JPH041213A - Conductive crosslinkable material - Google Patents
Conductive crosslinkable materialInfo
- Publication number
- JPH041213A JPH041213A JP10139090A JP10139090A JPH041213A JP H041213 A JPH041213 A JP H041213A JP 10139090 A JP10139090 A JP 10139090A JP 10139090 A JP10139090 A JP 10139090A JP H041213 A JPH041213 A JP H041213A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- weight
- conductive
- water
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 39
- 229920000620 organic polymer Polymers 0.000 claims abstract description 14
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 125000005843 halogen group Chemical group 0.000 claims abstract description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 18
- 150000001875 compounds Chemical class 0.000 abstract description 17
- 229920000642 polymer Polymers 0.000 abstract description 12
- 239000003960 organic solvent Substances 0.000 abstract description 9
- 239000003999 initiator Substances 0.000 abstract description 6
- 150000001412 amines Chemical class 0.000 abstract description 4
- 239000000654 additive Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 39
- 239000000243 solution Substances 0.000 description 30
- 238000000576 coating method Methods 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 23
- 239000011521 glass Substances 0.000 description 12
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 8
- 229910052753 mercury Inorganic materials 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 7
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 239000012046 mixed solvent Substances 0.000 description 6
- -1 benzoin alkyl ethers Chemical class 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- DQRXJTQZENKXNW-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.ClCC=CC1=CC=CC=C1 DQRXJTQZENKXNW-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 125000001309 chloro group Chemical group Cl* 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- WHQSYGRFZMUQGQ-UHFFFAOYSA-N n,n-dimethylformamide;hydrate Chemical compound O.CN(C)C=O WHQSYGRFZMUQGQ-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- AMIULHAFCHLPIK-UHFFFAOYSA-N 3-(9-oxothioxanthen-2-yl)oxypropane-1-sulfonic acid Chemical compound C1=CC=C2C(=O)C3=CC(OCCCS(=O)(=O)O)=CC=C3SC2=C1 AMIULHAFCHLPIK-UHFFFAOYSA-N 0.000 description 3
- ZWYHFZWHUSLIDH-UHFFFAOYSA-N 5,5-diazido-2-(2-phenylethenyl)cyclohex-3-ene-1,1-disulfonic acid Chemical compound OS(=O)(=O)C1(S(O)(=O)=O)CC(N=[N+]=[N-])(N=[N+]=[N-])C=CC1C=CC1=CC=CC=C1 ZWYHFZWHUSLIDH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 3
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- UZNOMHUYXSAUPB-UNZYHPAISA-N (2e,6e)-2,6-bis[(4-azidophenyl)methylidene]cyclohexan-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1\C=C(/CCC\1)C(=O)C/1=C/C1=CC=C(N=[N+]=[N-])C=C1 UZNOMHUYXSAUPB-UNZYHPAISA-N 0.000 description 1
- UROHSXQUJQQUOO-UHFFFAOYSA-M (4-benzoylphenyl)methyl-trimethylazanium;chloride Chemical compound [Cl-].C1=CC(C[N+](C)(C)C)=CC=C1C(=O)C1=CC=CC=C1 UROHSXQUJQQUOO-UHFFFAOYSA-M 0.000 description 1
- SUDVPELGFZKOMD-UHFFFAOYSA-N 1,2-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(C(C)C)C(C(C)C)=CC=C3SC2=C1 SUDVPELGFZKOMD-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- IMDHDEPPVWETOI-UHFFFAOYSA-N 1-(4-tert-butylphenyl)-2,2,2-trichloroethanone Chemical compound CC(C)(C)C1=CC=C(C(=O)C(Cl)(Cl)Cl)C=C1 IMDHDEPPVWETOI-UHFFFAOYSA-N 0.000 description 1
- JHGGYGMFCRSWIZ-UHFFFAOYSA-N 2,2-dichloro-1-(4-phenoxyphenyl)ethanone Chemical compound C1=CC(C(=O)C(Cl)Cl)=CC=C1OC1=CC=CC=C1 JHGGYGMFCRSWIZ-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- LJUKODJASZSKFL-UHFFFAOYSA-N 2-(9-oxothioxanthen-2-yl)oxyacetic acid Chemical compound C1=CC=C2C(=O)C3=CC(OCC(=O)O)=CC=C3SC2=C1 LJUKODJASZSKFL-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- TURITJIWSQEMDB-UHFFFAOYSA-N 2-methyl-n-[(2-methylprop-2-enoylamino)methyl]prop-2-enamide Chemical compound CC(=C)C(=O)NCNC(=O)C(C)=C TURITJIWSQEMDB-UHFFFAOYSA-N 0.000 description 1
- RUROFEVDCUGKHD-UHFFFAOYSA-N 3-bromoprop-1-enylbenzene Chemical compound BrCC=CC1=CC=CC=C1 RUROFEVDCUGKHD-UHFFFAOYSA-N 0.000 description 1
- INZLZTHXPOJSCN-UHFFFAOYSA-N 3-fluoroprop-1-enylbenzene Chemical compound FCC=CC1=CC=CC=C1 INZLZTHXPOJSCN-UHFFFAOYSA-N 0.000 description 1
- WIYVVIUBKNTNKG-UHFFFAOYSA-N 6,7-dimethoxy-3,4-dihydronaphthalene-2-carboxylic acid Chemical compound C1CC(C(O)=O)=CC2=C1C=C(OC)C(OC)=C2 WIYVVIUBKNTNKG-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- RFZIVRDWIDJDGF-UHFFFAOYSA-N N(=[N+]=[N-])C1(CC=C(C=C1)C=CC(=O)C1=CC=CC=C1)N=[N+]=[N-] Chemical compound N(=[N+]=[N-])C1(CC=C(C=C1)C=CC(=O)C1=CC=CC=C1)N=[N+]=[N-] RFZIVRDWIDJDGF-UHFFFAOYSA-N 0.000 description 1
- 239000011837 N,N-methylenebisacrylamide Substances 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000011243 crosslinked material Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- GJQRYIOSVPEUQJ-UHFFFAOYSA-N n-[3-(prop-2-enoylamino)propyl]prop-2-enamide Chemical compound C=CC(=O)NCCCNC(=O)C=C GJQRYIOSVPEUQJ-UHFFFAOYSA-N 0.000 description 1
- YQCFXPARMSSRRK-UHFFFAOYSA-N n-[6-(prop-2-enoylamino)hexyl]prop-2-enamide Chemical compound C=CC(=O)NCCCCCCNC(=O)C=C YQCFXPARMSSRRK-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- 238000005956 quaternization reaction Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野コ
本発明は導電性架橋性樹脂組成物、特に光および/また
は熱によって容易に架橋硬化して耐水性および/ままた
は耐有機溶剤性を得ることができうる導電性材料に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to conductive crosslinkable resin compositions, particularly those easily crosslinked and cured by light and/or heat to obtain water resistance and/or organic solvent resistance. The present invention relates to conductive materials that can be used.
