JPH0413566U - - Google Patents
Info
- Publication number
- JPH0413566U JPH0413566U JP5344390U JP5344390U JPH0413566U JP H0413566 U JPH0413566 U JP H0413566U JP 5344390 U JP5344390 U JP 5344390U JP 5344390 U JP5344390 U JP 5344390U JP H0413566 U JPH0413566 U JP H0413566U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor products
- adhesive
- taping member
- adhering
- combining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Packages (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
従来の粘着式テーピング部材の一例の平面図であ
る。
１……紙テープ、２，２ａ，２ｂ……粘着テー
プ。
FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a plan view of an example of a conventional adhesive taping member. 1...Paper tape, 2, 2a, 2b...Adhesive tape.
Claims (1)
式テーピング部材において、前記半導体製品を粘
着する粘着テープを少くとも２本組み合せて構成
したことを特徴とする半導体製品用粘着式テーピ
ング部材。 An adhesive taping member for semiconductor products used for packaging semiconductor products, characterized in that the adhesive taping member for semiconductor products is constructed by combining at least two adhesive tapes for adhering the semiconductor products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344390U JPH0413566U (en) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344390U JPH0413566U (en) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0413566U true JPH0413566U (en) | 1992-02-04 |
Family
ID=31574631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5344390U Pending JPH0413566U (en) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0413566U (en) |
-
1990
- 1990-05-22 JP JP5344390U patent/JPH0413566U/ja active Pending