A Pending JPH041248A (en) | 1990-04-17 | 1990-04-17 | Conductive crosslinkable material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041248A (en) |
-
1990
- 1990-04-17 JP JP10138890A patent/JPH041248A/en active Pending
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