[従来の技術]
従来、紙、各種記録用紙、有機樹脂フィルム、有機樹脂
成形体、無機成形体などの基材の帯電を防止する目的で
、イオン性または非イオン性高分子または低分子化合物
からなる帯電防止剤が使用されている。[Prior Art] Conventionally, in order to prevent the charging of base materials such as paper, various recording papers, organic resin films, organic resin molded bodies, inorganic molded bodies, etc., the use of ionic or nonionic polymers or low molecular compounds has been used. An antistatic agent is used.
[発明が解決しようとする課題]
これら帯電防止剤は通常、水可溶であるため吸湿による
ベタ付きや、塗布ないしは混合成形後に水に触れると容
易に除去され、目的とした帯電防止効果が得られないな
どの問題が発生している。[Problems to be Solved by the Invention] Since these antistatic agents are usually water-soluble, they do not become sticky due to moisture absorption, and are easily removed when they come into contact with water after being applied or mixed and molded, so that the desired antistatic effect cannot be achieved. There are problems such as not being able to
[課題を解決するための手段]
本発明者らは、塗布後に光および/または熱により容易
に架橋硬化し、耐水性および/または耐有機溶剤性を得
ることができうる導電性材料を得ることを目的に鋭意検
討した結果本発明に到達した。すなわち本発明は一般式
(1)
(式中、Zは一般式(2)で示され、R7は水素原子ま
たはメチル基を示し、R2、R3およびR4は水素原子
または炭素数1〜4のアルキル基を示し、m1nは1以
上の整数を示し、Xはハロゲン原子を示す。[Means for Solving the Problems] The present inventors aim to obtain a conductive material that can be easily crosslinked and cured by light and/or heat after application, and can have water resistance and/or organic solvent resistance. As a result of intensive studies aimed at this purpose, the present invention was arrived at. That is, the present invention is based on the general formula (1) (wherein Z is represented by the general formula (2), R7 represents a hydrogen atom or a methyl group, and R2, R3, and R4 are a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. m1n represents an integer of 1 or more, and X represents a halogen atom.
(式中、R7、Xは一般式(1)の場合と同一であり、
R5は水素原子またはメチル基を示し、p、qは1以上
の整数を示す。)で示される有機高分子を含有してなる
ことを特徴とする導電性架橋性材料である。(In the formula, R7 and X are the same as in general formula (1),
R5 represents a hydrogen atom or a methyl group, and p and q represent an integer of 1 or more. ) is a conductive crosslinkable material characterized by containing an organic polymer represented by:
一般式(1)および−船蔵(2)で示される有機高分子
において、R2、R3、RJの炭素数1〜4のアルキル
基としてはメチル基、エチル基、n−プロピル基、イソ
プロピル基、n−ブチル基などの直鎖および分岐アルキ
ル基が挙げられる。R2−R4が全てメチル基の場合耐
熱性に優れ、またR2−R4が同一でない場合には溶剤
および他の成分との相溶性に優れる。In the organic polymers represented by the general formulas (1) and -Funazo (2), the alkyl groups having 1 to 4 carbon atoms in R2, R3, and RJ include methyl group, ethyl group, n-propyl group, isopropyl group, Mention may be made of straight chain and branched alkyl groups such as n-butyl groups. When R2-R4 are all methyl groups, it has excellent heat resistance, and when R2-R4 are not the same, it has excellent compatibility with solvents and other components.
Xのハロゲン原子としてはフッ素原子、塩素原子、臭素
原子、ヨウ素原子があげられる。原料入手の点から好ま
しくは塩素原子である。Examples of the halogen atom for X include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. From the viewpoint of raw material availability, chlorine atoms are preferred.
plqSnは通常p/(p+q+n)=o、os 〜0
.9、q/ (p+q+n)〜0.05〜0.9、n/
(p+q+n)〜0.05〜0.9であり、好ましくは
q/(p + q + n) 〜0.1〜0.85、n
/ (p+q+n)〜0.1〜0.85である。q/(
p+q+n)が0.05未満であれば架橋性の低下が見
られ、光および/または熱架橋後の耐液性が不充分とな
り、n/(p+q+n)が0.05未満であれば導電性
が不充分となる。n、p、q個の各構成単位はブロック
で結合していてもランダムで結合していてもよい。plqSn is usually p/(p+q+n)=o, os ~0
.. 9, q/ (p+q+n) ~ 0.05 ~ 0.9, n/
(p+q+n) ~0.05-0.9, preferably q/(p + q + n) ~0.1-0.85, n
/ (p+q+n)~0.1~0.85. q/(
If p+q+n) is less than 0.05, a decrease in crosslinking properties will be observed, resulting in insufficient liquid resistance after photo and/or thermal crosslinking, and if n/(p+q+n) is less than 0.05, conductivity will be poor. It becomes insufficient. The n, p, and q constituent units may be connected in blocks or randomly.
