JPH0412634U - - Google Patents
Info
- Publication number
- JPH0412634U JPH0412634U JP5344890U JP5344890U JPH0412634U JP H0412634 U JPH0412634 U JP H0412634U JP 5344890 U JP5344890 U JP 5344890U JP 5344890 U JP5344890 U JP 5344890U JP H0412634 U JPH0412634 U JP H0412634U
- Authority
- JP
- Japan
- Prior art keywords
- board
- burn
- semiconductor device
- socket
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は、本考案の半導体装置バーインボード
の一実施例の斜視図、第２図は従来の半導体装置
のバーインボードに用いていたソケツトの斜視図
、第３図は第１図のソケツト拡大図である。
１……バーインボードキヤツプ、２……バーイ
ンボード、３……スプリング、４……ロツクねじ
、５……レバーなしソケツト、６……半導体装置
の挿入部、１１……レバー、１２……ソケツト。
Figure 1 is a perspective view of an embodiment of the semiconductor device burn-in board of the present invention, Figure 2 is a perspective view of a socket used in a conventional semiconductor device burn-in board, and Figure 3 is an enlarged view of the socket in Figure 1. It is a diagram. DESCRIPTION OF SYMBOLS 1... Bar-in-board cap, 2... Bar-in-board, 3... Spring, 4... Lock screw, 5... Socket without lever, 6... Semiconductor device insertion part, 11... Lever, 12... Socket.
Claims (1)
ソケツトを有するバーインボードにおいて、各ソ
ケツトに対応して半導体装置をセツトするバーイ
ンボードキヤツプをスプリングを介して設け、ス
プリングを伸縮させてキヤツプにセツトした半導
体装置をバーインボードのソケツトに挿入抜去す
るようにしたことを特徴とする半導体装置のバー
インボード。 In a burn-in board that has a plurality of sockets into which PGA package semiconductor devices are inserted, a burn-in board cap for setting the semiconductor device in each socket is provided via a spring, and the spring is expanded and contracted to burn-in the semiconductor device set in the cap. A burn-in board for a semiconductor device, characterized in that it can be inserted into and removed from a board socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344890U JPH0412634U (en) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344890U JPH0412634U (en) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412634U true JPH0412634U (en) | 1992-01-31 |
Family
ID=31574641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5344890U Pending JPH0412634U (en) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412634U (en) |
-
1990
- 1990-05-22 JP JP5344890U patent/JPH0412634U/ja active Pending