JPH0412661U - - Google Patents
Info
- Publication number
- JPH0412661U JPH0412661U JP5343390U JP5343390U JPH0412661U JP H0412661 U JPH0412661 U JP H0412661U JP 5343390 U JP5343390 U JP 5343390U JP 5343390 U JP5343390 U JP 5343390U JP H0412661 U JPH0412661 U JP H0412661U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- punch
- mold
- semiconductor device
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims 2
- 241000272168 Laridae Species 0.000 claims 1
- 235000019987 cider Nutrition 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は本考案の一実施例の下死点状態における縦断面
図、第３図は従来のリード成形金型の縦断面図で
ある。
１……リード成形ダイ、２……リード成形回転
パンチ、３……シエダー、４……パンチプレート
、５……バツキングプレート、６……半導体製品
、７……ばね、８……支点ピン。
Fig. 1 is a longitudinal sectional view of an embodiment of the present invention, Fig. 2 is a longitudinal sectional view of an embodiment of the invention at bottom dead center, and Fig. 3 is a longitudinal sectional view of a conventional lead forming die. be. DESCRIPTION OF SYMBOLS 1... Lead forming die, 2... Lead forming rotary punch, 3... Cider, 4... Punch plate, 5... Bucking plate, 6... Semiconductor product, 7... Spring, 8... Fulcrum pin.
Claims (1)
用いて成形する半導体装置のリード成形金型にお
いて、回転パンチによるリード成形後、金型の下
死点近傍において回転パンチをパンチプレート及
びバツキングプレートに当接させて回転パンチを
固定し、次いでバツキングプレートにより回転パ
ンチを下方向に加圧してリード先端部を押圧する
機構を有することを特徴とする半導体装置のリー
ド成形金型。 (2) 金型の下死点において回転パンチがバツキ
ングプレートに接する長さに形成されている前項
(1)記載の半導体装置のリード成形金型。[Scope of Claim for Utility Model Registration] (1) In a lead forming mold for a semiconductor device in which gull wing type leads are formed using a rotating punch, after the lead is formed by the rotating punch, the rotating punch is punched near the bottom dead center of the mold. A lead molding tool for a semiconductor device, characterized by having a mechanism for fixing a rotary punch by bringing it into contact with a plate and a bucking plate, and then pressing the rotary punch downward by the bucking plate to press the tip of the lead. Type. (2) In the previous item, the rotary punch is formed to a length that touches the bucking plate at the bottom dead center of the mold.
(1) A lead molding mold for the semiconductor device described in (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5343390U JPH0412661U (en) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5343390U JPH0412661U (en) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412661U true JPH0412661U (en) | 1992-01-31 |
Family
ID=31574611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5343390U Pending JPH0412661U (en) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412661U (en) |
-
1990
- 1990-05-22 JP JP5343390U patent/JPH0412661U/ja active Pending
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