重量平均分子量は通常500〜500000であり、好
ましくは3000〜150000である。重量平均分子
量が500未満であれば硬化物の耐液性が不充分となり
、500000を越えると、例えば本発明の材料を溶液
として用いる場合の粘度が高くなり、塗布性が低下する
。The weight average molecular weight is usually 500 to 500,000, preferably 3,000 to 150,000. If the weight average molecular weight is less than 500, the liquid resistance of the cured product will be insufficient, and if it exceeds 500,000, for example, when the material of the present invention is used as a solution, the viscosity will increase and the coating properties will decrease.
一般式(1)および−船蔵(2)で示される有機高分子
の具体例としては例えば、表−1に示される基およびp
:q:nの比を有する有機高分子が挙げられる。Specific examples of the organic polymers represented by the general formulas (1) and -Funezo (2) include the groups shown in Table 1 and p
Examples include organic polymers having a ratio of :q:n.
表−1(1)
(R1、R5が水素原子で、Xが塩素原子の場合)(本
頁以下余白)
(R1、R5が水素原子で、Xが塩素原子の場合)−船
蔵(1)および−船蔵(2)で示される有機高分子は一
般式(3)、
表−1中、Mwは重量平均分子量を示し、Meはメチル
基を示し、Etはエチル基を示し、nPrはn−プロピ
ル基を示し以下同様の記載を用いる。Table-1 (1) (When R1 and R5 are hydrogen atoms and X is chlorine atom) (Left space below this page) (When R1 and R5 are hydrogen atoms and X is chlorine atom) - Onboard (1) The organic polymer represented by and - Funazou (2) has the general formula (3). In Table 1, Mw represents the weight average molecular weight, Me represents a methyl group, Et represents an ethyl group, and nPr represents - represents a propyl group and the same description will be used below.
(式中、R7、R5、p、q、nおよびXは、−船蔵(
1)および−船蔵(2)の場合と同一。)で示される有
機高分子を水、有機溶剤(ベンゼン、トルエン、1.2
−ジクロロエタン、クロロベンゼン、アセトンなど)お
よびこれらの溶剤の混合溶媒中、それぞれ対応するアミ
ンと通常O〜100℃で0.1〜30時間攪はん反応さ
せ、4級化することにより得られる。反応終点は1/I
ON塩酸水溶液を用いての滴定により容易に確認される
。このときの反応溶液濃度は通常10〜50重量%、好
ましくは15〜45重量%である。(In the formula, R7, R5, p, q, n and
1) and - Same as in the case of shipyard (2). ) with water, an organic solvent (benzene, toluene, 1.2
-dichloroethane, chlorobenzene, acetone, etc.) and the corresponding amines in a mixed solvent of these solvents, usually by stirring and reacting with the corresponding amine at 0 to 100°C for 0.1 to 30 hours, and quaternizing. The end point of the reaction is 1/I
It is easily confirmed by titration using ON aqueous hydrochloric acid solution. The concentration of the reaction solution at this time is usually 10 to 50% by weight, preferably 15 to 45% by weight.
−船蔵(4)の有機高分子は例えば、対応するモノマー
(スチレン、α−メチルスチレン、クロロメチルスチレ
ン、フルオロメチルスチレン、ブロモメチルスチレンな
ど)の共重合、スチレンまたはα−メチルスチレンの単
独重合体のハロメチル化などにより得ることができる。- Organic polymers in stock (4) are, for example, copolymerization of corresponding monomers (styrene, α-methylstyrene, chloromethylstyrene, fluoromethylstyrene, bromomethylstyrene, etc.), homopolymerization of styrene or α-methylstyrene, etc. It can be obtained by halomethylation of a combination.
共重合にはアゾビスイソブチロニトリル、ベンゾイルパ
ーオキサイド、ジクミルパーオキサイドなどによるラジ
カル重合法、ルイス酸(BF3−Et20、AlCl3
など)やプロトン酸(H2SO4、HClO4、p−)
ルエンスルホン酸など)によるカチオン重合法、ブチル
リチウムなどによるアニオン重合法を用いることができ
る。ハロメチル化には1,2−エチレンジクロライドを
溶媒に用いて、それぞれの単独重合体にパラホルムおよ
びハロゲン化水素を塩化亜鉛存在下反応させることによ
り得られる。For copolymerization, a radical polymerization method using azobisisobutyronitrile, benzoyl peroxide, dicumyl peroxide, etc., a Lewis acid (BF3-Et20, AlCl3
etc.) and protonic acids (H2SO4, HClO4, p-)
A cationic polymerization method using luenesulfonic acid, etc., and an anionic polymerization method using butyllithium, etc. can be used. For halomethylation, 1,2-ethylene dichloride is used as a solvent, and each homopolymer is reacted with paraform and hydrogen halide in the presence of zinc chloride.
本発明の導電性架橋性材料には光重合性不飽和化合物(
A)および/または光重合開始剤(B)および/または
ビスアジド化合物(C)および/またはその他の添加剤
、充填剤を加えることができる。(A)成分である光重
合性不飽和化合物としては例えば、2−ヒドロキシエチ
ルメタクリレート、1,1,2.2−テトラアリルオキ
シエタン、アミド類(N、N’−メチレンビスアクリル
アミド、N、N’−メチレンビスメタクリルアミド、N
−メチロールアクリルアミド、N−メチロールメタクリ
ルアミド、アクリルアミド、メタクリルアミド、N、N
’−トリメチレンビスアクリルアミド、N、N’−ヘキ
サメチレンビスアクリルアミドなど)、多価アルコール
(トリエチレングリコール、テトラエチレングリコール
、エチレングリコール、プロピレングリコール、トリメ
チロールプロパン、ペンタエリスリトール、ネオペンチ
ルグリコール、ジペンタエリスリトールなど)のアクリ
ル酸エルテル類、多価アルコール(トリエチレングリコ
ール、テトラエチレングリコール、エチレングリコール
、プロピレングリコール、トリメチロールプロパン、ペ
ンタエリスリトール、ネオペンチルグリコール、ジペン
タエリスリトールなど)のメタクリル酸エステル類など
が挙げられる。これらの光重合性不飽和化合物は単独ま
たは2種以上混合して用いることができる。(B)成分
である光開始剤としては紫外線、遠紫外線などの活性エ
ネルギー線により不飽和化合物の重合を開始するいかな
る開始剤も使用でき例えば、ベンゾインアルキルエーテ
ル類(ベンゾイン、ベンゾインイソブチルエーテル、ベ
ンゾインイソプロピルエーテルなど)、ベンゾフェノン
類(ベンゾフェノン、ミヒラーケトン、4−ベンゾイル
ベンジルトリメチルアンモニウムクロライドなど)、ア
セトフェノン類(2,2−ジメトキシ−2−フェニルア
セトフェノン、2,2−ジェトキシアセトフェノン、2
,2−ジクロル−4′−フェノキシアセトフェノン、p
−t−ブチルトリクロロアセトフェノンなど)、アント
ラキノン類(2−エチルアントラキノンなど)、チオキ
サントン類[2−(カルボキシメトキシ)チオキサント
ン、2−(3−スルホプロポキシ)チオキサントン、2
−(2−スルホエトキシエトキシ)チオキサントン、3
.4−ジメチル−2−(3−スルホプロポキシ)チオキ
サントン、2−(3−ジメチルアミノ−2−ヒドロキシ
プロポキシ) −3,4−ジメチル−9H−チオキサン
チン−9−オンメトクロライド、2−(カルボキシメト
キシ)チオキサントンのナトリウム塩、2−(3−スル
ホプロポキシ)チオキサントンのアンモニウム塩、ジエ
チルチオキサントン、ジイソプロピルチオキサントン、
2−クロロチオキサントンなど]などが挙げられる。ま
た、増感剤としてトリエタノールアミン、メチルジェタ
ノールアミン、エチルジェタノールアミン、2−(ジメ
チルアミノ)エチルメタクリレートなどを共存させるこ
とができる。(C)成分であるビスアジド化合物として
は、水可溶性ビスアジド化合物[4,4−一ジアジドス
チルベンー2,2−−ジソジウムサルフエート、4.4
−−ジアジドスチルベン−2,2−−ジスルホン酸ジア
ンモニウム塩、4,4−−ジアジドスチルベン−2゜2
−−ジスルホン酸ジ(テトラメチルアンモニウム塩)、
4,4−−ジアジドスチルベン−2,2−−ジスルホン
酸ジ(テトラエチルアンモニウム塩)、4,4−−ジア
ジドスチルベン−2,2−−ジスルホン酸ジ(トリメチ
ルアンモニウム塩)、4,4−−ジアジドスチルベン−
2,2−−ジスルホン酸ジ(ジメチルアンモニウム塩)
、など]、有機溶剤可溶性ビスアジド化合物[2,6−
ジ(p−アジドベンザル)シクロヘキサノン、2,6−
ジ(ρ−アジドベンザル)−4−メチルシクロヘキサノ
ン、2.6−ジ(ρ−アジドベンザル)−4−(t−ア
ミル)シクロヘキサノン、4,4−−ジアジドカルコン
などコなどが挙げられる。これらの光重合性不飽和化合
物(A)および/または光重合開始剤(B)を含有する
場合の構成成分の配合量は通常、−船蔵(1)の有機高
分子30〜99重量%、光重合性不飽和化合物0〜70
重量%、光重合開始剤0〜25重量%であり好ましくは
一般式(1)の有機高分子40〜99重量%、光重合性
不飽和化合物5〜60重量%、光重合開始剤0.1〜1
0重量%である。またビスアジド化合物(C)を含有す
る場合の構成成分の配合比率は通常、−船蔵(1)の有
機高分子70〜99重量%、ビスアジド化合物1〜30
重量%であり好ましくは一般式(1)の有機高分子85
〜99重量%、ビスアジド化合物1〜20重量%である
。この架橋性導電性材料を、水、有機溶剤(ジメチルホ
ルムアミド、ジメチルスルホキシド、N−メチルピロリ
ドン、γ−ブチロラクトン、ブチルアルコール、エチル
アルコール、イソプロピルアルコール、メチルアルコー
ル、エチルセロソルブアセテート、メチルエチルケトン
、メチルイソブチルケトンなど)およびこれら溶剤の混
合溶剤などに溶解することにより、塗布可能な溶液とな
り目的とする各種帯電防止に利用することができる。溶
液の濃度は通常5〜60重量%溶液であり、好ましくは
10〜50重量%溶液である。The conductive crosslinkable material of the present invention contains a photopolymerizable unsaturated compound (
A) and/or a photopolymerization initiator (B) and/or a bisazide compound (C) and/or other additives and fillers can be added. Examples of the photopolymerizable unsaturated compound as component (A) include 2-hydroxyethyl methacrylate, 1,1,2.2-tetraallyloxyethane, amides (N,N'-methylenebisacrylamide, N,N '-methylenebismethacrylamide, N
-Methylol acrylamide, N-methylol methacrylamide, acrylamide, methacrylamide, N, N
'-trimethylenebisacrylamide, N,N'-hexamethylenebisacrylamide, etc.), polyhydric alcohols (triethylene glycol, tetraethylene glycol, ethylene glycol, propylene glycol, trimethylolpropane, pentaerythritol, neopentyl glycol, dipenta esters of acrylates such as erythritol, methacrylates of polyhydric alcohols (such as triethylene glycol, tetraethylene glycol, ethylene glycol, propylene glycol, trimethylolpropane, pentaerythritol, neopentyl glycol, dipentaerythritol, etc.) Can be mentioned. These photopolymerizable unsaturated compounds can be used alone or in combination of two or more. As the photoinitiator component (B), any initiator that initiates the polymerization of unsaturated compounds by active energy rays such as ultraviolet rays and deep ultraviolet rays can be used. For example, benzoin alkyl ethers (benzoin, benzoin isobutyl ether, benzoin isopropyl ether, etc.), benzophenones (benzophenone, Michler's ketone, 4-benzoylbenzyltrimethylammonium chloride, etc.), acetophenones (2,2-dimethoxy-2-phenylacetophenone, 2,2-jethoxyacetophenone, 2
, 2-dichloro-4'-phenoxyacetophenone, p
-t-butyltrichloroacetophenone, etc.), anthraquinones (2-ethylanthraquinone, etc.), thioxanthones [2-(carboxymethoxy)thioxanthone, 2-(3-sulfopropoxy)thioxanthone,
-(2-sulfoethoxyethoxy)thioxanthone, 3
.. 4-dimethyl-2-(3-sulfopropoxy)thioxanthone, 2-(3-dimethylamino-2-hydroxypropoxy)-3,4-dimethyl-9H-thioxanthine-9-one methochloride, 2-(carboxymethoxy) ) Sodium salt of thioxanthone, ammonium salt of 2-(3-sulfopropoxy)thioxanthone, diethylthioxanthone, diisopropylthioxanthone,
2-chlorothioxanthone, etc.]. Further, as a sensitizer, triethanolamine, methylgetanolamine, ethylgetanolamine, 2-(dimethylamino)ethyl methacrylate, etc. can be made to coexist. As the bisazide compound which is the component (C), a water-soluble bisazide compound [4,4-monodiazidostilbene-2,2-disodium sulfate, 4.4
--Diazidostilbene-2,2-disulfonic acid diammonium salt, 4,4--diazidostilbene-2゜2
--Disulfonic acid di(tetramethylammonium salt),
4,4-Diazidostilbene-2,2-disulfonic acid di(tetraethylammonium salt), 4,4-diazidostilbene-2,2-disulfonic acid di(trimethylammonium salt), 4,4- -Diazidostilbene-
2,2-Disulfonic acid di(dimethylammonium salt)
, etc.], organic solvent-soluble bisazide compound [2,6-
Di(p-azidobenzal)cyclohexanone, 2,6-
Examples include di(ρ-azidobenzal)-4-methylcyclohexanone, 2,6-di(ρ-azidobenzal)-4-(t-amyl)cyclohexanone, and 4,4-diazidochalcone. When containing these photopolymerizable unsaturated compounds (A) and/or photopolymerization initiators (B), the amounts of the components are usually: - 30 to 99% by weight of the organic polymer in the ship's inventory (1); Photopolymerizable unsaturated compound 0-70
% by weight, 0 to 25% by weight of photopolymerization initiator, preferably 40 to 99% by weight of the organic polymer of general formula (1), 5 to 60% by weight of photopolymerizable unsaturated compound, and 0.1% by weight of photopolymerization initiator. ~1
It is 0% by weight. In addition, when the bisazide compound (C) is contained, the blending ratio of the constituent components is usually - 70 to 99% by weight of the organic polymer of shipyard (1), 1 to 30% by weight of the bisazide compound (C);
% by weight, preferably organic polymer of general formula (1) 85
-99% by weight, bisazide compound 1-20% by weight. This crosslinkable conductive material can be mixed with water, organic solvents (dimethylformamide, dimethyl sulfoxide, N-methylpyrrolidone, γ-butyrolactone, butyl alcohol, ethyl alcohol, isopropyl alcohol, methyl alcohol, ethyl cellosolve acetate, methyl ethyl ketone, methyl isobutyl ketone, etc.). ) or a mixed solvent of these solvents, it becomes a coatable solution and can be used for various antistatic purposes. The concentration of the solution is usually 5 to 60% by weight, preferably 10 to 50% by weight.
本発明の導電性架橋性材料の使用方法は、その溶液を紙
、各種記録用紙、有機樹脂フィルム、有機樹脂成形体、
無機成形体などの基材上に、スピンコード塗布、スクリ
ーン印刷塗布、スプレー塗布、ロールコート塗布、ディ
ッピング塗布、バーコーター塗布などにより塗布膜厚1
mm以下となるように塗布し、続いて、紫外線、遠紫外
線などの照射より架橋が進行し、耐水性および/または
耐溶剤性が得られる。この時光源として、高圧水銀灯、
超高圧水銀灯、メタルハライドランプ、低圧水銀灯、遠
紫外線ランプ、エキシマレーザ−などを用いることがで
きる。また50〜150℃での加熱を行うことによって
も架橋が進行し、加熱には、循風炉、ホットプレート、
赤外線炉、遠赤外線炉などを用いることができる。The method of using the conductive crosslinkable material of the present invention is to apply the solution to paper, various recording papers, organic resin films, organic resin molded bodies, etc.
A coating film thickness of 1 is applied onto a base material such as an inorganic molded body by spin cord coating, screen printing coating, spray coating, roll coating coating, dipping coating, bar coater coating, etc.
It is coated to a thickness of 0.3 mm or less, and then crosslinked by irradiation with ultraviolet rays, deep ultraviolet rays, etc., resulting in water resistance and/or solvent resistance. At this time, as a light source, a high pressure mercury lamp,
An ultra-high pressure mercury lamp, a metal halide lamp, a low pressure mercury lamp, a far ultraviolet lamp, an excimer laser, etc. can be used. Crosslinking also proceeds by heating at 50 to 150°C, and heating can be done using a circulating oven, hot plate,
An infrared furnace, a far-infrared furnace, etc. can be used.
[実施例]
以下、本発明を実施例により更に説明するが、本発明は
これに限定されない。[Examples] Hereinafter, the present invention will be further explained with reference to Examples, but the present invention is not limited thereto.
実施例1
スチレン−クロロメチルスチレン共重合体(クロロメチ
ルスチレン含有率50%、Mw=10000)10gを
1,2−ジクロロエタン30gに溶解し、トリメチルア
ミン30重量%水溶液4.60g、水20gを加え、室
温で3時間攪はん反応した後、アセトン1リツトルに加
えた。析出したポリマーを減圧乾燥し本発明の導電性架
橋性材料であるスチレン−クロロメチルスチレンの部分
4級化物10.5gを得た。Example 1 10 g of styrene-chloromethylstyrene copolymer (chloromethylstyrene content 50%, Mw = 10000) was dissolved in 30 g of 1,2-dichloroethane, and 4.60 g of a 30% by weight aqueous solution of trimethylamine and 20 g of water were added. After stirring and reacting at room temperature for 3 hours, the mixture was added to 1 liter of acetone. The precipitated polymer was dried under reduced pressure to obtain 10.5 g of partially quaternized styrene-chloromethylstyrene, which is the conductive crosslinkable material of the present invention.
実施例2
スチレン−クロロメチルスチレン共重合体(クロロメチ
ルスチレン含有率60%、Mw=20000)10gを
1,2−ジクロロエタン30gに溶解し、トリメチルア
ミン30重量%水溶液4.44g、水20gを加え、室
温で3時間攪はん反応した後、アセトン1リツトルに加
えた。析出したポリマーを減圧乾燥し本発明の導電性架
橋性材料であるスチレン−クロロメチルスチレンの部分
4級化物11gを得た。Example 2 10 g of styrene-chloromethylstyrene copolymer (chloromethylstyrene content 60%, Mw = 20000) was dissolved in 30 g of 1,2-dichloroethane, and 4.44 g of a 30% by weight aqueous solution of trimethylamine and 20 g of water were added. After stirring and reacting at room temperature for 3 hours, the mixture was added to 1 liter of acetone. The precipitated polymer was dried under reduced pressure to obtain 11 g of partially quaternized styrene-chloromethylstyrene, which is the conductive crosslinkable material of the present invention.
実施例3
スチレン−クロコメチルスチレン共重合体(クロロメチ
ルスチレン含有率55%、Mw=50000)10gを
1,2−ジクロロエタン30gに溶解し、トリメチルア
ミン30重量%水溶液5.27g、水20gを加え、室
温で3時間攪はん反応した後、アセトン1リツトルに加
えた。析出したポリマーを減圧乾燥し本発明の導電性架
橋性材料であるスチレン−クロロメチルスチレンの部分
4級化物10.5gを得た。Example 3 10 g of styrene-crocomethylstyrene copolymer (chloromethylstyrene content 55%, Mw = 50000) was dissolved in 30 g of 1,2-dichloroethane, and 5.27 g of a 30% by weight aqueous solution of trimethylamine and 20 g of water were added. After stirring and reacting at room temperature for 3 hours, the mixture was added to 1 liter of acetone. The precipitated polymer was dried under reduced pressure to obtain 10.5 g of partially quaternized styrene-chloromethylstyrene, which is the conductive crosslinkable material of the present invention.
実施例4
スチレン−クロロメチルスチレン共重合体くクロロメチ
ルスチレン含有率65%、Mw =20000)10g
を1,2−ジクロロエタン30gに溶解し、トリメチル
アミン30重量%水溶液6.54g、水20gを加え、
室温で3時間攪はん反応した後、アセトン1リツトルに
加えた。析出したポリマーを減圧乾燥し本発明の導電性
架橋性材料であるスチレン−クロロメチルスチレンの部
分4級化物10gを得た。Example 4 Styrene-chloromethylstyrene copolymer (chloromethylstyrene content 65%, Mw = 20000) 10g
was dissolved in 30 g of 1,2-dichloroethane, and 6.54 g of a 30% by weight aqueous solution of trimethylamine and 20 g of water were added.
After stirring and reacting at room temperature for 3 hours, the mixture was added to 1 liter of acetone. The precipitated polymer was dried under reduced pressure to obtain 10 g of partially quaternized styrene-chloromethylstyrene, which is the conductive crosslinkable material of the present invention.
使用例1
実施例1で得たポリマー5gをDMF−水の混合溶剤2
0gに溶解し、本発明の材料の溶液である導電性架橋性
材料溶液を作成した。この溶液をガラス基板上にスピン
コード塗布し、1.5μmの均一な塗布膜を得た。この
塗布膜に高圧水銀灯により500m j / c m2
の紫外線照射を行った。メタノールに60秒間浸漬後の
表面抵抗値を表−2に示す。Usage Example 1 5 g of the polymer obtained in Example 1 was mixed with DMF-water mixed solvent 2
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared by dissolving 0g of the material. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. This coating film was heated to 500mj/cm2 using a high-pressure mercury lamp.
UV irradiation was performed. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例2
使用例1で作成した溶液をガラス基板上にスピンコード
塗布し、1.5μmの均一な塗布膜を得た。Usage Example 2 The solution prepared in Usage Example 1 was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm.
この基板を循風炉を用いて窒素下150℃で2時間のベ
ークを行った。メタノールに60秒間浸漬後の表面抵抗
値を表−2に示す。This substrate was baked at 150° C. for 2 hours under nitrogen using a circulating oven. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例3
実施例2で得たポリマー5gをDMF−水の混合溶剤2
0gに溶解し、本発明の材料の溶液である導電性架橋性
材料溶液を作成した。この溶液をガラス基板上にスピン
コード塗布し、1.5μmの均一な塗布膜を得た。この
塗布膜にメタルハライドランプにより500m j /
c m2の紫外線照射を行った。Use example 3 5 g of the polymer obtained in Example 2 was mixed with DMF-water mixed solvent 2
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared by dissolving 0g of the material. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. A metal halide lamp was applied to this coated film for 500 m j /
Ultraviolet irradiation was performed at cm2.
メタノールに60秒間浸漬後の表面抵抗値を表−2に示
す。Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例4
使用例3で作成した溶液をガラス基板上にスピンコード
塗布し、1.5μmの均一な塗布膜を得た。Usage Example 4 The solution prepared in Usage Example 3 was spin coated onto a glass substrate to obtain a uniform coating film of 1.5 μm.
この基板を循風炉を用いて窒素下150℃で2時間のベ
ークを行った。メタノールに60秒間浸漬後の表面抵抗
値を表−2に示す。This substrate was baked at 150° C. for 2 hours under nitrogen using a circulating oven. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例5
実施例3で得たポリマー5gを水20gに溶解し、本発
明の材料の溶液である導電性架橋性材料溶液を作成した
。この溶液をガラス基板上にスピンコード塗布し、1.
5μmの均一な塗布膜を得た。この塗布膜に高圧水銀灯
により500mj/cm2の紫外線照射を行った。メタ
ノールに60秒間浸漬後の表面抵抗値を表−2に示す。Use Example 5 5 g of the polymer obtained in Example 3 was dissolved in 20 g of water to prepare a conductive crosslinkable material solution, which is a solution of the material of the present invention. This solution was spin-coated onto a glass substrate, and 1.
A uniform coating film of 5 μm was obtained. This coated film was irradiated with ultraviolet light at 500 mj/cm2 using a high-pressure mercury lamp. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例6
使用例5で作成した溶液をガラス基板上にスピンコード
塗布し、1.5μmの均一な塗布膜を得た。Usage Example 6 The solution prepared in Usage Example 5 was spin coated onto a glass substrate to obtain a uniform coating film of 1.5 μm.
この基板を循風炉を用いて窒素下150℃で2時間のベ
ークを行った。メタノールに60秒間浸漬後の表面抵抗
値を表−2に示す。This substrate was baked at 150° C. for 2 hours under nitrogen using a circulating oven. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例7
実施例4で得たポリマー5gを水20gに溶解し、本発
明の材料の溶液である導電性架橋性材料溶液を作成した
。この溶液をガラス基板上にスピンコード塗布し、1.
5μmの均一な塗布膜を得た。この塗布膜にメタルハラ
イドランプにより500m j /Cm2の紫外線照射
を行った。メタノールに60秒間浸漬後の表面抵抗値を
表−2に示す。Use Example 7 5 g of the polymer obtained in Example 4 was dissolved in 20 g of water to prepare a conductive crosslinkable material solution, which is a solution of the material of the present invention. This solution was spin-coated onto a glass substrate, and 1.
A uniform coating film of 5 μm was obtained. This coated film was irradiated with ultraviolet light at 500 m j /Cm2 using a metal halide lamp. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例8
使用例7で作成した溶液をガラス基板上にスピンコード
塗布し、1.5μmの均一な塗布膜を得た。Use Example 8 The solution prepared in Use Example 7 was spin coated onto a glass substrate to obtain a uniform coating film of 1.5 μm.
この基板を循風炉を用いて窒素下150℃で2時間のベ
ークを行った。メタノールに60秒間浸漬後の表面抵抗
値を表−2に示す。This substrate was baked at 150° C. for 2 hours under nitrogen using a circulating oven. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
使用例9
実施例2で得たポリマー5g、N、N−−メチレンビス
アクリルアミド0.5g、ベンゾインイソプロピルエー
テル0.25gをDMF−水の混合溶剤20gに溶解し
、本発明の材料の溶液である導電性架橋性材料溶液を作
成した。この溶液をガラス基板上にスピンコード塗布し
、1.5μmの均一な塗布膜を得た。この塗布膜に高圧
水銀灯により200m j /cm2の紫外線照射を行
った。メタノールに60秒間浸漬後の表面抵抗値を表−
2に示す。Use Example 9 5 g of the polymer obtained in Example 2, 0.5 g of N,N-methylenebisacrylamide, and 0.25 g of benzoin isopropyl ether were dissolved in 20 g of a DMF-water mixed solvent to form a solution of the material of the present invention. A conductive crosslinkable material solution was prepared. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. This coated film was irradiated with ultraviolet light at 200 m j /cm 2 using a high-pressure mercury lamp. Table of surface resistance values after immersion in methanol for 60 seconds.
Shown in 2.
使用例】0
実施例4で得たポリマー5g、トリエチレングリコール
ジアクリレート0.5g、2− (3−スルホプロポキ
シ)チオキサントン0.2gをDMF−水の混合溶剤2
0gに溶解し、本発明の材料の溶液である導電性架橋性
材料溶液を作成した。この溶液をガラス基板上にスピン
コード塗布し、1.5μmの均一な塗布膜を得た。この
塗布膜に高圧水銀灯により200m j / c m”
の紫外線照射を行った。メタノールに60秒間浸漬後の
表面抵抗値を表−2に示す。Usage example: 0 5 g of the polymer obtained in Example 4, 0.5 g of triethylene glycol diacrylate, and 0.2 g of 2-(3-sulfopropoxy)thioxanthone were mixed in a DMF-water mixed solvent 2
A conductive crosslinkable material solution, which is a solution of the material of the present invention, was prepared by dissolving 0g of the material. This solution was spin-coated onto a glass substrate to obtain a uniform coating film of 1.5 μm. This coated film was heated to 200mj/cm” using a high-pressure mercury lamp.
UV irradiation was performed. Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
比較例1
スチレン−クロロメチルスチレン共重合体(クロロメチ
ルスチレン含有率50%、Mw = 10000)のト
リメチルアミン完全4級化物10gを水40gに溶解し
、この溶液をガラス基板上にスピンコード塗布し、1.
5μmの塗布膜を得た。この塗布膜に高圧水銀灯により
500m j / c m”の紫外線照射を行った。メ
タノールに60秒間浸漬後の表面抵抗値を表−2に示す
。Comparative Example 1 10 g of completely quaternized trimethylamine of styrene-chloromethylstyrene copolymer (chloromethylstyrene content 50%, Mw = 10000) was dissolved in 40 g of water, and this solution was spin-coated on a glass substrate, 1.
A coating film of 5 μm was obtained. This coating film was irradiated with ultraviolet rays of 500 mj/cm'' using a high-pressure mercury lamp.Table 2 shows the surface resistance values after immersion in methanol for 60 seconds.
比較例2
スチレン−クロロメチルスチレン共重合体(クロロメチ
ルスチレン含有率70%、Mw=30000)のトリメ
チルアミン完全4級化物10gを水40gに溶解し、こ
の溶液をガラス基板上にバーコーター塗布し、1.5μ
mの塗布膜を得た。この基板を循風炉を用いて窒素下1
50℃で2時間のベークを行った。Comparative Example 2 10 g of completely quaternized trimethylamine of styrene-chloromethylstyrene copolymer (chloromethylstyrene content 70%, Mw = 30000) was dissolved in 40 g of water, and this solution was coated on a glass substrate with a bar coater. 1.5μ
A coating film of m was obtained. This substrate was heated under nitrogen using a circulating oven.
Baking was performed at 50°C for 2 hours.
メタノールに60秒間浸漬後の表面抵抗値を表−2に示
す。Table 2 shows the surface resistance values after being immersed in methanol for 60 seconds.
(本頁以下余白)
表−2
表−2中、2.OF2は2.0X107を示し、以下同
様の記載を用いる。(Margins below this page) Table 2 In Table 2, 2. OF2 indicates 2.0X107, and the same description will be used below.
溶剤への浸漬による表面抵抗値の測定により塗布膜の変
化を評価した。架橋が進行しない比較例との比較から、
溶剤浸漬後も良好な導電性が確認され、本発明の導電性
架橋性材料の耐水性および/または耐有機溶剤性の付与
効果が示される。また、使用例1〜10で作成したいず
れの硬化膜も、空気中放置1週間でのベタ付きは見られ
なかった。Changes in the coating film were evaluated by measuring the surface resistance value by immersion in a solvent. From a comparison with a comparative example in which crosslinking does not proceed,
Good conductivity was confirmed even after immersion in the solvent, demonstrating the effect of imparting water resistance and/or organic solvent resistance to the conductive crosslinkable material of the present invention. Moreover, no stickiness was observed in any of the cured films prepared in Usage Examples 1 to 10 after being left in the air for one week.
[発明の効果コ
本発明は導電性架橋性材料を提供し、またこれらの導電
性架橋性材料は次のような顕著な特徴を有する。[Effects of the Invention] The present invention provides electrically conductive crosslinkable materials, and these electrically conductive crosslinkable materials have the following notable features.
(1)光および/または熱により架橋硬化が可能な導電
性材料である。この導電性架橋性材料の使用により例え
ば塗布後の吸湿によるベタ付きや、塗布後に水や有機溶
剤に触れることにより容易に除去され、目的とした帯電
防止効果が得られないなどの問題発生を抑制することが
できる。(1) It is a conductive material that can be crosslinked and cured by light and/or heat. The use of this conductive cross-linked material prevents problems such as stickiness due to moisture absorption after application, and the fact that it is easily removed by contact with water or organic solvents after application, making it impossible to obtain the desired antistatic effect. can do.
(2)イオン成分の含有比率および/または4級化に使
用するアミンのアルキル基を変化させることにより、架
橋前の溶剤溶解性を自由に変えることができ使用条件の
許容性が高い。(2) By changing the content ratio of ionic components and/or the alkyl group of the amine used for quaternization, the solvent solubility before crosslinking can be freely changed and the use conditions are highly acceptable.
(3)架橋硬化により耐水性および/または耐液性が付
与され、本材料への他の材料の積層が可能である。(3) Water resistance and/or liquid resistance is imparted by crosslinking and curing, and other materials can be laminated onto this material.
(4)光硬化が可能であるため、耐熱性の劣る材料への
塗布、利用が可能である。(4) Since it can be photocured, it can be applied and used on materials with poor heat resistance.
(5)光硬化が可能であるため、導電性の耐熱性が劣る
組成物も利用することができる。(5) Since photocuring is possible, compositions with poor conductivity and heat resistance can also be used.
(6)各種塗布法での塗布が可能であり、あらゆる形状
、材質の基材への利用が可能である。(6) It can be applied using various coating methods, and can be applied to base materials of all shapes and materials.
(7)露光、未露光部分の溶解性の差を利用してパター
ンを形成することができる。(7) A pattern can be formed by utilizing the difference in solubility between exposed and unexposed areas.
i琺に」i 琺に”
Claims (1)
またはメチル基を示し、R_2、R_3およびR_4は
水素原子または炭素数1〜4のアルキル基を示し、m、
nは1以上の整数を示し、Xはハロゲン原子を示す。 ▲数式、化学式、表等があります▼(2) (式中、R_1、Xは一般式(1)の場合と同一であり
、R_5は水素原子またはメチル基を示し、p、qは1
以上の整数を示す。)で示される有機高分子を含有して
なることを特徴とする導電性架橋性材料。[Claims] 1. General formula (1) ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (1) (In the formula, Z is represented by the general formula (2), and R_1 represents a hydrogen atom or a methyl group. , R_2, R_3 and R_4 represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m,
n represents an integer of 1 or more, and X represents a halogen atom. ▲There are mathematical formulas, chemical formulas, tables, etc.▼(2) (In the formula, R_1 and X are the same as in general formula (1), R_5 represents a hydrogen atom or a methyl group, and p and q are 1
Indicates an integer greater than or equal to ) A conductive crosslinkable material characterized by containing an organic polymer represented by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10139090A JPH041213A (en) | 1990-04-17 | 1990-04-17 | Conductive crosslinkable material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10139090A JPH041213A (en) | 1990-04-17 | 1990-04-17 | Conductive crosslinkable material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH041213A true JPH041213A (en) | 1992-01-06 |
Family
ID=14299428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10139090A Pending JPH041213A (en) | 1990-04-17 | 1990-04-17 | Conductive crosslinkable material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041213A (en) |
-
1990
- 1990-04-17 JP JP10139090A patent/JPH041213A/en active Pending
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